公开(公告)号：US20050189642A1

公开(公告)日：2005-09-01

申请号：US11121221

申请日：2005-05-03

申请人： Todd Bolken ,  David Peters

发明人： Todd Bolken ,  David Peters

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A mold apparatus for encapsulating IC chips mounted on a substrate. In an exemplary embodiment a mold is provided with an upper mold platen having a plurality of cavities for encapsulating wire bonds and related interconnections on a first side of a multi-chip carrier substrate. The mold further includes a lower mold platen with a single cavity for encapsulating substantially the entire second chip side of the carrier substrate. Support elements are provided for supporting the multi-chip carrier substrate. The support elements are configured to prevent or minimize substrate deflection during the fill of the mold cavities with encapsulant material. The support elements may be integral to a mold cavity or may be removable. The support elements may further be aligned along lines representing a series of individual device packages. The molded assembly may then be cut along marks left in the encapsulant to define individual device packages.

公开(公告)号：US20070145556A1

公开(公告)日：2007-06-28

申请号：US11708196

申请日：2007-02-20

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L23/02

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.

摘要翻译： 制造多器件组件的技术。 具体地，涉及用于制造包括至少一个I / C模块和多芯片封装的堆叠封装的技术。 多芯片封装包括耦合到载体的多个集成电路芯片。 骰子被封装，使得导电元件通过密封剂暴露。 导电元件电耦合到芯片。 I / C模块包括具有设置在其上的多个集成电路芯片的插入器。 I / C模块的裸片通过焊丝电耦合到插入器。 插入器被配置为使得通孔与多芯片封装上的导电元件对准。 多芯片封装和I / C模块可以单独制造，然后耦合在一起以形成堆叠封装。

公开(公告)号：US20070108579A1

公开(公告)日：2007-05-17

申请号：US11646991

申请日：2006-12-28

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L23/02

CPC分类号： H01L23/00 ,  B33Y80/00 ,  H01L21/50 ,  H01L23/02 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599

摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.

摘要翻译： 用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。 在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。 晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。 在第二实施例中，光学交互设备与背面导电元件电连接到插入器。 在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。 在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。 在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。

公开(公告)号：US20060051891A1

公开(公告)日：2006-03-09

申请号：US11250906

申请日：2005-10-15

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L21/50 ,  H01L21/44 ,  H01L21/00

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14603 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S257/924 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, a unitary shell of entirely transparent material is used. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.

摘要翻译： 本发明提供了用于轻或其它辐射敏感的电子设备的封装方法，例如包括CCD或CMOS芯片的图像传感器。 在本发明的一个实施例中，图像传感器封装通过围绕具有转移模具化合物的屏障的芯片组装并用透明盖覆盖芯片来组装。 在本发明的另一个实施例中，包括互连的芯片的周边区域用液体分配的环氧树脂封装，并且附接有透明盖。 在本发明的另一个实施例中，使用完全透明材料的整体外壳。 在本发明的另一个实施例中，将衬底安装的芯片和透明盖子装载到转移模具中，以使它们保持最佳对准。 然后将转移模具填充模塑料以封装芯片和互连，并保持透明盖。

公开(公告)号：US20050263312A1

公开(公告)日：2005-12-01

申请号：US11180493

申请日：2005-07-13

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20060169490A1

公开(公告)日：2006-08-03

申请号：US11366793

申请日：2006-03-02

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01L23/28

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20060051892A1

公开(公告)日：2006-03-09

申请号：US11250907

申请日：2005-10-15

申请人： Todd Bolken ,  Chad Cobbley

发明人： Todd Bolken ,  Chad Cobbley

IPC分类号： H01L21/50 ,  H01L21/44 ,  H01L21/00

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L23/293 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14603 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10S257/924 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00011

摘要： The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.

公开(公告)号：US20050255637A1

公开(公告)日：2005-11-17

申请号：US11168776

申请日：2005-06-28

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： H01L21/56 ,  H01L23/13 ,  H01L23/24 ,  H01L21/44

CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73203 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  Y10T29/49172

摘要： Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semiconductor die can be flip chip attached to the interposer by at least partial insertion of the semiconductor die within the recess with discrete conductive elements between bond pads of the semiconductor die and electrical connection pads of the interposer. The electrical connection pads communicate with a number of other electrical contact pads accessible elsewhere on the interposer, preferably on a lower surface thereof. A low viscosity underfill encapsulant is disposed between the semiconductor die and the interposer and around the discrete conductive elements by permitting the same to flow into the space between the die and the perimeter wall. The encapsulant may form an underfill or substantially encapsulate the semiconductor die within the recess of the interposer.

摘要翻译： 用于形成半导体组件的装置和方法。 插入器包括围绕其上表面的至少一部分的周边壁以形成凹部。 电连接垫阵列位于凹槽内。 半导体管芯可以通过在半导体管芯的接合焊盘和插入器的电连接焊盘之间的离散导电元件至少部分地插入凹槽内而将倒装芯片附接到插入器。 电连接焊盘与可插入到其他地方的多个其它电接触焊盘通信，优选地在其下表面上。 低粘度底部填充密封剂通过允许其相同的流入模具和周边壁之间的空间而设置在半导体管芯和插入件之间以及离散的导电元件周围。 密封剂可以形成底部填充物或基本上将半导体管芯封装在插入件的凹部内。

公开(公告)号：US20050248013A1

公开(公告)日：2005-11-10

申请号：US11182160

申请日：2005-07-15

申请人： Todd Bolken

发明人： Todd Bolken

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/34

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device includes two or more semiconductor devices with bond pads that are electrically connected to the same, single surface of a plurality of leads. The two or more devices may include substantially centrally located bond pads or substantially identically arranged bond pads.

摘要翻译： 半导体器件包括两个或更多个具有接合焊盘的半导体器件，该焊盘电连接到多个引线的相同的单个表面。 两个或更多个器件可以包括基本上位于中心的接合焊盘或基本相同布置的接合焊盘。

公开(公告)号：US20050029554A1

公开(公告)日：2005-02-10

申请号：US10930520

申请日：2004-08-31

申请人： William Stephenson ,  Bret Street ,  Todd Bolken

发明人： William Stephenson ,  Bret Street ,  Todd Bolken

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L29/40

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A BGA and a system implementing a BGA. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.

摘要翻译： BGA和实施BGA的系统。 具体地说，在球附着到包装上之后封装BGA封装。 具有设置在其上的球的包装的背面可以被密封剂完全覆盖。 密封剂围绕球的一部分直接接触。 提供衬垫以便于形成每个球的未封装部分。 未封装的部分可以用于将包装物耦合到系统。