公开(公告)号：US5023407A

公开(公告)日：1991-06-11

申请号：US390616

申请日：1989-08-07

申请人： Mitugu Shirai ,  Kaoru Katayama ,  Hideaki Sasaki ,  Shinichi Kazui ,  Ryohei Satoh ,  Tateoki Miyauchi ,  Mamoru Kobayashi

发明人： Mitugu Shirai ,  Kaoru Katayama ,  Hideaki Sasaki ,  Shinichi Kazui ,  Ryohei Satoh ,  Tateoki Miyauchi ,  Mamoru Kobayashi

IPC分类号： B23K1/20 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/50 ,  H05K1/03 ,  H05K1/09 ,  H05K3/24 ,  H05K3/34

CPC分类号： H05K3/246 ,  H01L21/4846 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/0723 ,  H05K2203/107 ,  H05K3/244 ,  H05K3/3457

摘要： A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.

摘要翻译： 在陶瓷基板上形成金以外的金属层，在所述金属层上进一步形成金层，然后将高密度光束施加到处理过的基板部件。 由此，通过热处理等将金的晶界扩散到金层的表面的底层的金属与金均匀混合，形成对焊料的润湿性优异的合金化层。 同时，将金属杂质如粘附在金层表面上的碳熔化并除去。

公开(公告)号：US5801350A

公开(公告)日：1998-09-01

申请号：US619186

申请日：1996-03-21

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

摘要翻译： 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US06423405B1

公开(公告)日：2002-07-23

申请号：US09384105

申请日：1999-08-27

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： B32B712

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/22 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809 ,  H01L2924/00

摘要： There is disclosed a surface reformation method of a high polymer material such that by irradiating and excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface, wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be soldered with preferable durability by a fluxess reflow soldering.

摘要翻译： 公开了一种高分子材料的表面改性方法，使得通过仅在其上将电子部件等暂时固定在预定区域上的预定区域照射和准分子激光束，所述预定区域通过液体在具有高聚合物层的基底上 仅用于临时固定的液体的表面润湿性相对于预定面积得到改善。 在通过使用该方法将电子部件暂时固定在基板上之后，可以通过无电流回流焊接将电子部件焊接在优选的耐久性上。

公开(公告)号：US6017424A

公开(公告)日：2000-01-25

申请号：US028095

申请日：1998-02-23

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  C07C1/00 ,  C07C2/00 ,  C07C4/00 ,  C07C5/00 ,  C07C6/00

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

摘要翻译： 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US5151773A

公开(公告)日：1992-09-29

申请号：US676389

申请日：1991-03-28

申请人： Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

发明人： Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

IPC分类号： H01L23/10

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315

摘要： An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

摘要翻译： 将电子电路部件安装到多路接线基板等上以与诸如LSI的电子电路一起使用的电子电路装置通过密封单元密封。 密封单元由指定为上板密封单元的上板和指定为侧板密封单元的侧板密封，侧板的横截面的边缘的形状为凸形或圆形。 金属化应用于基板和侧板之间以及侧板和上板之间的焊接部分，并且由支撑柱提供预定的焊点高度以实现焊料接合。

公开(公告)号：US5276289A

公开(公告)日：1994-01-04

申请号：US674599

申请日：1991-03-25

申请人： Ryohei Satoh ,  Fumiyuki Kobayashi ,  Yutaka Watanabe ,  Tositada Netsu ,  Mitugu Shirai ,  Kenji Takeda ,  Masahide Harada ,  Kiyoshi Matsui ,  Hideaki Sasaki

发明人： Ryohei Satoh ,  Fumiyuki Kobayashi ,  Yutaka Watanabe ,  Tositada Netsu ,  Mitugu Shirai ,  Kenji Takeda ,  Masahide Harada ,  Kiyoshi Matsui ,  Hideaki Sasaki

IPC分类号： H01L23/02 ,  B23K35/30 ,  H01L21/60 ,  H01L23/10 ,  H01L23/16 ,  H01L23/538 ,  H01L25/065 ,  H05K3/34 ,  H05K1/00

CPC分类号： H01L24/81 ,  B23K35/30 ,  H01L23/10 ,  H01L23/16 ,  H01L23/5385 ,  H01L25/0655 ,  H05K3/3463 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/30107 ,  H05K2201/094 ,  H05K2201/10704 ,  H05K2201/10734

摘要： The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).

摘要翻译： 本发明提供一种多步电子电路装置，其包括多个部件和元件，它们依次机械地或电连接地连接到具有多个焊料的基板上，该多个焊料包括作为部件和元件的基板，输入和输出销和 LSI芯片，以及任选的封装和通过多步接合结合的冷却器，包括至少一个CCB结合和至少一个密封的部件和元件的结合，每个具有比部件或元件的耐热温度低的熔点 与焊料接合，并且其中一个焊料的熔点比紧接在之前的接合步骤中使用的其它焊料的熔点低至少10摄氏度。 使用的焊料选自Au10-15wt％Ge合金（熔点：356〜450℃），Pb1-5wt％Sn合金（熔点：314〜325℃），Pb10-13wt％Sn合金 （熔点：270〜300℃），Au20重量％Sn合金（熔点：280℃），Sn3-6重量％Sb合金（熔点：232度-243℃），Sn2-8重量％ Ag合金（熔点221〜235℃），Sn35-55wt％Pb合金（熔点：183〜200℃），Sn45wt％Pb18wt％Bi（熔点：135〜160℃） ）。

公开(公告)号：US5136360A

公开(公告)日：1992-08-04

申请号：US563281

申请日：1990-08-06

申请人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

发明人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

IPC分类号： B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H01L21/60 ,  H01L23/488 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L23/488 ,  H01L2224/16225

摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

摘要翻译： 一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分 基材由1.0〜8.0重量份的合金组成构成。 提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。 该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法 电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件 所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

公开(公告)号：US5865365A

公开(公告)日：1999-02-02

申请号：US761430

申请日：1996-12-06

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426

摘要： A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

摘要翻译： 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中，并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法，进行无焊剂焊接，位移偏移降低，并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。

公开(公告)号：US5878943A

公开(公告)日：1999-03-09

申请号：US753018

申请日：1996-11-19

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/16 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157

摘要： In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

摘要翻译： 在将诸如电子电路器件的两个部件焊接在氧化物或污染层已经从焊料或焊盘的表面除去之后，例如，这些部件在氧化气氛中对准。 然后将焊料材料在非氧化气氛中加热以熔化焊料并结合该构件。 通过溅射清洗，激光清洗，机械抛光或切割来进行焊料或焊盘的清洁。

公开(公告)号：US5341980A

公开(公告)日：1994-08-30

申请号：US890255

申请日：1992-05-29

申请人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

发明人： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC分类号： B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

摘要： In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

摘要翻译： 在用于制造电子电路器件的焊接方法中，在焊料的表面上的氧化物层和/或污染层和由此被焊接的部件被去除之后，通过用原子或离子进行溅射清洗，这些部件对准 在预定时间段内的氧化气氛中，然后，在非氧化性气氛中加热焊接材料进行焊接。 用于执行上述方法的装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。 代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待结合的部件的表面，或者可以使用镀有金的焊球。 要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的补充凹部。