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    Apparatus for providing controlled impedance in an electrical contact
    42.
    发明公开
    Apparatus for providing controlled impedance in an electrical contact 失效
    用于在电触点中提供受控阻抗的装置

    公开(公告)号：EP1037328A1

    公开(公告)日：2000-09-20

    申请号：EP00202137.6

    申请日：1996-02-07

    Applicant: JOHNSTECH INTERNATIONAL CORPORATION

    Inventor： Johnson, David A. ,  Kline, Eric V.

    IPC: H01R13/66 ,  H01L23/64

    CPC classification number: H01R13/2464 ,  H01L23/64 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R12/57 ,  H01R13/2407 ,  H01R13/6464 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6608 ,  H01R13/719 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/025 ,  H05K7/1092 ,  H05K2201/0792 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

    Abstract: The invention concerns a connector apparatus for transmitting a plurality of signals between a plurality of first terminals, for connection to a first device, and a corresponding plurality of second terminals, for connection to a second device, comprising a plurality of rigid contacts for electro-mechanically coupling the plurality of first terminals to the corresponding plurality of second terminals, predetermined ones of said plurality of contacts comprising: electrical active means for electrically affecting a corresponding one of the plurality of signals as the corresponding one of the plurality of signals is transmitted between the corresponding first terminal and the corresponding second terminals, wherein said electrically affecting means comprises a controlled impedance, wherein said controlled impedance comprises:

    (a) a ceramic substrate (202) having an outer surface;
    (b) a first conductive surface (204) deposited on a first portion of said outer surface, said first conductive surface being coupled to a corresponding one of the plurality of first terminals (158G);
    (c) a second conductive surface (206) deposited on a second portion of said outer surface, said second conductive portion not in electrical communication with said first conductive surface, said second conductive surface being coupled to a corresponding one of the plurality of second terminals (158H); and
    (d) a component (208) having a first terminal (210) and a second terminal (212), said first terminal being coupled to said first conductive surface and said second terminal being coupled to said second conductive surface, whereby the signal passes between said first conductive surface, said first terminal of the component, said second terminal of said component, and said second conductive surface.

    Abstract translation: 本发明涉及一种用于在多个第一端子之间传输多个信号以连接到第一设备的连接器装置以及用于连接到第二设备的相应的多个第二端子，所述连接器设备包括多个用于电 - 将所述多个第一端子机械地耦合到所述对应的多个第二端子，所述多个触点中的预定触点包括：电激活装置，用于在多个信号中的对应的一个信号在 相应的第一端子和相应的第二端子，其中所述电力影响装置包括受控阻抗，其中所述受控阻抗包括：（a）陶瓷衬底（202），其具有外表面; （b）沉积在所述外表面的第一部分上的第一导电表面（204），所述第一导电表面耦合到所述多个第一端子（158G）中相应的一个; （c）沉积在所述外表面的第二部分上的第二导电表面（206），所述第二导电部分不与所述第一导电表面电连通，所述第二导电表面耦合到所述多个第二端子中的相应一个 （158H）; 和（d）具有第一端子（210）和第二端子（212）的部件（208），所述第一端子连接到所述第一导电表面，所述第二端子连接到所述第二导电表面，由此信号通过 在所述第一导电表面，所述部件的所述第一端子，所述部件的所述第二端子和所述第二导电表面之间。

    High-frequency module
    43.
    发明公开
    High-frequency module 有权
    高频模块

    公开(公告)号：EP0977298A2

    公开(公告)日：2000-02-02

    申请号：EP99114940.2

    申请日：1999-07-30

    Applicant: Kyocera Corporation

    Inventor： Sawa, Yoshinobu, c/o Kyocera Corporation ,  Koriyama, Shinichi, c/o Kyocera Corporation ,  Kitazawa, Kenji, c/o Kyocera Corporation ,  Minamiue, Hidehiro, c/o Kyocera Corporation

    IPC: H01P1/04

    CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2224/05599 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H05K1/0219 ,  H05K1/0243 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09781 ,  H05K2201/10477 ,  H05K2201/1053 ,  H05K2201/10727 ,  H05K2203/1572 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

    Abstract: There is described a high-frequency module comprising a high-frequency device-mounting package and an external circuit board characterized in that said high-frequency device-mounting package (A) includes a dielectric substrate (1) having a first grounding layer (4) contained therein, said dielectric substrate (1) mounting a high-frequency device (2) on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines (3) connected to said high-frequency device (2), and having, formed on the other surface thereof, second high-frequency signal transmission lines (7) coupled to said first high-frequency signal transmission lines (3), said external circuit board (B) is constituted by a dielectric board (20) having third high-frequency signal transmission lines (25) and a second grounding layer (26), said third high-frequency signal transmission lines (25) being formed on one surface of said dielectric board (20), and said second grounding layer (26) being formed on the other surface of said dielectric board (20) or inside thereof; and said high-frequency device-mounting package (A) and said external circuit board (B) are arranged side by side, and the second high-frequency signal transmission lines (7) of the high-frequency device-mounting package (A) are electrically connected to the third high-frequency signal transmission lines (25) of the external circuit board (B) through linear electrically conducting members (31). The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

    Abstract translation: 描述了一种包括高频器件安装封装和外部电路板的高频模块，其特征在于，所述高频器件安装封装（A）包括具有第一接地层（4）的电介质衬底（1） ），所述电介质基板（1）在其一个表面上安装有高频装置（2），并且在其一个表面上形成有连接到所述高频装置（2）的第一高频信号传输线（3） 2）上，并且在其另一表面上形成有与所述第一高频信号传输线（3）耦合的第二高频信号传输线（7），所述外部电路板（B）由介电板 （20），其具有第三高频信号传输线（25）和第二接地层（26），所述第三高频信号传输线（25）形成在所述介电板（20）的一个表面上，并且所述第二高频信号传输线 接地层（ 26）形成在所述介电板（20）的另一个表面上或其内部; （A）和所述外部电路板（B）并排布置，并且所述高频器件安装封装（A）的所述第二高频信号传输线（7）与所述高频器件安装封装（A） 通过线状导电部件（31）与外部电路基板（B）的第三高频信号传输线路（25）电连接。 高频器件组装侧的第二高频信号传输线的图案可以容易地与外部电路板侧的第三高频信号传输线的图案对齐，从而有效地减少 线路连接部分的传输损耗。

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