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公开(公告)号:US20090238233A1
公开(公告)日:2009-09-24
申请号:US12052650
申请日:2008-03-20
申请人: Omar Bchir , Islam Salama , Charan Gurumurthy , Houssam Jomaa , Ravi Nalla
发明人: Omar Bchir , Islam Salama , Charan Gurumurthy , Houssam Jomaa , Ravi Nalla
CPC分类号: G02B6/02042 , H01L31/0203 , H01S5/02248 , H01S5/02284 , H01S5/423
摘要: Optical die structures and associated package substrates are generally described. In one example, an electronic device includes a package substrate having a package substrate core, a dielectric layer coupled with the package substrate core, and one or more input/output (I/O) optical fibers coupled with the package substrate core or coupled with the build-up dielectric layer, or combinations thereof, the one or more I/O optical fibers to guide I/O optical signals to and from the package substrate wherein the one or more I/O optical fibers allow both input and output optical signals to travel through the one or more I/O optical fibers.
摘要翻译: 通常描述光学晶粒结构和相关的封装衬底。 在一个示例中,电子设备包括封装衬底,其具有封装衬底芯,与封装衬底芯耦合的电介质层,以及与封装衬底芯耦合的一个或多个输入/输出(I / O)光纤或与 所述积聚介质层或其组合,所述一个或多个I / O光纤以将I / O光信号引导到所述封装基板,其中所述一个或多个I / O光纤允许输入和输出光信号 穿过一个或多个I / O光纤。
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公开(公告)号:US07831115B2
公开(公告)日:2010-11-09
申请号:US12052650
申请日:2008-03-20
申请人: Omar Bchir , Islam Salama , Charan Gurumurthy , Houssam Jomaa , Ravi Nalla
发明人: Omar Bchir , Islam Salama , Charan Gurumurthy , Houssam Jomaa , Ravi Nalla
CPC分类号: G02B6/02042 , H01L31/0203 , H01S5/02248 , H01S5/02284 , H01S5/423
摘要: Optical die structures and associated package substrates are generally described. In one example, an electronic device includes a package substrate having a package substrate core, a dielectric layer coupled with the package substrate core, and one or more input/output (I/O) optical fibers coupled with the package substrate core or coupled with the build-up dielectric layer, or combinations thereof, the one or more I/O optical fibers to guide I/O optical signals to and from the package substrate wherein the one or more I/O optical fibers allow both input and output optical signals to travel through the one or more I/O optical fibers.
摘要翻译: 通常描述光学晶粒结构和相关的封装衬底。 在一个示例中,电子设备包括封装衬底,其具有封装衬底芯,与封装衬底芯耦合的电介质层以及与封装衬底芯耦合的一个或多个输入/输出(I / O)光纤或与 所述积聚介质层或其组合,所述一个或多个I / O光纤以将I / O光信号引导到所述封装基板,其中所述一个或多个I / O光纤允许输入和输出光信号 穿过一个或多个I / O光纤。
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3.
公开(公告)号:US09929097B2
公开(公告)日:2018-03-27
申请号:US14719764
申请日:2015-05-22
申请人: Ravi Nalla , Omar Bchir , Houssam Jomaa
发明人: Ravi Nalla , Omar Bchir , Houssam Jomaa
CPC分类号: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
摘要: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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公开(公告)号:US20090056989A1
公开(公告)日:2009-03-05
申请号:US11845404
申请日:2007-08-27
申请人: Omar Bchir , Islam Salama , Charan Gurumurthy
发明人: Omar Bchir , Islam Salama , Charan Gurumurthy
CPC分类号: H05K3/06 , H05K1/0265 , H05K3/02 , H05K3/027 , H05K3/064 , H05K2201/09727 , H05K2201/09972 , H05K2203/095 , H05K2203/1476 , Y10T29/49155
摘要: Disclosed is a method for preparing a printed circuit board. The method comprises forming a conductive layer on an insulated layer substrate. The method further includes partitioning the conductive layer into a first area and a second area by applying a photoresist mask. Furthermore, the method includes applying a first etching process to the conductive layer to pattern a first set of features on the first area of the conductive layer. Thereafter, the method includes applying a second etching process to the conductive layer to pattern a second set of features on the second area of the conductive layer. The second set of features on the second area of the conductive layer has a finer pitch as compared to the first set of features on the first area of the conductive layer.
摘要翻译: 公开了一种制备印刷电路板的方法。 该方法包括在绝缘层基底上形成导电层。 该方法还包括通过施加光致抗蚀剂掩模将导电层划分成第一区域和第二区域。 此外,该方法包括对导电层施加第一蚀刻工艺以在导电层的第一区域上图案化第一组特征。 此后,该方法包括对导电层施加第二蚀刻工艺,以在导电层的第二区域上图形化第二组特征。 与导电层的第一区域上的第一组特征相比,导电层的第二区域上的第二组特征具有更细的间距。
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5.
公开(公告)号:US20160079174A1
公开(公告)日:2016-03-17
申请号:US14719764
申请日:2015-05-22
申请人: Ravi Nalla , Omar Bchir , Houssam Jomaa
发明人: Ravi Nalla , Omar Bchir , Houssam Jomaa
IPC分类号: H01L23/532 , C08J5/18
CPC分类号: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
摘要: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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6.
公开(公告)号:US20130299226A1
公开(公告)日:2013-11-14
申请号:US13867851
申请日:2013-04-22
申请人: Ravi Nalla , Omar Bchir , Houssam Jomaa
发明人: Ravi Nalla , Omar Bchir , Houssam Jomaa
CPC分类号: H01L23/53238 , C08J5/18 , C08J2363/00 , H01L24/26 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0298 , H05K3/181 , H05K3/381 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2203/0773 , H05K2203/0796 , Y10T156/1052 , Y10T428/249921 , Y10T428/254 , Y10T428/268 , H01L2924/00
摘要: In some embodiments, an improved mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers is presented. In this regard, a substrate build-up film is introduced having epoxy material and a plurality of epoxy microspheres, wherein an interior of the microspheres is not fully cured. Other embodiments are also disclosed and claimed.
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公开(公告)号:US07538021B2
公开(公告)日:2009-05-26
申请号:US11524859
申请日:2006-09-20
申请人: Houssam Jomaa , Omar Bchir
发明人: Houssam Jomaa , Omar Bchir
IPC分类号: H01L21/44 , H01L23/52 , H01L23/48 , H01L23/40 , H01L23/485 , H01L23/488
CPC分类号: H05K3/3484 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05147 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11009 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13155 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H05K3/3452 , H05K2203/0568 , H05K2203/0577 , H01L2224/13099 , H01L2924/00014 , H01L2924/013
摘要: A technique to remove dry film resist residues during solder bump formation. A resist assembly is formed on a metal pad on a substrate. The resist assembly includes a solder resist (SR) layer, a poly-electrolyte multi-layer (PEMU), and a dry film resist (DFR). A SR opening is formed in the resist assembly. A solder bump is formed on the SR opening. The PEMU is removed.
摘要翻译: 在焊料凸点形成期间去除干膜抗蚀剂残留物的技术。 抗蚀剂组件形成在基板上的金属焊盘上。 抗蚀剂组件包括阻焊层(SR)层,多电解质多层(PEMU)和干膜抗蚀剂(DFR)。 在抗蚀剂组件中形成SR开口。 在SR开口上形成焊料凸块。 PEMU被删除。
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公开(公告)号:US20080070329A1
公开(公告)日:2008-03-20
申请号:US11524859
申请日:2006-09-20
申请人: Houssam Jomaa , Omar Bchir
发明人: Houssam Jomaa , Omar Bchir
IPC分类号: H01L21/00
CPC分类号: H05K3/3484 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/05147 , H01L2224/0557 , H01L2224/05571 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/11009 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13155 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H05K3/3452 , H05K2203/0568 , H05K2203/0577 , H01L2224/13099 , H01L2924/00014 , H01L2924/013
摘要: A technique to remove dry film resist residues during solder bump formation. A resist assembly is formed on a metal pad on a substrate. The resist assembly includes a solder resist (SR) layer, a poly-electrolyte multi-layer (PEMU), and a dry film resist (DFR). A SR opening is formed in the resist assembly. A solder bump is formed on the SR opening. The PEMU is removed.
摘要翻译: 在焊料凸点形成期间去除干膜抗蚀剂残留物的技术。 抗蚀剂组件形成在基板上的金属焊盘上。 抗蚀剂组件包括阻焊层(SR)层,多电解质多层(PEMU)和干膜抗蚀剂(DFR)。 在抗蚀剂组件中形成SR开口。 在SR开口上形成焊料凸块。 PEMU被删除。
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9.
公开(公告)号:US09398699B2
公开(公告)日:2016-07-19
申请号:US13595149
申请日:2012-08-27
申请人: Houssam Jomaa , Omar Bchir
发明人: Houssam Jomaa , Omar Bchir
IPC分类号: H05K1/16 , H05K3/28 , H01L21/48 , H01L23/31 , H01L23/498 , H01L21/56 , H01L23/538 , H05K1/18 , H05K3/00 , H05K3/34
CPC分类号: H05K3/28 , H01L21/4853 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/5387 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/15311 , H05K1/189 , H05K3/0035 , H05K3/3452 , H05K2201/0162 , H05K2201/0195 , H05K2201/0209 , H05K2201/099 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49165 , Y10T29/49169 , H01L2224/05599
摘要: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.
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公开(公告)号:US20090081381A1
公开(公告)日:2009-03-26
申请号:US11861302
申请日:2007-09-26
申请人: Omar Bchir , Houssam Jomaa , Islam A. Salama , Yonggang Li
发明人: Omar Bchir , Houssam Jomaa , Islam A. Salama , Yonggang Li
CPC分类号: C23C18/1605 , C23C18/1651 , C23C18/1653 , C25D5/022 , C25D5/10 , H05K3/0035 , H05K3/107 , H05K3/108 , H05K3/423 , H05K2201/09509 , H05K2201/09563
摘要: A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.
摘要翻译: 一种使得在衬底上进行选择性区域电镀的方法包括在基本上所有衬底上形成第一导电层(310),用掩模(410)覆盖第一导电层的部分,使得第一导电层具有 掩模部分和未屏蔽部分,形成第二导电层(710,1012),所述第二导电层仅形成在所述第一导电层的未掩模部分上,并且去除所述掩模和所述第一导电层的所述掩蔽部分 层。 在一个实施例中,第一导电层的掩模覆盖部分是施加有印模(1020)的非导电物质(1010)。 在一个实施例中,掩模是黑色氧化物层。
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