公开(公告)号：US5714801A

公开(公告)日：1998-02-03

申请号：US624081

申请日：1996-03-29

申请人： Keiichi Yano ,  Jun-ichi Kudo ,  Koji Yamakawa ,  Kiyoshi Iyogi

发明人： Keiichi Yano ,  Jun-ichi Kudo ,  Koji Yamakawa ,  Kiyoshi Iyogi

IPC分类号： H01L23/498 ,  H01L23/52

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011

摘要： A semiconductor package is disclosed which is provided with a multilayer ceramic substrate such as, for example, a multilayer aluminum nitride substrate having a surface for mounting a semiconductor device and, at the same time, having an inner wiring layer electrically connected to the semiconductor device. On the surface of the multilayer ceramic substrate for forming terminals thereon, input and output terminals such as, for example, pin terminals and bump terminals electrically connected to the inner wiring layer. The input and output terminals embrace signal terminals, ground terminals, and power source terminals. The signal terminals among other terminals are so disposed that they may be each positioned adjacently to at least one ground terminal or power source terminal. This semiconductor package possesses perfect transmission properties even for signals of such a high frequency as exceeds the order of GHz. The dispersion of the transmission properties is small.

摘要翻译： 公开了一种半导体封装，其具有多层陶瓷衬底，例如具有用于安装半导体器件的表面的多层氮化铝衬底，并且同时具有与半导体器件电连接的内部布线层 。 在用于在其上形成端子的多层陶瓷基板的表面上，诸如引脚端子和凸起端子的输入和输出端子电连接到内部布线层。 输入和输出端子包括信号端子，接地端子和电源端子。 其他端子之间的信号端子被布置成使得它们可以各自邻近于至少一个接地端子或电源端子。 该半导体封装即使对于超过GHz数量级的高频的信号也具有完美的传输特性。 透射性能的分散性很小。

公开(公告)号：US5736790A

公开(公告)日：1998-04-07

申请号：US710769

申请日：1996-09-20

申请人： Kiyoshi Iyogi ,  Kaoru Koiwa ,  Keiichi Yano ,  Hironori Asai

发明人： Kiyoshi Iyogi ,  Kaoru Koiwa ,  Keiichi Yano ,  Hironori Asai

IPC分类号： H01L23/485 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H05K1/111 ,  H05K3/3436 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K2201/0212 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Disclosed is a bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad. The bump has: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material. With another conductive bonding material provided on the other pad of a wiring substrate or a package, the ball of the bump of the semiconductor chip or the package is placed close to another pad of the wiring substrate or package. The conductive bonding material of the other pad is heated and melted to connect the ball and the other pad of the wiring substrate or package by the conductive bonding material.

摘要翻译： 公开了一种形成在焊盘上的凸块，其设置在半导体芯片或封装或其输入或输出的布线基板上，用于在焊盘上进行电连接。 凸起具有：从该垫突出的突起; 具有导电性并位于垫上方的球; 以及用于接合焊盘和球的导电接合材料，其中球的蠕变强度大于导电接合材料的强度。 通过设置在布线基板或封装的另一个焊盘上的另一个导电接合材料，将半导体芯片或封装的凸块的球放置成靠近布线基板或封装的另一个焊盘。 另一个焊盘的导电接合材料被加热熔化，以通过导电接合材料将接线衬底或封装的球和另一焊盘连接起来。

公开(公告)号：US5969413A

公开(公告)日：1999-10-19

申请号：US855931

申请日：1997-05-14

申请人： Keiichi Yano ,  Kazuo Kimura ,  Hironori Asai ,  Jun Monma ,  Koji Yamakawa ,  Mitsuyoshi Endo ,  Hirohisa Osoguchi

发明人： Keiichi Yano ,  Kazuo Kimura ,  Hironori Asai ,  Jun Monma ,  Koji Yamakawa ,  Mitsuyoshi Endo ,  Hirohisa Osoguchi

IPC分类号： H01L23/10 ,  H01L23/15 ,  H01L23/28 ,  H01L23/495 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48

CPC分类号： H01L23/10 ,  H01L23/15 ,  H01L23/49572 ,  H01L24/50 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/30107

摘要： A semiconductor chip is supported on a tape carrier provided with lead wirings. The semiconductor chip is electrically connected to the lead wirings. The semiconductor chip of this quality is bonded in combination with the pe carrier to an aluminum nitride substrate. The lead wirings provided on the carrier combine the two functions as an internal lead and an external lead. The semiconductor package of such a structure as is described above allows multi-terminal connection by the narrowing of pitches between the leads and permits provision of a miniature package excelling in the heat-radiating property. Alternatively, the lead wirings supported on the tape carrier and electrically connected to the semiconductor chip are utilized as internal leads. For the external leads, such lead frames as are bonded to the aluminum nitride substrate are used. The lead frames are electrically connected to the internal leads provided in the tape carrier.

摘要翻译： 半导体芯片被支撑在带有引线配线的带载体上。 半导体芯片电连接到引线配线。 该质量的半导体芯片与pe载体结合到氮化铝衬底上。 载体上提供的导线结合了作为内部引线和外部引线的两个功能。 如上所述的这种结构的半导体封装允许通过引线之间的间距变窄来实现多端子连接，并且允许提供具有优异的散热性能的微型封装。 或者，支撑在带载体上并电连接到半导体芯片的引线配线被用作内部引线。 对于外部引线，使用与氮化铝基板结合的引线框架。 引线框架电连接到设置在带式载体中的内部引线。

公开(公告)号：US08973759B2

公开(公告)日：2015-03-10

申请号：US13418970

申请日：2012-03-13

申请人： Hideo Ichikawa ,  Kaori Ozeki ,  Tatsushi Umayahara ,  Takashi Ono ,  Masayoshi Suzuki ,  Teruo Shibata ,  Keiichi Yano ,  Masato Suzuki ,  Eiichi Masushio ,  Hiroshi Sano ,  Yusuke Uchida ,  Junji Yamabe ,  Seiji Terazawa ,  Masashi Hasegawa

发明人： Hideo Ichikawa ,  Kaori Ozeki ,  Tatsushi Umayahara ,  Takashi Ono ,  Masayoshi Suzuki ,  Teruo Shibata ,  Keiichi Yano ,  Masato Suzuki ,  Eiichi Masushio ,  Hiroshi Sano ,  Yusuke Uchida ,  Junji Yamabe ,  Seiji Terazawa ,  Masashi Hasegawa

IPC分类号： G03G15/08 ,  B07B1/06 ,  B07B1/55 ,  B07B4/08 ,  B07B13/16 ,  B65G65/48 ,  G03G9/08

CPC分类号： B07B1/06 ,  B07B1/55 ,  B07B4/08 ,  B07B13/16 ,  B65G65/48 ,  B65G65/4809 ,  G03G9/08 ,  G03G9/0817

摘要： A sieving device including a hollow cylindrical body, a filter disposed at a bottom portion of the hollow cylindrical body, and a blade configured to rotate in close proximity to the filter around a rotation axis thereof crossing the filter to thereby stir powder supplied to the hollow cylindrical body.

摘要翻译： 一种筛分装置，包括中空圆柱体，设置在中空圆柱体的底部的过滤器和一个叶片，其构造成围绕过滤器的旋转轴线紧邻过滤器旋转，从而搅拌供应到中空的粉末 圆柱体。

公开(公告)号：US08613666B2

公开(公告)日：2013-12-24

申请号：US12872790

申请日：2010-08-31

申请人： Chris Esaki ,  Keiichi Yano

发明人： Chris Esaki ,  Keiichi Yano

IPC分类号： A63F13/00

CPC分类号： A63F13/42 ,  A63F13/213 ,  A63F13/533 ,  A63F13/5375 ,  A63F2300/1093 ,  A63F2300/305 ,  A63F2300/308 ,  A63F2300/6607 ,  G06F3/017

摘要： A system for performing user selection of an option is provided. A user interface displays one or more options. Each option is associated with a sequence of a looped motion. In response, a user will perform one of the displayed sequences of looped motion. User motion data is received from one or more sensors connected to the computing device. The user's progress of performing the sequence of the looped motion is determined based on the user motion data matching one or more looped motion criteria associated with the performed looped motion. The user's progress of performing the sequence of the looped motion is displayed to the user. A selection of the option associated with the performed looped motion is automatically triggered in response to determining that the user has completed the sequence of looped motion.

摘要翻译： 提供了一种用于执行选项的用户选择的系统。 用户界面显示一个或多个选项。 每个选项与循环运动的顺序相关联。 作为响应，用户将执行所显示的循环运动序列之一。 从连接到计算设备的一个或多个传感器接收用户运动数据。 基于与所执行的循环运动相关联的一个或多个循环运动标准的用户运动数据来确定执行循环运动序列的用户进度。 向用户显示用户执行循环运动序列的进度。 响应于确定用户已经完成了循环运动的顺序，自动地触发与执行的循环运动相关联的选项的选择。

公开(公告)号：US08610145B2

公开(公告)日：2013-12-17

申请号：US10572595

申请日：2004-09-29

申请人： Keiichi Yano

发明人： Keiichi Yano

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： A light emitting apparatus 10 includes an aluminum nitride co-fired substrate 11 and a light emitting device 12 arranged on a front surface of the co-fired substrate, in which the front surface of the aluminum nitride substrate 11 bearing the light emitting device 12 is mirror-polished so as to have a surface roughness of 0.3 μm Ra or less, and the light emitting apparatus 10 further includes a vapor-deposited metal film 14 and via holes 15. The vapor-deposited metal film 14 is arranged on the front surface of the aluminum nitride substrate 11 around the light emitting device 12 and has a reflectivity of 90% or more with respect to light emitted from the light emitting device 12. The via holes 15 penetrates the aluminum nitride substrate 11 from the front surface bearing the light emitting device 12 to the rear surface to thereby allow conduction to the light emitting device 12 from the rear surface. This configuration can reduce light emitting apparatuses in size and can provide light emitting apparatuses that are excellent in heat radiation performance, allow a larger current to pass therethrough, and can have a significantly increased luminance with a high luminous efficiency.

摘要翻译： 发光装置10包括氮化铝共烧基板11和布置在共烧基板的前表面上的发光装置12，其中承载发光装置12的氮化铝基板11的前表面是 镜面抛光以使表面粗糙度为0.3μmRa或更小，并且发光装置10还包括蒸镀金属膜14和通孔15.蒸镀金属膜14配置在前表面 的氮化铝衬底11，并且相对于从发光器件12发射的光具有90％或更多的反射率。通孔15从承载光的前表面穿透氮化铝衬底11 发射器件12到后表面，从而允许从后表面传导到发光器件12。 这种结构可以减小发光装置的尺寸，并且可以提供散热性能优异的发光装置，允许较大的电流通过，并且可以以高发光效率显着提高亮度。

公开(公告)号：US20080160617A1

公开(公告)日：2008-07-03

申请号：US12030314

申请日：2008-02-13

申请人： Yoshiki Sasai ,  Hiroo Iwata ,  Yoshinobu Murakami ,  Mitsuo Sato ,  Masato Kobori ,  Keiichi Yano

发明人： Yoshiki Sasai ,  Hiroo Iwata ,  Yoshinobu Murakami ,  Mitsuo Sato ,  Masato Kobori ,  Keiichi Yano

IPC分类号： C12N15/87 ,  C12N5/06

CPC分类号： G01N33/5073 ,  A61K35/12 ,  A61K35/48 ,  A61K38/1709 ,  C12N5/0603 ,  C12N5/0619 ,  C12N2501/415 ,  C12N2501/90 ,  C12N2501/91 ,  C12N2502/13 ,  C12N2503/02 ,  C12N2506/02 ,  G01N33/5008 ,  G01N33/5023 ,  G01N33/5058 ,  G01N33/6896

摘要： A method for obtaining a solution having activity to induce differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell, which comprises culturing a stromal cell in a culture comprising a polyanionic compound and recovering the culture; a solution having activity to induce differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell, which is obtainable by the method; and an agent for inducing differentiation of an embryonic stem cell into an ectodermal cell or ectoderm-derived cell.

摘要翻译： 一种获得具有诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的活性的溶液的方法，其包括在包含聚阴离子化合物的培养物中培养基质细胞并回收培养物; 具有诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的活性的溶液，其可通过该方法获得; 以及用于诱导胚胎干细胞分化为外胚层细胞或外胚层衍生细胞的药剂。

公开(公告)号：US20070247855A1

公开(公告)日：2007-10-25

申请号：US11576533

申请日：2005-09-30

申请人： Keiichi Yano

发明人： Keiichi Yano

IPC分类号： F21V29/00 ,  F21V7/00

CPC分类号： H01L33/641 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting apparatus 11 comprises: an aluminum nitride co-fired substrate 13; at least one light emitting device 15 mounted on a front surface of the co-fired substrate 13 through a flip-tip method; and a reflector 16 having an inclined surface 14 for reflecting a light emitted from the light emitting device 15 to a front side direction, the reflector 16 is bonded to a surface of the aluminum nitride co-fired substrate 13 so as to surround a circumference of the light emitting device 15. This configuration can simplify the process of manufacturing the apparatus and can provide light emitting apparatus that are excellent in heat radiation performance, allow a larger current to pass therethrough, and can have a significantly increased luminance with a high luminous efficiency.

摘要翻译： 发光装置11包括：氮化铝共烧基板13; 至少一个发光装置15，通过翻盖法安装在共烧基板13的前表面上; 以及具有用于将从发光装置15发射的光反射到前侧方向的倾斜面14的反射体16，反射体16以氮化铝烧结基板13的表面贴合 发光器件15。 该配置可以简化制造装置的过程，并且可以提供散热性能优异的发光装置，允许较大的电流通过，并且可以以高发光效率具有显着增加的亮度。

公开(公告)号：US06642355B2

公开(公告)日：2003-11-04

申请号：US09750754

申请日：2001-01-02

申请人： Takeo Tanaka ,  Yoshikazu Morishita ,  Mika Makino ,  Shigeru Chiba ,  Isao Kawamoto ,  Eiji Tsukuda ,  Mayumi Yoshida ,  Chieko Bando ,  Kazuo Yamaguchi ,  Yuzuru Matsuda ,  Shigeto Kitamura ,  Toshihide Ikemura ,  Tatsuhiro Ogawa ,  Keiichi Yano ,  Toshiyuki Suzawa ,  Kenji Shibata ,  Motoo Yamasaki

发明人： Takeo Tanaka ,  Yoshikazu Morishita ,  Mika Makino ,  Shigeru Chiba ,  Isao Kawamoto ,  Eiji Tsukuda ,  Mayumi Yoshida ,  Chieko Bando ,  Kazuo Yamaguchi ,  Yuzuru Matsuda ,  Shigeto Kitamura ,  Toshihide Ikemura ,  Tatsuhiro Ogawa ,  Keiichi Yano ,  Toshiyuki Suzawa ,  Kenji Shibata ,  Motoo Yamasaki

IPC分类号： C07K700

CPC分类号： C07K7/06 ,  A61K38/00 ,  C07K5/1021 ,  C07K5/1024 ,  C07K7/08 ,  C07K14/36 ,  C07K14/57536 ,  C12R1/465

摘要： The invention relates to an endothelin antagonistic peptide of the formula (I): X-A-Trp-B-Gly-Thr-E-G-Y   (I) SEQ ID NO: 2 wherein represents Asn or Asp; B represents His or Lys; E represents Ala or Ser; G represents Ala or Pro; X represents X1-Gly or  and Y represents hydroxy, lower alkoxy, amino, wherein X1, X3, Y1, Y2 and Z are further defined, or a pharmaceutically acceptable salt thereof.

摘要翻译： 本发明涉及式（I）的内皮素拮抗肽：其中代表Asn或Asp; B代表His或Lys; E表示Ala或Ser; G表示Ala或Pro; X表示X 1 -Gly或Y表示羟基，低级烷氧基，氨基，其中X 1，X 3，Y 1，Y 2和Z进一步定义，或 其药学上可接受的盐。

公开(公告)号：US06372247B1

公开(公告)日：2002-04-16

申请号：US09885932

申请日：2001-06-22

申请人： Tadashi Nagashima ,  Satoshi Kuroyanagi ,  Tadanori Yamamura ,  Hideharu Anazawa ,  Yoko Kato ,  Seiji Sugimoto ,  Keiichi Yano

发明人： Tadashi Nagashima ,  Satoshi Kuroyanagi ,  Tadanori Yamamura ,  Hideharu Anazawa ,  Yoko Kato ,  Seiji Sugimoto ,  Keiichi Yano

IPC分类号： A23K1165

CPC分类号： C12N9/16 ,  A23K20/189 ,  Y10S426/807

摘要： Provided is an isolated phytase derived from a microorganism. The microorganism is preferably from the genus Monascus. The phytase has a Michaelis constant of 10 to 110 &mgr;M when phytic acid is used as a substrate. A process for producing the phytase is also provided as is an animal feed comprising the phytase. The phytase is preferably isolated from Monascus anka IFO 30873. The phytase has a Km of 107 &mgr;m when phytic acid is used as a substrate, the optimum pH is 2.5, the optimum temperature is 45° C., the molecular weight of the phytase is 140 kDa when measured by gel filtration, and the isolectric point is 5.2 using chromatofocusing.

摘要翻译： 提供来自微生物的分离的植酸酶。 微生物优选来自红曲霉属。 当植酸作为底物时，植酸酶的米氏常数为10〜110μM。 还提供了用于产生植酸酶的方法，包括植酸酶的动物饲料也是如此。 植酸酶优选与红曲霉IFO 30873分离。当植酸用作底物时，肌醇六磷酸酶的Km为107，最佳pH为2.5，最适温度为45℃，植酸酶的分子量为 当通过凝胶过滤测量时为140kDa，并且使用色谱聚焦的等电点为5.2。