公开(公告)号：US06841857B2

公开(公告)日：2005-01-11

申请号：US10197790

申请日：2002-07-18

申请人： Gottfried Beer ,  Robert Bergmann ,  Heng Wan Jenny Hong

发明人： Gottfried Beer ,  Robert Bergmann ,  Heng Wan Jenny Hong

IPC分类号： H01L23/433 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/0567 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0104 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An electronic component and a system carrier having a heat conduction block, on which overlapping inner flat conductor ends are fixed mechanically and insulated electrically by an organoceramic layer (6). In addition, methods of producing the system carrier and the electronic component are encompassed.

摘要翻译： 具有导热块的电子部件和系统载体，其上重叠的内部平坦的导体端机械地固定并由有机陶瓷层（6）电绝缘。 此外，包括制造系统载体和电子部件的方法。

公开(公告)号：US08889548B2

公开(公告)日：2014-11-18

申请号：US13084105

申请日：2011-04-11

申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

IPC分类号： H01L29/72 ,  H01L23/552 ,  H01L21/768 ,  H01L23/48 ,  H01L23/66

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/76879 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6688 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2924/00014 ,  H01L2224/05552

摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分布线图案。

公开(公告)号：US07952185B2

公开(公告)日：2011-05-31

申请号：US11645150

申请日：2006-12-22

申请人： Horst Theuss ,  Gottfried Beer

发明人： Horst Theuss ,  Gottfried Beer

IPC分类号： H01L23/52

CPC分类号： H01L21/568 ,  B81B7/007 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

摘要翻译： 公开了一种包括芯片的装置，该芯片保持在铸造化合物中并且布置有中空结构。

公开(公告)号：US07910404B2

公开(公告)日：2011-03-22

申请号：US12205294

申请日：2008-09-05

申请人： Klaus Pressel ,  Gottfried Beer

发明人： Klaus Pressel ,  Gottfried Beer

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06593 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.

摘要翻译： 制造堆叠模具模块的方法包括将多个堆叠的模具结构应用于载体。 每个堆叠的管芯结构包括施加到载体的第一半导体管芯和堆叠在第一半导体管芯上的第二半导体管芯。 第二半导体管芯具有比第一半导体管芯更大的侧表面积。 在每个堆叠的模具结构周围施加坝，从而为每个堆叠的模具结构形成封闭的腔。 用于每个堆叠的管芯结构的封闭空腔包围堆叠管芯结构的第一半导体管芯。

公开(公告)号：US20110024918A1

公开(公告)日：2011-02-03

申请号：US12904561

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

摘要翻译： 公开了堆叠的半导体芯片。 一个实施例提供了包括具有第一表面和相对的第二表面的第一基底的方法。 第一衬底包括在第一衬底的第一表面上的第一连接元件的阵列。 第二基板具有第一表面和相对的第二表面。 第二衬底包括在第二衬底的第一表面上的第二连接元件的阵列。 第一连接元件附接到第二连接元件; 并且在将第一连接元件附接到第二连接元件之后使第一基板和第二基板中的至少一个变薄。

公开(公告)号：US07867878B2

公开(公告)日：2011-01-11

申请号：US11859329

申请日：2007-09-21

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L21/30

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

公开(公告)号：US20100019370A1

公开(公告)日：2010-01-28

申请号：US12179217

申请日：2008-07-24

申请人： Klaus Pressel ,  Gottfried Beer

发明人： Klaus Pressel ,  Gottfried Beer

IPC分类号： H01L23/52 ,  H01L23/28 ,  H01L21/50 ,  H01L21/98

CPC分类号： G01P1/023 ,  B81B7/02 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/0023 ,  B81C2203/0154 ,  G01L9/0042 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H04R1/04 ,  H04R2201/003 ,  H01L2224/82 ,  H01L2224/29099 ,  H01L2924/00

摘要： A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.

摘要翻译： 半导体器件及其制造方法。 一个实施例提供一种半导体芯片。 封装材料覆盖半导体芯片。 金属层在半导体芯片和封装材料之上。 电压产生单元和显示单元中的至少一个刚性地附接到至少一个封装材料和金属层。

公开(公告)号：US07413353B2

公开(公告)日：2008-08-19

申请号：US11693446

申请日：2007-03-29

申请人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

发明人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

IPC分类号： G02B6/36 ,  G02B6/00

CPC分类号： G02B6/4202 ,  G02B6/4232

摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。

公开(公告)号：US07268423B2

公开(公告)日：2007-09-11

申请号：US11013851

申请日：2004-12-16

申请人： Gottfried Beer ,  Jochen Dangelmaier ,  Alfred Haimerl ,  Manfred Mengel ,  Klaus Mueller ,  Klaus Pressel

发明人： Gottfried Beer ,  Jochen Dangelmaier ,  Alfred Haimerl ,  Manfred Mengel ,  Klaus Mueller ,  Klaus Pressel

IPC分类号： H01L23/48

CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49877 ,  H01L24/05 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/14 ,  Y10S977/742 ,  Y10S977/932

摘要： The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 μm, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.

摘要翻译： 本发明描述了一种用于具有连接栅格的部件的再布线板， 100nm和10um，该再布线板包括基体和具有碳纳米管的通道，通道的下端开口成接触连接表面，并且碳纳米管从接触连接表面到前表面形成导电连接 的基体。

公开(公告)号：US20070181979A1

公开(公告)日：2007-08-09

申请号：US11701044

申请日：2007-02-01

申请人： Gottfried Beer ,  Horst Theuss

发明人： Gottfried Beer ,  Horst Theuss

IPC分类号： H01L29/06 ,  H01L21/30

CPC分类号： B81C1/00269 ,  B81C2203/0118 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05099

摘要： One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The microelectromechanical structure is surrounded by walls of at least one cavity. A covering, which covers the cavity, is arranged on the walls. The walls have a photolithographically patterned polymer. The covering has a layer with a polymer of identical type. In one case, the molecular chains of the polymer of the walls are crosslinked with the molecular chains of the polymer layer of the covering layer to form a dimensionally stable cavity housing.

摘要翻译： 本发明的一个方面涉及具有腔结构的半导体部件及其制造方法。 半导体部件具有微机电结构的有源半导体芯片及其顶侧的布线结构。 微机电结构由至少一个空腔的壁包围。 覆盖空腔的覆盖物布置在墙壁上。 墙壁具有光刻图案的聚合物。 覆盖物具有具有相同类型的聚合物的层。 在一种情况下，壁的聚合物的分子链与覆盖层的聚合物层的分子链交联以形成尺寸稳定的腔体。