公开(公告)号：US08670211B1

公开(公告)日：2014-03-11

申请号：US13164991

申请日：2011-06-21

申请人： Ming Sun ,  Jose A. Medina ,  Keith Y. Sasaki ,  Ming Jiang

发明人： Ming Sun ,  Jose A. Medina ,  Keith Y. Sasaki ,  Ming Jiang

IPC分类号： G11B5/127 ,  C25D3/00

CPC分类号： G11B5/3143 ,  C25D3/562 ,  C25D5/18 ,  C25D7/001 ,  G11B5/3163 ,  H01F41/26

摘要： A method and system plates CoFeX, where X is an insertion metal. The method and system include providing a plating solution including hydroxymethyl-p-tolylsulfone (HPT). The plating solution being configured to provide a CoFeX film having a high saturation magnetic flux density of greater than 2.3 Tesla and not more than 3 weight percent of X. The method and system also include plating the CoFeX film on a substrate in the plating solution. In some aspects, the plated CoFeX film may be used in structures such as main poles of a magnetic recording head.

摘要翻译： 一种方法和系统板CoFeX，其中X是插入金属。 该方法和系统包括提供包含羟甲基对甲苯砜（HPT）的电镀溶液。 电镀溶液被配置为提供具有大于2.3特斯拉的高饱和磁通密度和不大于X重量百分比的X的高的饱和磁通密度的CoFeX膜。该方法和系统还包括在电镀液中的基底上电镀CoFeX膜。 在一些方面，电镀CoFeX膜可以用于诸如磁记录头的主极的结构中。

公开(公告)号：US08441756B1

公开(公告)日：2013-05-14

申请号：US12970423

申请日：2010-12-16

申请人： Ming Sun ,  Dehua Han ,  Jose A. Medina ,  Ming Jiang ,  Ying Hong ,  Feng Liu ,  Jian X. Shen

发明人： Ming Sun ,  Dehua Han ,  Jose A. Medina ,  Ming Jiang ,  Ying Hong ,  Feng Liu ,  Jian X. Shen

IPC分类号： G11B5/39

CPC分类号： G11B5/187 ,  G11B5/3116 ,  G11B5/3163

摘要： A method and system for fabricating a magnetic transducer are described. The magnetic transducer includes a pole and a nonmagnetic intermediate layer adjacent to the pole. The pole has a paddle and a pole tip including a plurality of sidewalls. The pole includes a first magnetic pole layer, at least one antiferromagnetic coupling (AFC) structure on the first magnetic pole layer, and a second magnetic pole layer on the AFC structure(s). At least a portion of the first magnetic pole layer resides on the sidewalls of the pole tip. The paddle has a paddle width in a track width direction. The pole tip has a pole tip width in a track width direction that is less than the paddle width.

摘要翻译： 描述了用于制造磁换能器的方法和系统。 磁换能器包括极和邻近极的非磁性中间层。 极具有桨和包括多个侧壁的极尖。 所述极包括第一磁极层，在所述第一磁极层上的至少一个反铁磁耦​​合（AFC）结构和所述AFC结构上的第二磁极层。 第一磁极层的至少一部分位于极尖的侧壁上。 桨叶在轨道宽度方向上具有桨叶宽度。 极尖具有小于桨宽度的轨道宽度方向上的极尖宽度。

公开(公告)号：US09731242B2

公开(公告)日：2017-08-15

申请号：US15028478

申请日：2013-11-06

申请人： XiaoShan Zhou ,  Ming Sun ,  Ji Lei

发明人： XiaoShan Zhou ,  Ming Sun ,  Ji Lei

IPC分类号： B01D53/047 ,  B01D53/06

CPC分类号： B01D53/06 ,  B01D53/047 ,  B01D2253/108 ,  B01D2253/116 ,  B01D2259/40003

摘要： A pressure swing adsorption apparatus having: a housing with an arc-shaped inner surface, the housing being arranged with at least one gas inlet, at least one exhaust port and at least one gas outlet for discharging the separated gas; a rotor arranged in the housing, at least two contact ends being arranged on the rotor for maintaining a non-stop sliding contact with the inner surface of the housing, individual cavities, i.e., air cavities between the adjacent contact ends and formed between the external surface of the rotor and the inner surface of the housing, and each air cavity being separated by the contact ends; adsorption chambers set inside the rotor as parts of the rotor and rotated along with the rotor, molecular sieves being loaded in the interior of the adsorption chambers, and the adsorption chambers being provided with screen openings for connection with the air cavities.

公开(公告)号：US08680658B2

公开(公告)日：2014-03-25

申请号：US12130663

申请日：2008-05-30

申请人： Lei Shi ,  Kai Liu ,  Ming Sun

发明人： Lei Shi ,  Kai Liu ,  Ming Sun

IPC分类号： H01L23/495

CPC分类号： H01L23/49524 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/544 ,  H01L24/28 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/54486 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/451 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A clip for a semiconductor device package may include two or more separate electrically conductive fingers electrically connected to each other by one or more electrically conductive bridges. A first end of at least finger is adapted for electrical contact with a lead frame. The bridges are adapted to provide electrical connection to a top semiconductor region of a semiconductor device and may also to provide heat dissipation path when a top surface of the fingers is exposed. A semiconductor device package may include the clip along with a semiconductor device and a lead frame. The semiconductor device may have a first and semiconductor regions on top and bottom surfaces respectively. The clip may be electrically connected to the top semiconductor region at the bridges and electrically connected to the lead frame at a first end of at least one of the fingers.

摘要翻译： 用于半导体器件封装的夹子可以包括通过一个或多个导电桥彼此电连接的两个或更多个分离的导电指状物。 至少手指的第一端适于与引线框架电接触。 桥适于提供与半导体器件的顶部半导体区域的电连接，并且还可以在手指的顶表面暴露时提供散热路径。 半导体器件封装可以包括夹子以及半导体器件和引线框架。 半导体器件可以分别在顶表面和底表面上具有第一半导体区域和半导体区域。 夹子可以在桥接处电连接到顶部半导体区域，并且在至少一个手指的第一端处电连接到引线框架。

公开(公告)号：US08497160B2

公开(公告)日：2013-07-30

申请号：US13560786

申请日：2012-07-27

申请人： François Hébert ,  Anup Bhalla ,  Kai Liu ,  Ming Sun

发明人： François Hébert ,  Anup Bhalla ,  Kai Liu ,  Ming Sun

IPC分类号： H01L21/60

CPC分类号： H01L24/40 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/64 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/05624 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/37099

摘要： A solder-top enhanced semiconductor device is proposed for packaging. The solder-top device includes a device die with a top metal layer patterned into contact zones and contact enhancement zones. At least one contact zone is electrically connected to at least one contact enhancement zone. Atop each contact enhancement zone is a solder layer for an increased composite thickness thus lowered parasitic impedance. Where the top metal material can not form a uniform good electrical bond with the solder material, the device die further includes an intermediary layer sandwiched between and forming a uniform electrical bond with the top metal layer and the solder layer. A method for making the solder-top device includes lithographically patterning the top metal layer into the contact zones and the contact enhancement zones; then forming a solder layer atop each of the contact enhancement zones using a stencil process for an increased composite thickness.

摘要翻译： 提出了一种焊顶增强型半导体器件进行封装。 焊料顶部器件包括具有图案化为接触区域和接触增强区域的顶部金属层的器件裸片。 至少一个接触区域电连接到至少一个接触增强区域。 每个接触增强区顶部都是一个焊料层，用于增加复合材料厚度，从而降低寄生阻抗。 在顶部金属材料不能与焊料材料形成均匀的良好电接合的情况下，器件裸片还包括夹在中间层之间并与顶部金属层和焊料层形成均匀的电接合的中间层。 制造焊料顶部器件的方法包括将顶部金属层光刻地图案化成接触区域和接触增强区域; 然后使用用于增加的复合材料厚度的模版工艺在每个接触增强区的顶部上形成焊料层。

公开(公告)号：US20130006982A1

公开(公告)日：2013-01-03

申请号：US13497857

申请日：2010-06-03

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： G06F17/30

CPC分类号： G06F11/3476 ,  G06F11/3409 ,  G06F17/30339 ,  H04L41/0823 ,  H04L41/0853

摘要： A method and system for storing performance data are disclosed, and the method includes: during a process of adding a collection point, a system creating a data subtable in real time according to the number of added collection points and a predetermined maximum number of collection points of the data subtable; and storing the performance data of the collection point into the created data subtable, and storing the corresponding relationship between the collection point and the data subtable.

摘要翻译： 公开了一种存储性能数据的方法和系统，该方法包括：在添加收集点的过程中，根据添加的收集点的数量和预定的最大数量的收集点，实时地生成数据的系统 的数据子表; 并将所述收集点的演奏数据存储在所生成的数据中，并且存储所述收集点和所述数据之间的对应关系。

公开(公告)号：US08343801B2

公开(公告)日：2013-01-01

申请号：US13278240

申请日：2011-10-21

申请人： Ming Sun ,  Michael Xuefei Tang ,  Insik Jin ,  Venkatram Venkatasamy ,  Philip George Pitcher ,  Nurul Amin

发明人： Ming Sun ,  Michael Xuefei Tang ,  Insik Jin ,  Venkatram Venkatasamy ,  Philip George Pitcher ,  Nurul Amin

IPC分类号： H01L21/00 ,  H01L21/16

CPC分类号： H01L45/085 ,  H01L27/2436 ,  H01L45/1233 ,  H01L45/141 ,  H01L45/146

摘要： Programmable metallization memory cells include an electrochemically active electrode and an inert electrode and an ion conductor solid electrolyte material between the electrochemically active electrode and the inert electrode. An electrically insulating oxide layer separates the ion conductor solid electrolyte material from the electrochemically active electrode.

摘要翻译： 可编程金属化存储单元包括在电化学活性电极和惰性电极之间的电化学活性电极和惰性电极以及离子导体固体电解质材料。 电绝缘氧化物层将离子导体固体电解质材料与电化学活性电极分离。

公开(公告)号：US08334165B2

公开(公告)日：2012-12-18

申请号：US12761899

申请日：2010-04-16

申请人： Haiwen Xi ,  Ming Sun ,  Dexin Wang ,  Shuiyuan Huang ,  Michael Tang ,  Song S. Xue

发明人： Haiwen Xi ,  Ming Sun ,  Dexin Wang ,  Shuiyuan Huang ,  Michael Tang ,  Song S. Xue

IPC分类号： H01L21/00

CPC分类号： H01L45/085 ,  H01L27/2409 ,  H01L27/2436 ,  H01L27/2463 ,  H01L27/2472 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/1266 ,  H01L45/141 ,  H01L45/143 ,  H01L45/1625 ,  H01L45/1633 ,  H01L45/1658 ,  H01L45/1675

摘要： Methods for making a programmable metallization memory cell are disclosed.

摘要翻译： 公开了制造可编程金属化存储单元的方法。

公开(公告)号：US08330264B2

公开(公告)日：2012-12-11

申请号：US13454342

申请日：2012-04-24

申请人： Ming Sun ,  Yueh Se Ho

发明人： Ming Sun ,  Yueh Se Ho

IPC分类号： H01L23/12

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49844 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00

摘要： This invention discloses an electronic package for containing a vertical semiconductor chip that includes a laminated board having a via connector and conductive traces distributed on multiple layers of the laminated board connected to the via connector. The semiconductor chip having at least one electrode connected to the conductive traces for electrically connected to the conductive traces at a different layer on the laminated board and the via connector dissipating heat generated from the vertical semiconductor. A ball grid array (BGA) connected to the via connector functioning as contact at a bottom surface of the package for mounting on electrical terminals disposed on a printed circuit board (PCB) wherein the laminated board having a thermal expansion coefficient in substantially a same range the PCB whereby the BGA having a reliable electrical contact with the electrical terminals.

公开(公告)号：US20120234935A1

公开(公告)日：2012-09-20

申请号：US13066729

申请日：2011-04-22

申请人： Ming Sun

发明人： Ming Sun

IPC分类号： B05B7/30 ,  B05B11/00 ,  B05B1/30

CPC分类号： B05B7/2443 ,  B05B1/3013 ,  B05B7/12

摘要： The dispenser draws a concentrate fluid from a liquid container into an input fluid. There is an elongated channel having an input for the input fluid and dispensing nozzle at an exit end for dispensing the concentrate fluid in a diluted form. A transverse intersecting channel is intermediate the input end and the exit end. An insert is moveable in the transverse intersecting channel, apertures of the moveable insert being alignable with apertures in the transverse intersecting channel and the liquid container. The channels from the liquid container will have a plurality of various sized apertures to provide for the flow of differing amounts of concentrate fluid into the input fluid. By adjusting the moveable insert in the transverse intersecting channel and/or the input fluid flow rate the concentration of concentrate fluid in the input fluid is changed.

摘要翻译： 分配器将浓缩液从液体容器吸入输入流体。 具有细长通道，其具有用于在出口端处的输入流体和分配喷嘴的输入，用于以稀释形式分配浓缩液。 横向相交通道位于输入端和出口端之间。 插入件可在横向交叉通道中移动，可移动插入件的孔与横向相交通道和液体容器中的孔对准。 来自液体容器的通道将具有多个各种尺寸的孔，以提供不同量的浓缩液流入输入流体的流量。 通过调整横向交叉通道中的可移动插入件和/或输入流体流速，改变输入流体中的浓缩液的浓度。