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公开(公告)号：US20150236214A1
公开(公告)日：2015-08-20
申请号：US14704334
申请日：2015-05-05
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译： 根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。
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公开(公告)号：US08680567B2
公开(公告)日：2014-03-25
申请号：US14014998
申请日：2013-08-30
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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3.发明授权公开(公告)号：US10260126B2
公开(公告)日：2019-04-16
申请号：US15005396
申请日：2016-01-25
摘要： In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.
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公开(公告)号：US10037947B1
公开(公告)日：2018-07-31
申请号：US15495014
申请日：2017-04-24
IPC分类号： H01L33/00 , H01L21/00 , H01L23/538 , H01L33/50 , H01L23/14
CPC分类号： H01L23/5387 , H01L25/0753 , H01L33/44 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0041
摘要： In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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公开(公告)号：US09252373B2
公开(公告)日：2016-02-02
申请号：US14704334
申请日：2015-05-05
IPC分类号： H01L33/00 , H01L21/00 , H01L51/00 , H01L23/498 , H01L23/538
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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公开(公告)号：US20150042231A1
公开(公告)日：2015-02-12
申请号：US14484880
申请日：2014-09-12
IPC分类号： H05B33/08
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译： 根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。
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公开(公告)号：US08860318B2
公开(公告)日：2014-10-14
申请号：US14036368
申请日：2013-09-25
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
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公开(公告)号：US10651128B2
公开(公告)日：2020-05-12
申请号：US16021266
申请日：2018-06-28
IPC分类号： H01L21/00 , H01L33/00 , H01L23/538 , H01L33/50 , H01L33/62 , H01L25/075 , H01L33/60 , H01L33/58 , H01L33/44
摘要： In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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9.发明授权Lighting systems incorporating flexible light sheets deformable to produce desired light distributions 有权照明系统结合柔性光片可变形以产生所需的光分布公开(公告)号：US09494305B2
公开(公告)日：2016-11-15
申请号：US14303197
申请日：2014-06-12
IPC分类号： F21V21/14 , F21L4/00 , F21V21/005 , F21V21/34 , F21V33/00 , G06F1/16 , G09F13/00 , F21Y105/00 , F21L4/08 , F21V1/00 , F21V23/06 , F21V31/00 , F21V17/00 , F21V21/08 , F21Y101/02
CPC分类号： F21V21/14 , F21L4/00 , F21L4/08 , F21L2001/00 , F21V17/007 , F21V21/005 , F21V21/08 , F21V21/34 , F21V23/06 , F21V31/005 , F21V33/00 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , G06F1/1616 , G09F13/00
摘要： In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.
摘要翻译： 根据某些实施例，照明系统包括具有布置在其上的第一发光强度分布的发光元件的柔性光片，并且光片被弯曲或折叠以产生不同于第一发光强度分布的第二发光强度分布。
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公开(公告)号：US09107272B2
公开(公告)日：2015-08-11
申请号：US14484880
申请日：2014-09-12
CPC分类号： H05B33/089 , F21K9/20 , H05B33/08 , H05B33/0821 , H05K2201/09263 , H05K2201/10106 , H05K2201/10174 , Y10T29/49002
摘要： In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
摘要翻译： 根据某些实施例，包括多个功率串的照明系统具有促进对沿着每个功率线连接的一个或多个发光元件的故障进行补偿的元件。
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