公开(公告)号：US20080180065A1

公开(公告)日：2008-07-31

申请号：US12020968

申请日：2008-01-28

申请人： Takao ARADACHI ,  Kazuhiko FUNABASHI ,  Shinji WATANABE

发明人： Takao ARADACHI ,  Kazuhiko FUNABASHI ,  Shinji WATANABE

IPC分类号： H02J7/10

CPC分类号： H02J7/0031 ,  H02J2007/0095

摘要： To prevent a battery pack from being over-discharged even under a state that the battery pack (a secondary battery) is connected to a discharging device that is not connected to an ac input power source for a long time. A charging device 200 has a pair of output lines L1 and L2 and an anode terminal O1 and a cathode terminal O2 of a secondary battery 2 electrically connected between the output lines L1 and L2 to carry out a charging operation. In the charging device 200 including a component circuit part (a resistance 33, a series connecting circuit of resistances 102, 103 and 105, a series connecting circuit of resistances 91 and 92 and an inner circuit part of a shunt regulator 116) electrically connected by traversing a part between the pair of output lines L1 and L2, a switching element 121 is inserted between the component circuit part (the resistance 33 or the like) and one of the pair of output lines L1 and L2. When the charging device 200 is not connected to an input power source 1, the switching element 121 is allowed to be non-conductive to interrupt a discharging path so that the component circuit part does not form the discharging path.

摘要翻译： 即使在电池组（二次电池）连接到长时间未连接到交流输入电源的放电装置的状态下，也可防止电池组过度放电。 充电装置200具有一对输出线L 1和L 2以及电连接在输出线L 1和L 2之间的二次电池2的阳极端子O 1和阴​​极端子O 2，以执行充电操作。 在包括组件电路部分（电阻33，电阻102,103和105的串联连接电路，电阻91和92的串联连接电路和分流调节器116的内部电路部分）的充电装置200中，电连接 穿过一对输出线L 1和L 2之间的部分，开关元件121插入在组件电路部分（电阻33等）和一对输出线L 1和L 2中的一个之间。 当充电装置200未连接到输入电源1时，允许开关元件121不导通以中断放电路径，使得元件电路部分不形成放电路径。

公开(公告)号：US20110242717A1

公开(公告)日：2011-10-06

申请号：US13084059

申请日：2011-04-11

申请人： Kazuhiko FUNABASHI ,  Shinji WATANABE ,  Eiji NAKAYAMA

发明人： Kazuhiko FUNABASHI ,  Shinji WATANABE ,  Eiji NAKAYAMA

IPC分类号： H02H3/00 ,  H02J7/00

CPC分类号： H01M10/48 ,  H01M10/425 ,  H01M10/441 ,  H01M10/448 ,  Y10T307/826

摘要： A power tool 1 is connected to a battery pack 5 including an overcurrent detector 533 which detects overcurrent of a battery module 51 and outputs a detection signal, and an overdischarge detector 532 which detects overdischarge of the battery module 51 and outputs a detection signal. The power tool 1 includes a motor 2 which is driven by electric power supplied from the battery pack 5, a trigger switch 31 for setting the power supply from the battery pack 5 to the motor 2 in ON/OFF state, and an FET 410 which sets the power supply to the motor 2 in ON/OFF state on the basis of the detection signal from the overcurrent detector 533 or the overdischarge detector 532.

公开(公告)号：US20150179615A1

公开(公告)日：2015-06-25

申请号：US14557644

申请日：2014-12-02

申请人： Shinji WATANABE ,  Tsuyoshi KIDA ,  Yoshihiro ONO ,  Kentaro MORI ,  Kenji SAKATA ,  Yusuke YAMADA

发明人： Shinji WATANABE ,  Tsuyoshi KIDA ,  Yoshihiro ONO ,  Kentaro MORI ,  Kenji SAKATA ,  Yusuke YAMADA

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L21/78 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/13017 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16238 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81986 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/013

摘要： To improve reliability of a semiconductor device. In a conductive material that electrically couples a Cu pillar electrode and a lead, an alloy part comprised of an alloy of tin and copper is formed inside this conductive material. At this time, the alloy part contacts both the Cu pillar electrode and the lead, and the Cu pillar electrode and the lead are bound through the alloy part. Similarly, also in FIG. 8, it is found that the Cu pillar electrode and the lead are electrically coupled to each other by the alloy part. Thereby, it is possible to improve electric coupling reliability between the Cu pillar electrode and the lead.

摘要翻译： 提高半导体器件的可靠性。 在电耦合Cu柱电极和引线的导电材料中，在该导电材料内形成由锡和铜合金组成的合金部分。 此时，合金部分接触Cu柱电极和引线，Cu柱电极和引线通过合金部分结合。 类似地，也在图1中。 如图8所示，发现Cu柱电极和引线通过合金部件彼此电耦合。 由此，能够提高Cu柱电极与引线之间的电耦合可靠性。

公开(公告)号：US20120270700A1

公开(公告)日：2012-10-25

申请号：US13278277

申请日：2011-10-21

申请人： Nozomu KAMIOKA ,  Shinji WATANABE ,  Kensuke HAYASHI ,  Satoshi WACHI

发明人： Nozomu KAMIOKA ,  Shinji WATANABE ,  Kensuke HAYASHI ,  Satoshi WACHI

IPC分类号： B60W30/00 ,  B60W10/06 ,  F02N11/08 ,  B60W10/02

CPC分类号： F04B49/022 ,  B60Y2300/18016 ,  B60Y2300/192 ,  F02D41/0215 ,  F02D2250/28 ,  F02N11/0814 ,  F02N15/08 ,  F02N2200/041 ,  F16H61/0031 ,  Y02T10/48 ,  Y10T477/6418 ,  Y10T477/71

摘要： An engine start control device includes a mechanical pump supplying hydraulic pressure; an electric pump connected in parallel to the mechanical pump and independently driven; a device for stopping the engine when an idling stop condition is satisfied and starting the engine when a restart condition and a fuel injection condition are satisfied; a device for driving the electric pump when the hydraulic pressure is less than a first hydraulic pressure when the engine is stopped by idling stop; and a device for driving a motor at a target speed and for performing control so that the change in the target speed is small compared with the change exhibited when the hydraulic pressure is equal or higher than a second hydraulic pressure, when the hydraulic pressure is less than the second hydraulic pressure, and the restart condition is satisfied after the idling stop.

摘要翻译： 发动机启动控制装置包括提供液压的机械泵; 电动泵并联连接到机械泵并独立驱动; 当满足怠速停止条件时停止发动机的装置，并且当重新启动条件和燃料喷射条件被满足时启动发动机; 当发动机通过怠速停止而停止时，液压小于第一液压时驱动电动泵的装置; 以及用于以目标速度驱动电动机并且用于执行控制的装置，使得当液压等于或高于第二液压时显示的变化与目标速度的变化相比较小，当液压较小时 超过第二液压，并且在怠速停止之后满足重启条件。

公开(公告)号：US20120197509A1

公开(公告)日：2012-08-02

申请号：US13179238

申请日：2011-07-08

申请人： Shinji WATANABE

发明人： Shinji WATANABE

IPC分类号： F02D28/00

CPC分类号： F02D29/02 ,  F02D9/02 ,  F02D11/106 ,  F02D41/0002 ,  F02D41/042 ,  F02D41/062 ,  F02D41/1401 ,  F02D2041/1422 ,  F02D2200/021 ,  F02D2200/501 ,  F02N11/0818 ,  Y02T10/42

摘要： An engine control apparatus includes an ISS control unit provided with ISS determination means for inputting at least an engine cooling water temperature, vehicle speed, and brake information, and target opening setting means for setting a target opening in an idle stop/start control period; and a throttle control unit provided with proportional gain correction coefficient operation means for correcting a proportional gain to a value that is larger than a proportional gain outside the idle stop/start control period, throttle opening feedback control means for performing a throttle opening feedback control operation based on an opening deviation between a target opening and an actual opening, and PWM driving means for outputting a voltage that is in proportion to the operation amount to a motor.

摘要翻译： 发动机控制装置包括：ISS控制单元，其具有至少输入发动机冷却水温度，车速和制动信息的ISS判定单元，以及用于在怠速停止/起动控制期间内设定目标开度的目标开度设定单元; 以及节气门控制单元，其具有比例增益校正系数运算单元，用于将比例增益校正为大于怠速停止/开始控制周期以外的比例增益的值;节气门开度反馈控制单元，其执行节气门开度反馈控制动作 基于目标开度和实际开度之间的开度偏差，以及用于输出与电动机的操作量成比例的电压的PWM驱动装置。

公开(公告)号：US20110150353A1

公开(公告)日：2011-06-23

申请号：US12911290

申请日：2010-10-25

申请人： Shinji WATANABE ,  Junichiro Enoki

发明人： Shinji WATANABE ,  Junichiro Enoki

IPC分类号： G06K9/40

CPC分类号： G06T5/003

摘要： An information processing apparatus includes a first generating unit, a second generating unit, and an updating unit. The first generating unit generates a point spread function representing the degree of blurring generated in the input image. The second generating unit generates a plurality of corrected block images obtained by correcting blurring of structure components of plural input block images based on the point spread function. The updating unit executes one or more times an updating process to update the corrected block images, followed by making structure components of the updated corrected block images into new corrected block images.

摘要翻译： 信息处理设备包括第一生成单元，第二生成单元和更新单元。 第一生成单元生成表示在输入图像中生成的模糊程度的点扩散函数。 第二生成单元生成通过基于点扩展函数来校正多个输入块图像的结构成分的模糊而获得的多个校正块图像。 更新单元执行一次或多次更新处理以更新校正的块图像，随后将更新的校正块图像的结构分量构成新的校正块图像。

公开(公告)号：US20090243075A1

公开(公告)日：2009-10-01

申请号：US12409796

申请日：2009-03-24

申请人： Shinji WATANABE ,  Takao YAMAZAKI

发明人： Shinji WATANABE ,  Takao YAMAZAKI

IPC分类号： H01L23/12 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mounting structure comprises: at least one semiconductor device having solder bumps as outer terminals and a flexible wiring board with wiring formed thereon. The semiconductor device is structured to be wrapped by the flexible wiring board, the mounting structure is provided with outer electrodes on both sides of the flexible wiring board, one side being a side where outer terminals of the semiconductor device are formed, and the other side being an opposite side thereof. At least one wiring layer is formed on the flexible wiring board. A supporting member is provided covering side faces and a surface of the semiconductor device opposite to the side where the outer terminals are formed and protruding from the side faces of the semiconductor device and extending toward the surface on which the outer terminals are formed.

摘要翻译： 安装结构包括：至少一个具有作为外部端子的焊料凸块的半导体器件和其上形成有布线的柔性布线板。 半导体器件被构造成被柔性布线板包裹，安装结构在柔性布线板的两侧设置有外部电极，一侧是形成半导体器件的外部端子的一侧，另一侧 是相反的一面。 在柔性布线板上形成至少一个布线层。 提供了一种支撑构件，其覆盖半导体器件的与形成外部端子的侧相对的侧面和表面，并且从半导体器件的侧面突出并且朝向形成有外部端子的表面延伸。

公开(公告)号：US20120025371A1

公开(公告)日：2012-02-02

申请号：US13192049

申请日：2011-07-27

申请人： Satoshi MATSUI ,  Tsuyoshi EDA ,  Akira MATSUMOTO ,  Yoshitaka KYOUGOKU ,  Shinji WATANABE ,  Hirokazu HONDA

发明人： Satoshi MATSUI ,  Tsuyoshi EDA ,  Akira MATSUMOTO ,  Yoshitaka KYOUGOKU ,  Shinji WATANABE ,  Hirokazu HONDA

IPC分类号： H01L23/482

CPC分类号： H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/11622 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/1354 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05552

摘要： A semiconductor device includes a semiconductor chip, wiring formed thereon, a first insulating film formed on the wiring, provided with a first opening, a pad electrode formed so as to be in contact with the wiring, a second insulating film formed on the pad electrode film, provided with a second opening, and a flip chip bump formed so as to be in contact with the pad electrode film. In this case, the second insulating film exists between the flip chip bump and the pad electrode film, in a region directly underneath the outer edge of the flip chip bump, as seen in a plan view, and the outer edge of the flip chip bump is formed in a region inside the outer edge of the pad electrode film.

摘要翻译： 半导体器件包括半导体芯片，形成在其上的布线，形成在布线上的第一绝缘膜，设置有第一开口，形成为与布线接触的焊盘电极，形成在焊盘电极上的第二绝缘膜 具有第二开口的膜，以及形成为与焊盘电极膜接触的倒装芯片凸块。 在这种情况下，如俯视图所示，第二绝缘膜存在于倒装芯片凸块和焊盘电极膜之间的直接在倒装芯片凸块的外边缘下方的区域中，并且倒装芯片凸块的外边缘 形成在焊盘电极膜的外边缘内的区域中。

公开(公告)号：US20110298936A1

公开(公告)日：2011-12-08

申请号：US13111326

申请日：2011-05-19

申请人： Shinji WATANABE ,  Nobuhiro OGAWA ,  Tatsumi SAKAGUCHI

发明人： Shinji WATANABE ,  Nobuhiro OGAWA ,  Tatsumi SAKAGUCHI

IPC分类号： H04N5/228

CPC分类号： H04N5/23254 ,  G09G5/00 ,  G09G5/14 ,  G09G2320/0261 ,  G09G2340/10 ,  G09G2340/12 ,  H04N5/23219

摘要： Provided is an image stabilization device including an image capturing unit for capturing an image of a face of a user, a motion detection unit for detecting motion of the face whose image has been captured by the image capturing unit, a motion prediction unit for predicting motion of the face to be detected at a next time point, based on the motion of the face detected in time-series by the motion detection unit, an image data display unit for displaying image data, and a motion correction unit for performing control on the image data display unit to move the image data in a direction of cancelling the motion of the face predicted by the motion prediction unit.

摘要翻译： 提供了一种图像稳定装置，包括：用于捕获用户脸部的图像的图像捕获单元，用于检测由图像捕获单元捕获图像的脸部的运动的运动检测单元，用于预测运动的运动预测单元 基于由运动检测单元以时间序列检测到的面部的运动，用于显示图像数据的图像数据显示单元和用于对运动检测单元进行控制的运动校正单元，在下一个时间点检测的面部 图像数据显示单元，用于沿取消由运动预测单元预测的面部的运动的方向移动图像数据。

公开(公告)号：US20110242780A1

公开(公告)日：2011-10-06

申请号：US13158037

申请日：2011-06-10

申请人： Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

发明人： Shinji WATANABE ,  Nobuhiro MIKAMI ,  Junya SATO ,  Kenichiro FUJII ,  Katsumi ABE ,  Atsumasa SAWADA

IPC分类号： H05K7/14 ,  H05K7/00

CPC分类号： H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

摘要： An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

摘要翻译： 本发明的目的在于，当将半导体封装安装在弯曲的基板上时，可以抑制对半导体封装件施加的应力。 在安装基板1中，将半导体封装20安装在其至少一部分上包括弯曲表面的弯曲板10上。 弯曲板10包括设置在半导体封装20安装的弯曲表面部分的区域上并具有平坦的上表面的基座部分13a和设置在基座部分的平坦表面上的多个焊盘部分15a 13a。 基座部分13a由绝缘材料形成。 半导体封装20安装在焊盘部分15a上。