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公开(公告)号：US11239123B2
公开(公告)日：2022-02-01
申请号：US14888600
申请日：2013-08-29
发明人： Tatsuya Kawase , Noboru Miyamoto , Mikio Ishihara , Junji Fujino , Yuji Imoto , Naoki Yoshimatsu
IPC分类号： H01L23/053 , H01L23/31 , H01L23/367 , H01L23/492 , H01L23/498 , H01L23/00 , H01L23/36 , H01L23/373 , H01L21/48 , B60L50/51 , H01L23/40 , H01L25/07
摘要： A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).
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公开(公告)号：US20190189537A1
公开(公告)日：2019-06-20
申请号：US16301893
申请日：2017-07-25
发明人： Junji Fujino , Yuji Imoto , Shohei Ogawa , Mikio Ishihara
摘要： A semiconductor device includes a semiconductor element having a front electrode, an electrode plate having an area larger than the front electrode of the semiconductor element in a two-dimensional view and made of aluminum or aluminum alloy, and a metal member having a joint surface joined to the front electrode of the semiconductor element with solder, having an area smaller than the front electrode of the semiconductor element in a two-dimensional view, made of a metal different from the electrode plate, and fastened to the electrode plate to electrically connect the front electrode of the semiconductor element to the electrode plate.
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公开(公告)号：US09362219B2
公开(公告)日：2016-06-07
申请号：US14787103
申请日：2013-05-09
发明人： Tatsuya Kawase , Mikio Ishihara , Noboru Miyamoto
IPC分类号： H01L23/34 , H01L23/498 , H01L23/473 , H01L23/31 , H01L25/07 , H01L23/373 , H01L21/48 , H01L23/053 , H01L23/367 , H01L23/00 , H01L23/40
CPC分类号： H01L23/49844 , H01L21/4871 , H01L23/053 , H01L23/3107 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L23/4006 , H01L23/473 , H01L24/37 , H01L24/40 , H01L24/41 , H01L25/072 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/37124 , H01L2224/40137 , H01L2224/40247 , H01L2224/41175 , H01L2224/73263 , H01L2224/83801 , H01L2224/84801 , H01L2924/13055 , H01L2924/181 , H01L2924/014 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member. A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.
摘要翻译： 散热器具有与固定表面相对的固定表面和放热表面。 散热片设置在放热表面的中心部分。 绝热构件设置在散热器的固定表面上。 导电构件设置在绝缘构件上。 在导电构件上设置半导体芯片。 金属框架连接到半导体芯片。 模制树脂覆盖散热器，绝缘构件，导电构件，半导体芯片和金属框架，使得翅片暴露于外部。 孔延伸穿过散热器的周边部分和模制树脂的周边部分。 通过使螺钉穿过孔将半导体模块安装在冷却套上。
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公开(公告)号：US10388589B2
公开(公告)日：2019-08-20
申请号：US15742536
申请日：2015-11-25
发明人： Tatsuya Kawase , Mikio Ishihara , Noboru Miyamoto , Yosuke Nakata , Yuji Imoto
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18 , H05K7/20
摘要： The object is to provide a technology capable of enhancing a cooling performance of a semiconductor device. The semiconductor device includes a fin portion including a plurality of projecting portions that are connected to a lower surface of a heat-transfer base plate, a cooling member covering the fin portion and being connected to an inlet through which coolant to flow toward the fin portion flows in and an outlet through which coolant flowing from the fin portion flows out, and a header being a water storage chamber that is provided between the inlet and the fin portion and is partitioned from the fin portion so as to be capable of allowing coolant to flow through from the inlet to the fin portion.
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公开(公告)号：US20190111467A1
公开(公告)日：2019-04-18
申请号：US16080163
申请日：2017-05-29
发明人： Keisuke Tanaka , Daisuke Oya , Mikio Ishihara , Tatsuya Iwasa , Koji Saito , Yuki Wakabayashi
摘要： In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.
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公开(公告)号：US10104775B2
公开(公告)日：2018-10-16
申请号：US14269585
申请日：2014-05-05
发明人： Naoki Yoshimatsu , Masayoshi Shinkai , Taketoshi Shikano , Daisuke Murata , Nobuyoshi Kimoto , Yuji Imoto , Mikio Ishihara
摘要： A semiconductor device according to the present invention includes a ceramic substrate, a plurality of circuit patterns arranged on a surface of the ceramic substrate, a semiconductor element arranged on an upper surface of at least one circuit pattern, and a sealing resin for sealing the ceramic substrate, the plurality of circuit patterns, and the semiconductor element, in which an undercut part is formed in opposed side surfaces of the circuit patterns adjacent to one another, the undercut part is configured such that an end of an upper surface of the circuit pattern protrudes outside the circuit pattern more than an end of a lower surface of the circuit pattern on the ceramic substrate, and the undercut part is also filled with the sealing resin.
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公开(公告)号：US09716052B2
公开(公告)日：2017-07-25
申请号：US14894456
申请日：2013-08-28
发明人： Tsuyoshi Osaga , Mikio Ishihara , Kazuaki Hiyama , Tatsuya Kawase
IPC分类号： H01L23/34 , H01L29/861 , H01L27/06 , H01L29/423 , H01L29/739 , H01L29/78 , H01L23/538 , H01L23/495 , H01L23/00
CPC分类号： H01L23/34 , H01L23/49562 , H01L23/5386 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L27/0629 , H01L27/0664 , H01L29/4236 , H01L29/42372 , H01L29/7397 , H01L29/7811 , H01L29/7813 , H01L29/861 , H01L2224/0237 , H01L2224/04042 , H01L2224/05548 , H01L2224/0603 , H01L2224/291 , H01L2224/33181 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/014
摘要： A ground working tool comprising a tubular base body with an inner receiving space for receiving a cylindrical core of solid ground material, connector mechanism for connecting the tubular base body with a rotary drive and locking mechanism for locking the core in the receiving space of the tubular base body. The locking mechanism involves at least one locking unit having a guide rail being disposed at an inner side of the tubular base body and arranged with a deviation angle relative to a tangential direction of the tubular base body and the locking unit further comprises at least one locking element, which is moveably mounted on the guide rail between a radially outer releasing position and a radially inner locking position, in which the core is clamped within the receiving space by means of the at least one locking element.
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公开(公告)号：US20170018495A1
公开(公告)日：2017-01-19
申请号：US15124489
申请日：2015-05-15
IPC分类号： H01L23/498 , H01L23/00 , H01L25/18 , H01L23/31
CPC分类号： H01L23/49861 , H01L23/28 , H01L23/3121 , H01L23/3735 , H01L23/48 , H01L23/49811 , H01L23/49838 , H01L23/49866 , H01L23/49894 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/48 , H01L25/07 , H01L25/18 , H01L2224/05553 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/37147 , H01L2224/37599 , H01L2224/40139 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45624 , H01L2224/48091 , H01L2224/48106 , H01L2224/48175 , H01L2224/48472 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2224/92247 , H01L2924/00011 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/17747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/2076 , H01L2924/01005
摘要： Herein provided are: a ceramic board; a semiconductor element for electric power, on one surface of which an electrode is formed, and the other surface of which is bonded to the ceramic board; a lead terminal, one end side of which is bonded to the electrode, and the other end side of which is to be electrically connected to an outside thereof; and a sealing member by which the semiconductor element for electric power is sealed together with a part, in the lead terminal, bonded to the electrode; wherein, near an end in said one end side of the lead terminal, an inclined surface is formed which becomes farther from the circuit board as it becomes closer to the end.
摘要翻译： 这里提供：陶瓷板; 用于电力的半导体元件，其一个表面上形成有电极，另一个表面接合到陶瓷板上; 引线端子的一端侧与电极接合，另一端侧与外部电连接; 以及密封构件，通过所述密封构件将所述电力用半导体元件与所述引线端子中的与所述电极接合的部分密封; 其特征在于，在所述引线端子的所述一端侧的端部附近形成倾斜面，所述倾斜面越接近所述端部越靠近所述电路基板。
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公开(公告)号：US09530766B2
公开(公告)日：2016-12-27
申请号：US14897362
申请日：2013-08-23
发明人： Mikio Ishihara , Kazuaki Hiyama , Tatsuya Kawase , Tsuyoshi Osaga
CPC分类号： H01L27/0251 , H01L23/34 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L27/0629 , H01L2224/0603 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48132 , H01L2224/4846 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H03K17/0828 , H03K2017/0806 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A transistor (2) is provided on a semiconductor substrate (8). A temperature detection diode (4) for monitoring temperature of an upper surface of the semiconductor substrate (8) is provided on the semiconductor substrate (8). An external electrode (7) is connected in common to an emitter (E) of the transistor (2) and a cathode (K) of the temperature detection diode (4). Therefore, an external electrode for the cathode (K) of the temperature detection diode (4) can be removed, and thus the device can be reduced in size and improved in terms of ease of assembly.
摘要翻译： 晶体管（2）设置在半导体衬底（8）上。 用于监测半导体衬底（8）的上表面的温度的温度检测二极管（4）设置在半导体衬底（8）上。 外部电极（7）共同连接到晶体管（2）的发射极（E）和温度检测二极管（4）的阴极（K）。 因此，可以去除用于温度检测二极管（4）的阴极（K）的外部电极，因此可以减小装置的尺寸并且在组装的容易性方面得到改进。
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公开(公告)号：US20210121943A1
公开(公告)日：2021-04-29
申请号：US17132708
申请日：2020-12-23
发明人： Keisuke Tanaka , Daisuke Oya , Mikio Ishihara , Tatsuya Iwasa , Koji Saito , Yuki Wakabayashi
IPC分类号： B22C3/00 , B22D19/00 , B22D27/20 , H01L23/12 , B22D27/18 , H01L23/36 , H05K1/02 , H01L23/14 , H01L23/373
摘要： In a semiconductor-mounting heat dissipation base plate including: an insulating substrate to which a metal circuit layer for mounting a semiconductor chip thereon is fixed; a heat dissipation base formed from the same metal material as the metal circuit layer at a side opposite to the metal circuit layer across the insulating substrate and fixed to the insulating substrate similar to the metal circuit layer; and a strengthening member provided in the heat dissipation base so as to be separated from the insulating substrate, the sizes of crystal grains of a metal structure at a part of the heat dissipation base or the metal circuit layer are reduced by a crystal size reducing material adhered to a mold, thereby preventing an adverse effect of a columnar crystal structure.
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