公开(公告)号：US20090173529A1

公开(公告)日：2009-07-09

申请号：US12189206

申请日：2008-08-11

申请人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

发明人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC分类号： H05K1/11 ,  H05K3/10 ,  H05K1/00

CPC分类号： H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

摘要： A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

摘要翻译： 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US08513532B2

公开(公告)日：2013-08-20

申请号：US13033385

申请日：2011-02-23

申请人： Yu-Hua Chen ,  Ying-Ching Shih

发明人： Yu-Hua Chen ,  Ying-Ching Shih

IPC分类号： H05K1/00

CPC分类号： H05K1/0283 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/185 ,  H05K1/189 ,  H05K3/007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09263 ,  H05K2201/09909 ,  H05K2203/016 ,  H05K2203/0271 ,  Y10T29/49124 ,  H01L2924/00

摘要： A flexible circuit structure with stretchability comprises a flexible substrate, a metal layer, and a plurality of flexible bumps. The metal layer is formed on the flexible substrate. These flexible bumps are formed on the metal layer and the flexible substrate.

摘要翻译： 具有拉伸性的柔性电路结构包括柔性基板，金属层和多个柔性凸块。 金属层形成在柔性基板上。 这些柔性凸块形成在金属层和柔性基板上。

公开(公告)号：US08269112B2

公开(公告)日：2012-09-18

申请号：US12189206

申请日：2008-08-11

申请人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

发明人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC分类号： H05K1/00 ,  H05K1/09

CPC分类号： H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

摘要： A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

摘要翻译： 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US20120306080A1

公开(公告)日：2012-12-06

申请号：US13298046

申请日：2011-11-16

申请人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Shang-Yun Hou ,  Kuo-Ching Hsu ,  Cheng-Chieh Hsieh ,  Ying-Ching Shih ,  Po-Hao Tsai ,  Cheng-Lin Huang ,  Jing-Cheng Lin

IPC分类号： H01L23/52

CPC分类号： H01L24/11 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/04 ,  H01L25/50 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05073 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05184 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05686 ,  H01L2224/10145 ,  H01L2224/10156 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11831 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01047 ,  H01L2924/049 ,  H01L2924/053 ,  H01L2924/00

摘要： A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier.

摘要翻译： 封装组件不含其中的有源器件。 封装部件包括衬底，衬底中的通孔，衬底上的顶部电介质层和在顶部电介质层的顶表面上方具有顶表面的金属柱。 金属柱电连接到通孔。 扩散阻挡层在金属支柱的上表面之上。 焊料帽设置在扩散阻挡层上。

公开(公告)号：US20120045611A1

公开(公告)日：2012-02-23

申请号：US12858211

申请日：2010-08-17

申请人： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/12 ,  B32B3/24 ,  B32B3/26 ,  B32B38/10 ,  H01L21/50 ,  B32B37/02 ,  B32B37/12 ,  B32B17/06 ,  B32B7/12

CPC分类号： G07F17/3213 ,  B32B17/10 ,  B32B37/1207 ,  B32B37/182 ,  B32B37/185 ,  B32B2457/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.

摘要翻译： 提供了一种用于制造半导体器件的复合载体结构。 复合载体结构利用多个载体衬底，例如玻璃或硅衬底，通过插入的粘合剂层耦合在一起。 复合载体结构可以附接到晶片或模具，用于例如背面处理，例如变薄处理。 在一个实施例中，复合载体结构包括具有贯穿其中形成的贯通基板通孔的第一载体基板。 使用粘合剂将第一衬底附接到第二衬底，使得粘合剂可以延伸到贯穿衬底通孔中。

公开(公告)号：US07772679B2

公开(公告)日：2010-08-10

申请号：US12213660

申请日：2008-06-23

申请人： Shu-Ming Chang ,  Ying-Ching Shih

发明人： Shu-Ming Chang ,  Ying-Ching Shih

IPC分类号： H01L21/00

CPC分类号： H01L23/552 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/3025 ,  H01L2224/05599 ,  H01L2224/05099

摘要： This invention provides a magnetic shielding package structure of a magnetic memory device, in which at least a magnetic memory device is embedded between a magnetic shielding substrate and a magnetic shielding layer. A plurality of through vias is formed in the magnetic shielding substrate or the magnetic shielding layer, and a plurality of conductive contacts passes through the through vias such that electrical connection between the magnetic memory device and the external is established.

摘要翻译： 本发明提供一种磁存储器件的磁屏蔽封装结构，其中至少一个磁存储器件被嵌入在磁屏蔽衬底和磁屏蔽层之间。 在磁屏蔽基板或磁屏蔽层中形成多个通孔，并且多个导电触头通过通孔，从而建立磁存储器件与外部之间的电连接。

公开(公告)号：US08846499B2

公开(公告)日：2014-09-30

申请号：US12858211

申请日：2010-08-17

申请人： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Ying-Ching Shih ,  Weng-Jin Wu ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L21/30

CPC分类号： G07F17/3213 ,  B32B17/10 ,  B32B37/1207 ,  B32B37/182 ,  B32B37/185 ,  B32B2457/14 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

摘要： A composite carrier structure for manufacturing semiconductor devices is provided. The composite carrier structure utilizes multiple carrier substrates, e.g., glass or silicon substrates, coupled together by interposed adhesive layers. The composite carrier structure may be attached to a wafer or a die for, e.g., backside processing, such as thinning processes. In an embodiment, the composite carrier structure comprises a first carrier substrate having through-substrate vias formed therethrough. The first substrate is attached to a second substrate using an adhesive such that the adhesive may extend into the through-substrate vias.

摘要翻译： 提供了一种用于制造半导体器件的复合载体结构。 复合载体结构利用多个载体衬底，例如玻璃或硅衬底，通过插入的粘合剂层耦合在一起。 复合载体结构可以附接到晶片或模具，用于例如背面处理，例如变薄处理。 在一个实施例中，复合载体结构包括具有贯穿其中形成的贯通基板通孔的第一载体基板。 使用粘合剂将第一衬底附接到第二衬底，使得粘合剂可以延伸到贯穿衬底通孔中。

公开(公告)号：US20130199577A1

公开(公告)日：2013-08-08

申请号：US13369138

申请日：2012-02-08

申请人： I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

发明人： I-Ting Chen ,  Ying-Ching Shih ,  Szu Wei Lu ,  Jing-Cheng Lin

IPC分类号： B08B7/04 ,  B08B5/00 ,  B08B3/08 ,  B08B3/02 ,  B08B3/12

CPC分类号： H01L21/02041 ,  H01L21/4864 ,  H01L21/67028 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/81911 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/0401

摘要： A flux residue cleaning system includes first and second immersion chambers, first and second spray chambers, and a drying chamber. The first immersion chamber softens an outer region of a flux residue formed around microbumps interposed between a wafer and a die when the wafer is immersed in a first chemical. The first spray chamber removes the outer region of the flux residue when the wafer is impinged upon by a first chemical spray in order to expose an inner region of the flux residue. The second immersion chamber softens the inner region of the flux residue when the wafer is immersed in a second chemical. The second spray chamber removes the inner region of the flux residue when the wafer is impinged upon by a second chemical spray in order to clean the wafer to a predetermined standard. The drying chamber dries the wafer.

摘要翻译： 助焊剂残渣清洁系统包括第一和第二浸没室，第一和第二喷雾室以及干燥室。 当晶片浸入第一化学品中时，第一浸入室软化在介于晶片和管芯之间的微胶片周围形成的焊剂残余物的外部区域。 当晶片通过第一化学喷雾冲击以便暴露焊剂残余物的内部区域时，第一喷雾室除去焊剂残余物的外部区域。 当晶片浸入第二种化学品中时，第二浸入室软化助焊剂残余物的内部区域。 当晶片被第二化学喷雾冲击时，第二喷雾室去除焊剂残余物的内部区域，以便将晶​​片清洁至预定的标准。 干燥室干燥晶片。

公开(公告)号：US20110316147A1

公开(公告)日：2011-12-29

申请号：US12823851

申请日：2010-06-25

申请人： Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

发明人： Ying-Ching Shih ,  Jing-Cheng Lin ,  Wen-Chih Chiou ,  Shin-Puu Jeng ,  Chen-Hua Yu

IPC分类号： H01L23/488

CPC分类号： H01L21/76885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/13 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/11002 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/4007 ,  H05K2203/016 ,  H05K2203/025 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/16145 ,  H01L2924/00012

摘要： A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs) penetrate through the substrate. A first metal bump is in the at least one dielectric layer and electrically coupled to the plurality of TSVs. A second metal bump is over the at least one dielectric layer. A die is embedded in the at least one dielectric layer and bonded to the first metal bump.

摘要翻译： 一种装置包括：插入件，其包括基板; 以及衬底上的至少一个电介质层。 多个穿通基板通孔（TSV）穿透基板。 第一金属凸块在至少一个电介质层中并电耦合到多个TSV。 第二金属凸块在至少一个电介质层的上方。 模具嵌入在至少一个电介质层中并结合到第一金属凸块。

公开(公告)号：US20060088255A1

公开(公告)日：2006-04-27

申请号：US10971462

申请日：2004-10-22

申请人： Enboa Wu ,  Ying-Ching Shih

发明人： Enboa Wu ,  Ying-Ching Shih

IPC分类号： G02B6/42

CPC分类号： G02B6/4215 ,  G02B6/29361 ,  G02B6/2938 ,  G02B6/4204

摘要： Disclosed is an optical transceiver subassembly module for multiplexing and demultiplexing a plurality of channels of different wavelengths. The optical subassembly module includes a transmitter optical subassembly (TOSA) and a receiver optical subassembly (ROSA). For a TOSA, the optical signals emitted by four laser diodes of different wavelengths are combined into a multiplexed optical signal, through respective thin film filters and lenses, which is then coupled onto an optical fiber after passing through a focusing lens. For a ROSA, the input optical signal on the receiver end of the optical fiber is separated into multiple optical wavelength signals, through respective thin film filters and lenses, which are then registered by respective photo detectors. This optical subassembly module with compact star-shaped optics design, active and passive alignments is able to attain high coupling efficiency between optical signals and the optical fiber.

摘要翻译： 公开了一种用于对多个不同波长的信道进行复用和解复用的光收发器子组件模块。 光学子组件模块包括发射机光学子组件（TOSA）和接收机光学子组件（ROSA）。 对于TOSA，由不同波长的四个激光二极管发射的光信号通过相应的薄膜滤光器和透镜组合成复用光信号，然后通过聚焦透镜耦合到光纤上。 对于ROSA，光纤的接收端上的输入光信号通过相应的薄膜滤光器和透镜分离成多个光波长信号，然后由相应的光电检测器记录。 这种具有紧凑的星形光学设计，有源和无源对准的光学子组件模块能够实现光信号和光纤之间的高耦合效率。