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公开(公告)号：US20170080513A1
公开(公告)日：2017-03-23
申请号：US15126642
申请日：2015-04-15
Applicant: NSK LTD.
Inventor： Takashi SUNAGA , Noboru KANEKO , Osamu MIYOSHI , Ryoichi SUZUKI
CPC classification number: B23K11/14 , B23K11/00 , B23K11/24 , B23K11/25 , B23K2101/006 , B62D5/0403
Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.
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公开(公告)号：US20160181221A1
公开(公告)日：2016-06-23
申请号：US14910355
申请日：2014-10-06
Applicant: NSK LTD.
Inventor： Takashi SUNAGA , Noboru KANEKO , Osamu MIYOSHI , Ryoichi SUZUKI
IPC: H01L23/00 , H01L23/498 , H01L23/492 , H01L29/78 , H01L29/739
CPC classification number: H01L24/41 , H01L23/3735 , H01L23/492 , H01L23/49811 , H01L23/49838 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/7393 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/2732 , H01L2224/29101 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/37611 , H01L2224/4001 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4099 , H01L2224/4112 , H01L2224/73263 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/8421 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/9221 , H01L2924/00015 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/35121 , H01L2924/365 , H01L2924/00 , H01L2924/00014 , H01L2224/291 , H01L2924/014 , H01L2924/00012 , H01L2924/01047 , H01L2224/29294 , H01L2224/293 , H01L2224/48 , H01L2224/85 , H01L2224/83 , H01L2224/84 , H01L2924/01029 , H01L2924/013 , H01L2924/00013
Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.
Abstract translation: 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。
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公开(公告)号：US20190337560A1
公开(公告)日：2019-11-07
申请号：US16070973
申请日：2017-07-04
Applicant: NSK LTD.
Inventor： Takahiro TSUBAKI , Tomohiro MIURA , Takashi SUNAGA , Nobuaki KOGURE
Abstract: An electric power steering apparatus that enables more precise estimation of a coil temperature by considering a heat transfer phenomenon between a control substrate and a poly-phase coil in addition to a heat transfer phenomenon between respective phases of the coil. The apparatus includes a control substrate that controls a poly-phase motor, a temperature sensor that detects a substrate temperature of the control substrate and a coil temperature estimating section that estimates coil temperatures of respective phases of the poly-phase motor by a motor current of the phase and the substrate temperature based on a heat transfer phenomenon between the respective phases that is caused by a difference in temperature between coils of the respective phases and a heat transfer phenomenon between the coil and the control substrate.
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公开(公告)号：US20170294374A1
公开(公告)日：2017-10-12
申请号：US15516723
申请日：2015-11-20
Applicant: NSK Ltd.
Inventor： Shigeru SIMAKAWA , Takashi SUNAGA , Takaaki SEKINE , Teruyoshi KOGURE , Ryoichi SUZUKI
CPC classification number: H01L23/50 , B29C39/10 , B62D5/0406 , G01R1/203 , H01L23/12 , H01L23/36 , H01L23/367 , H01L23/48 , H01L23/49844 , H01L23/49861 , H01L24/40 , H01L25/072 , H01L2924/0002 , H02K11/33 , H02M7/003 , H02M2001/327 , H01L2924/00
Abstract: An electronic part mounting heat-dissipating substrate which includes: a conductor plate which is formed on lead frames of wiring pattern shapes; and an insulating member which is provided between the lead frames of the wiring pattern shapes on the conductor plate; wherein a plate surface of a part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the part arrangement surface form one continuous surface, wherein a plate surface of a back surface of the part arrangement surface of the conductor plate and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane, wherein the substrate is formed in a circular shape
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5.发明申请公开(公告)号：US20190173216A1
公开(公告)日：2019-06-06
申请号：US16320653
申请日：2017-08-23
Applicant: NSK Ltd.
Inventor： Takashi SUNAGA , Tadayoshi OSAKABE
CPC classification number: H01R13/113 , B62D5/0403 , B62D5/0406 , H01R4/26 , H01R13/04 , H01R13/05 , H01R13/5213 , H02K5/225 , H02K11/33
Abstract: A terminal connection component including press-fit terminals and terminal metal-fittings. The press-fit terminals have a plate shape in which a taper is disposed at one tip, and the terminal metal-fittings also have a plate shape in which a fitting section is disposed at one end side. The fitting sections of the terminal metal-fittings have a first hole part and a second hole part from the one end in parallel. The tips of the press-fit terminals are press-fitted and are connected to the fitting sections of the terminal metal-fittings, and a portion between the first hole part and the second hole part of the fitting section, which serves as an elastic deformation section, is elastically deformed in a thickness direction of the press-fit terminal and biases the press-fit terminal so that the press-fit terminals are surely press-fitted to the fitting sections of the terminal metal-fittings.
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Patent Agency Ranking
公开(公告)号：US20170309555A1
公开(公告)日：2017-10-26
申请号：US15516730
申请日：2015-11-20
Applicant: NSK LTD.
Inventor： Shigeru SHIMAKAWA , Takashi SUNAGA , Takaaki SEKINE , Teruyoshi KOGURE , Ryoichi SUZUKI
CPC classification number: H01L23/49568 , B62D5/0403 , B62D5/0406 , B62D5/0409 , H01C1/14 , H01L21/4821 , H01L21/565 , H01L23/3735 , H01L23/48 , H01L23/49524 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L23/49589 , H01L23/49861 , H01L24/37 , H01L24/40 , H01L25/072 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/40 , H01L2224/40245 , H01L2924/0002 , H01L2924/18301 , H02K11/33 , H05K7/2089 , H01L2924/00014 , H01L2924/00012
Abstract: [Problem] An object of the present invention is to provide an electronic part mounting heat-dissipating substrate which enables a circuit for which a power semiconductor in which a large current flows is used to reduce the wiring resistances of a large power operation and improve the heat dissipation.[Means for Solving] The present invention is an electronic part mounting heat-dissipating substrate which comprises lead frames of wiring pattern shapes formed by conductor plate and an insulating member 130 which is provided between the lead frames 110, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frame 110H is used for a large current signal and the thin lead frame 110L is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.
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公开(公告)号：US20150342074A1
公开(公告)日：2015-11-26
申请号：US14435682
申请日：2013-10-25
Applicant: NSK LTD.
Inventor： Takashi SUNAGA , Noboru KANEKO , Osamu MIYOSHI
IPC: H05K7/02
CPC classification number: H05K7/02 , H01L23/142 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/73 , H01L24/83 , H01L24/84 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L2224/291 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/32238 , H01L2224/32245 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37013 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/48 , H01L2224/73263 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/9221 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00015 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2924/00
Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.
Abstract translation: 提供能够缩短制造节拍时间，降低制造成本，提高组装性的半导体模块。 半导体模块（30）包括由金属制成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a〜33d） 通过焊料（34a）安装在布线图案（33a）上的芯片晶体管（35）; 以及通过焊料（34b，34c）将裸芯片晶体管（35）的电极（S，G）和布线图案（33b，33c）接合的金属板连接器（36a，36b）。 金属板连接器（36a，36b）具有桥接形状，并且在部件的中间部分具有平坦表面和重心。
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公开(公告)号：US20190267926A1
公开(公告)日：2019-08-29
申请号：US16348398
申请日：2017-11-08
Applicant: NSK Ltd.
Inventor： Takahiro TSUBAKI , Tomohiro MIURA , Takashi SUNAGA , Nobuaki KOGURE , Haruhiko KAMIGUCHI
Abstract: [Problem] An object of the present invention is to provide an electric power steering apparatus that enables more precise estimation of a coil temperature for a poly-phase motor by considering a heat transfer phenomenon between a control substrate and a coil in addition to a heat transfer phenomenon between the coils.[Means for solving the problem] An electric power steering apparatus that comprises a control substrate that controls a poly-phase motor having two-system motor windings, comprises a temperature sensor that detects a substrate temperature of the control substrate, and a coil temperature estimating section that estimates all coil temperatures by all motor currents of the poly-phase motor and the substrate temperature based on a heat transfer phenomenon between all coils that is caused by a difference in temperature between the all coils and a heat transfer phenomenon between the coil and the control substrate.
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公开(公告)号：US20170338201A1
公开(公告)日：2017-11-23
申请号：US15535463
申请日：2015-12-02
Applicant: NSK LTD.
Inventor： Shigeru SHIMAKAWA , Takashi SUNAGA , Takaaki SEKINE
IPC: H01L25/065 , H02P6/28 , H02M7/5387 , H01L23/00 , H02P27/08 , B62D5/04 , H01L23/13 , H01L23/14 , H01L23/50
CPC classification number: H01L25/0655 , B62D5/04 , H01L23/13 , H01L23/14 , H01L23/3107 , H01L23/49562 , H01L23/49575 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/07 , H01L25/18 , H01L2224/0603 , H01L2224/48137 , H01L2224/48141 , H01L2224/48175 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49111 , H01L2224/49112 , H01L2224/49175 , H01L2924/0002 , H01L2924/15724 , H01L2924/15747 , H01L2924/181 , H02M7/53871 , H02P6/28 , H02P27/08 , H01L2924/00012 , H01L2924/00
Abstract: [Problem] An object of the present invention is to miniaturize and integrate plural power semiconductors in an electronic circuit in a low cost without occurrence of a problem of a heat dissipation or the like.[Means for solving the problem] The present invention is a power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.
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公开(公告)号：US20170309556A1
公开(公告)日：2017-10-26
申请号：US15523478
申请日：2015-11-20
Applicant: NSK Ltd.
Inventor： Shigeru SHIMAKAWA , Takashi SUNAGA , Takaaki SEKINE , Teruyoshi KOGURE , Ryoichi SUZUKI
IPC: H01L23/495 , H01L49/02
CPC classification number: H01L23/49568 , B62D5/0406 , G01R1/203 , H01L23/12 , H01L23/36 , H01L23/48 , H01L23/49524 , H01L23/49531 , H01L23/49537 , H01L23/49558 , H01L23/49861 , H01L23/50 , H01L24/34 , H01L24/37 , H01L25/071 , H01L28/20 , H01L2224/34 , H01L2224/37147 , H01L2224/37599 , H02K11/33 , H05K1/181 , H05K3/202 , H05K2201/09881 , H01L2924/00014 , H01L2924/00012
Abstract: An electronic heat-dissipating substrate including: lead frames of wiring pattern shapes on a conductor plate; and an insulating member between the lead frames. A plate surface of the lead frames and a top surface of the insulating member form one continuous surface. The part arrangement surface is on both surfaces of the electronic part mounting heat-dissipating substrate, a reductant circuit which includes at least similar dual-system circuit is formed on the electronic part mounting heat-dissipating substrate, a first-system circuit of the dual-system circuit is formed on a first surface of the electronic part mounting heat-dissipating substrate, a second-system circuit of the dual-system circuit is formed on a second surface of the electronic part mounting heat-dissipating substrate, and the common lead frames used in a portion of a circuit wiring are used to the first surface and the second surface of the electronic part mounting heat-dissipating substrate.
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