BI-LAYER PREPREG FOR REDUCED DIELECTRIC THICKNESS

    公开(公告)号:US20190333832A1

    公开(公告)日:2019-10-31

    申请号:US15967122

    申请日:2018-04-30

    Abstract: An apparatus is provided which comprises: a woven fiber layer, a first resin layer on a first surface of the woven fiber layer, a second resin layer on a second surface of the woven fiber layer, the second surface opposite the first surface, and the first and the second resin layers comprising cured resin, a third resin layer on the first resin layer, and a fourth resin layer on the second resin layer, the third and the fourth resin layers comprising an uncured resin, and wherein the fourth resin layer has a thickness greater than a thickness of the third resin layer. Other embodiments are also disclosed and claimed.

    Coreless organic packages with embedded die and magnetic inductor structures

    公开(公告)号:US11205626B2

    公开(公告)日:2021-12-21

    申请号:US16875417

    申请日:2020-05-15

    Abstract: A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.

    CORELESS ORGANIC PACKAGES WITH EMBEDDED DIE AND MAGNETIC INDUCTOR STRUCTURES

    公开(公告)号:US20200279819A1

    公开(公告)日:2020-09-03

    申请号:US16875417

    申请日:2020-05-15

    Abstract: A coreless semiconductor package comprises a plurality of horizontal layers of dielectric material. A magnetic inductor is situated at least partly in a first group of the plurality of layers. A plated laser stop is formed to protect the magnetic inductor against subsequent acidic processes. An EMIB is situated above the magnetic inductor within a second group of the plurality of layers. Vias and interconnections are configured within the horizontal layers to connect a die of the EMIB to other circuitry. A first level interconnect is formed on the top side of the package to connect to the interconnections. BGA pockets and BGA pads are formed on the bottom side of the package. In a second embodiment a polymer film is used as additional protection against subsequent acidic processes. The magnetic inductor comprises a plurality of copper traces encapsulated in magnetic material.

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