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    Surface mountable power supply module and method of manufacture therefor
    12.
    发明公开
    Surface mountable power supply module and method of manufacture therefor 审中-公开
    OberflächenmontierbaresStromversorgungsmodul und Verfahren zu dessen Herstellung

    公开(公告)号：EP1043920A2

    公开(公告)日：2000-10-11

    申请号：EP00302525.1

    申请日：2000-03-28

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Heinrich, Randy Thomas ,  Rozman, Allen Frank ,  Truong, Thang D. ,  Woods, William Lonzo, Jr.

    IPC: H05K3/34 ,  H05K1/16

    CPC classification number: H05K1/165 ,  H05K1/141 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10234 ,  H05K2201/10257 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49126

    Abstract: A surface mountable power supply and a method of manufacturing the power supply. In one embodiment, the power supply includes: (1) a substrate having opposing upper and lower conductive layers (2) a lower electrical component having a first lead mounted on a first pad on the lower conductive layer and subject to forces capable of detaching the lower electrical component from the substrate when the power supply passes through a reflow soldering process, (3) an upper electrical component having a second lead mounted on a second pad on the upper conductive layer, (4) a solder located proximate the first lead, the lower electrical component of a sufficiently low weight such that a surface tension of a liquid state of the solder is sufficient to maintain the lower electrical component in contact with the lower conductive layer as the power supply passes through the reflow soldering process, (5) a planar magnetic device mounted on the substrate, the planar magnetic device having windings formed from a portion of conductive traces on the upper and lower conductive layers and a core disposed through apertures of the substrate and proximate the windings and (6) an inter-substrate conductive mount, coupled to the lower conductive layer, composed of a material having a melting point above a solder reflow temperature and adapted to mount the power supply to an adjacent substrate and provide a conductive path therebetween, the conductive mount including first and second compliant solder joints at interfaces of the substrate and the adjacent substrate, respectively.

    Abstract translation: 一种可表面安装的电源及其制造方法。 在一个实施例中，电源包括：（1）具有相对的上和下导电层（2）的衬底，下电气部件具有安装在下导电层上的第一焊盘上的第一引线，并受到能够分离 当电源通过回流焊接工艺时，从基板上降低电气部件，（3）上部电气部件，其具有安装在上部导电层上的第二焊盘上的第二引线，（4）位于第一引线附近的焊料， 所述较低的电气部件具有足够低的重量，使得当电源通过回流焊接工艺时，焊料的液态的表面张力足以保持较低的电气部件与下导电层接触;（5） 安装在基板上的平面磁性装置，所述平面磁性装置具有由上和下导电层上的一部分导电迹线形成的绕组 以及通过所述衬底的孔并且靠近所述绕组设置的芯体，以及（6）衬底间导电安装件，其耦合到所述下导电层，所述衬底的导电层由熔点高于焊料回流温度的材料组成，并且适于安装所述功率 供应到相邻基板并在其间提供导电路径，导电安装座分别包括在基板和相邻基板的界面处的第一和第二柔性焊接点。

    CHIPKARTE, VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE
    13.
    发明公开
    CHIPKARTE, VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE 失效
    CHIPKARTE，VERBINDUNGSANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER CHIPKARTE

    公开(公告)号：EP0976104A2

    公开(公告)日：2000-02-02

    申请号：EP97914230.4

    申请日：1997-03-12

    Applicant: PAV Card GmbH

    Inventor： WILM, Robert

    IPC: G06K19/077

    CPC classification number: G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01077 ,  H05K1/0212 ,  H05K1/142 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/368 ,  H05K2201/0394 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10818 ,  H05K2201/10977 ,  H05K2203/0228 ,  H05K2203/0285 ,  H05K2203/107 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/01005

    Abstract: The invention concerns a smart card, a connection arrangement and a method of producing a smart card, a semiconductor chip located on a module being inserted into a recess (24) in a card carrier so as to be connected electrically and mechanically. According to a first feature of the invention, during the milling-out of the recess, a contact bump section is exposed (22, 23) such that a reliable connection is provided between the module and induction or antenna coil (11). According to a second and third feature, the required electrical contacts are produced by soldering and the required mechanical contacts are produced by heat-sealing or fusion adhesives. Furthermore, the adhesive is provided with conductive particles and is compressed when the connection is made, such that the necessary electrical contact is brought about. According to a fourth feature, a special reinforcement frame comprising insulating sections is provided. The reinforcement frame is used to increase mechanical stability and absorb torsion forces and stresses which can occur when the card is used. At the same time, the reinforcement frame permits easy contact with strip conductors inside the card, e.g. for elements which form an antenna for contactless data-transmission.

    Abstract translation: 本发明涉及智能卡，连接装置和制造智能卡的方法，位于模块上的半导体芯片被插入到卡片载体中的凹部（24）中，以便电和机械连接。 根据本发明的第一特征，在铣削凹槽期间，暴露接触凸块部分（22,23），使得在模块和感应或天线线圈（11）之间提供可靠的连接。 根据第二和第三特征，通过焊接产生所需的电触点，并且通过热密封或熔融粘合剂产生所需的机械触点。 此外，粘合剂设置有导电颗粒，并且在形成连接时被压缩，使得产生必要的电接触。 根据第四特征，提供了包括绝缘部分的特殊加强框架。 增强框架用于增加机械稳定性，并吸收使用卡时可能发生的扭转力和应力。 同时，加强框架允许容易地与卡内的带状导体接触，例如， 用于形成用于非接触式数据传输的天线的电感元件。

    Electrical devices
    15.
    发明公开
    Electrical devices 失效
    Elektrische Bauelemente

    公开(公告)号：EP0811993A2

    公开(公告)日：1997-12-10

    申请号：EP97202527.4

    申请日：1993-07-08

    Applicant: RAYCHEM CORPORATION

    Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming ,  Fang, Shou-Mean

    IPC: H01C1/14 ,  H05K1/18

    CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

    Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

    (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and
    (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element.
    Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

    Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可以弹性变形的端子。

    FEEDTHROUGH VIA CONNECTION METHOD AND APPARATUS
    17.
    发明公开
    FEEDTHROUGH VIA CONNECTION METHOD AND APPARATUS 失效
    方法和系统，用于连接通过。

    公开(公告)号：EP0638225A1

    公开(公告)日：1995-02-15

    申请号：EP94907837.0

    申请日：1994-01-18

    Applicant: MOTOROLA, INC.

    Inventor： OSTREM, Fred, E. ,  OCKEN, Alfred, G.

    IPC: H05K3 ,  H05K1

    CPC classification number: H05K3/44 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K3/4038 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977

    Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101). A solderable contact area (103), is located on the plate (101). Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109) is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. A quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

    Verfahren zur Herstellung elektrisch leitender Verbindungen an Leiterplatten
    20.
    发明公开
    Verfahren zur Herstellung elektrisch leitender Verbindungen an Leiterplatten 失效
    Verfahren zur Herstellung elektrisch leitender Verbindungen一个Leiterplatten。

    公开(公告)号：EP0535491A1

    公开(公告)日：1993-04-07

    申请号：EP92116098.2

    申请日：1992-09-21

    Applicant: Bodenseewerk Gerätetechnik GmbH

    Inventor： Neumann, Werner

    IPC: H05K3/36 ,  H01R9/09

    CPC classification number: H01R12/62 ,  H05K3/281 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/10666 ,  H05K2201/10977

    Abstract: Die Erfindung betrifft ein Verfahren zum Herstellen elektrisch leitender Verbindungen zwischen Leiterbahnen, die auf der Oberfläche einer als Träger dienenden starren Leiterplatte angeordnet sind und Leiterbahnen, die auf der Oberfläche einer als Träger dienenden biegsamen Folie angeordnet sind, wobei die Leiterbahnen im Bereich der herzustellenden Verbindungen Lötflächen aufweisen, mindestens eine von zwei gegenüberliegenden Lötflächen mit Lötplatte oder Lot beschichtet ist und die gegenüberliegenden Lötflächen unter Anwendung von Wärme und gegebenenfalls Druck miteinander verlötet werden.

    Abstract translation: 本发明涉及一种用于在导体轨道之间制造导电连接的方法，其布置在用作载体的刚性印刷电路板的表面上，并且布置在柔性膜的表面上的导体轨道，该柔性膜用作 载体，导体轨迹在待生产的连接区域中具有焊接表面，两个相对的焊接表面中的至少一个涂覆有焊料板或焊料，并且相对的焊接表面通过使用热量彼此焊接， 可能是压力。

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