公开(公告)号：EP1742520A1

公开(公告)日：2007-01-10

申请号：EP06013619.9

申请日：2006-06-30

Applicant: OMRON CORPORATION

Inventor： Yamamoto, Shingo c/o Omron Corporation ,  Ishibashi, Hiroyuki c/o Omron Corporation ,  Matsuda, Katsumi c/o Omron Corporation

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H01L23/49582 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0233 ,  H05K3/202 ,  H05K3/244 ,  H05K2201/086 ,  H05K2201/10909 ,  H01L2924/00

Abstract: A wiring board (lead frame) 10 has a configuration in which a high-frequency current suppression member 18 formed of a conductive soft magnetic film 18a having high magnetic permeability is provided in a near field (magnetic field dominant area) in a lead frame part (wiring part) 10a which can be a radiation noise source, preferably, in the periphery of the lead frame part 10a.

Abstract translation: 布线基板（引线框架）10具有这样的结构，即在引线框架部分的近场（磁场主导区域）中设置由具有高磁导率的导电软磁膜18a形成的高频电流抑制部件18 （布线部）10a，其优选地可以在引线框架部分10a的周围作为辐射噪声源。

公开(公告)号：EP1724831A2

公开(公告)日：2006-11-22

申请号：EP06009981.9

申请日：2006-05-15

Applicant: NEC Electronics Corporation

Inventor： Nomura, Yukio

IPC: H01L23/495

CPC classification number: H01L23/49582 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/181 ,  H05K3/244 ,  H05K3/341 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A an aspect of the present invention, a semiconductor device includes a lead frame having a lower base structure of oxygen free copper or copper-based alloy and having terminals; a semiconductor chip connected with the terminals of the lead frame; and a mold resin configured to cover the semiconductor chip. The lead frame has an exposed portion from the mold resin, and the exposed portion includes a diffusion prevention film formed on or above the lower base structure of the lead frame; and a Sn-Bi (tin-bismuth) film formed on the diffusion prevention film.

Abstract translation: 本发明的一个方面，一种半导体器件包括具有较低的无氧铜或铜基合金基底结构并具有端子的引线框架; 与引线框的端子连接的半导体芯片; 以及被配置为覆盖半导体芯片的模制树脂。 引线框架具有来自模制树脂的暴露部分，并且暴露部分包括形成在引线框架的下基座结构上或上的扩散防止膜; 和形成在扩散防止膜上的Sn-Bi（锡 - 铋）膜。

公开(公告)号：EP1715501A1

公开(公告)日：2006-10-25

申请号：EP05008912.7

申请日：2005-04-22

Applicant: DBK David + Baader GmbH

Inventor： Gschwind, Thomas ,  Bauer, Hans-Peter

IPC: H01H85/10

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H85/10 ,  H01H2085/0275 ,  H01H2085/0555 ,  H05K3/308 ,  H05K2201/10181 ,  H05K2201/10878 ,  H05K2201/10909

Abstract: Eine Schmelzsicherung für Leiterplattenmontage besitzt Anschlüsse, die mit Leiterbahnen auf der Leiterplatte elektrisch verbindbar sind, sowie mindestens eine leitfähige und schmelzbare Verbindung zwischen den Anschlüssen. Sie ist so gestaltet, dass sie kostengünstig einstückig aus Blech oder leitfähigem Kunststoff gefertigt werden kann.

Abstract translation: 保险丝具有可与印刷电路板的导电路径电连接的连接（3），其中在连接之间提供导电和易熔连接（2）。 保险丝制造为单件，并由材料制成。 板的熔点大于220摄氏度，但低于1085摄氏度。 连接可插入板的凹槽中。

公开(公告)号：EP1048392B1

公开(公告)日：2006-10-18

申请号：EP98959137.5

申请日：1998-12-09

Applicant: Hitachi, Ltd.

Inventor： SHIMOKAWA, Hanae, Production Engineering Res. Lab. ,  SOGA, Tasao, Production Engineering Res. Lab. ,  OKUDAIRA, Hiroaki, Production Engineering Res. Lab ,  ISHIDA, Toshiharu, Production Engineering Res. Lab ,  NAKATSUKA, Tetsuya, Production Engineering Res. ,  INABA, Yoshiharu, Semiconductor & Integr. Circuits ,  NISHIMURA, Asao, Semiconductor & Integr. Circuits

IPC: B23K1/20 ,  B23K35/26 ,  H05K3/34 ,  H01L23/50 ,  C22C13/02

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: A Pb-free solder-connected structure having a sufficiently large connection strength, featuring an interface that remains stable even after the passage of time, and maintaining sufficient wettability and resistance against whiskers, and an electronic device. Specifically, a Pb-free solder, characterized in that an Sn-Ag-Bi solder which is a representative Pb-free solder is connected to an electrode that has an Sn-Bi layer formed on the surface thereof. Bi concentration in the Sb-Bi layer is preferably 1 to 20 % by weight to obtain a sufficient degree of wettability. When a more reliable joint is required, the Cu layer is formed under the Sn-Bi layer to obtain a connection portion having a sufficiently large interfacial strength.

公开(公告)号：EP1622225A1

公开(公告)日：2006-02-01

申请号：EP05106937.5

申请日：2005-07-27

Applicant: Tyco Electronics AMP K.K.

Inventor： Yamagami, Hidehisa Tyco Electronics AMP K.K. ,  Nishida, Atsushi ,  Minikata, Masato ,  Kobayashi, Hiroshi ,  Furuyama, Ken Tyco Electronics AMP K.K.

IPC: H01R13/03 ,  H01R4/02

CPC classification number: H01R13/03 ,  H01R4/02 ,  H01R12/716 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10909

Abstract: A board-mount electrical connector (10) capable of maintaining favorable solderability of a connecting section (12e) of a terminal (12) over a long period, and preventing occurrence of a whisker in or on a bent section (12d) of the terminal (12) is provided. The electrical connector (10) includes a plurality of terminals (12) each having at one end a contact section (12b) which contacts a mating contact and having at the other end a connecting section (12e) which connects to a circuit board (20), and each having a bent section (12d) in a middle portion between the contact section (12b) and the connecting section (12e), and an insulating housing (11) which holds the plurality of terminals, and each terminal (12) has a bright tin-plated layer (12f) and a semi-bright tin plated layer (12g) formed on respective surfaces of the contact section (12b) and the connecting section (12e)such that the semi-bright tin-plated layer (12g) is thicker than the bright tin-plated layer (12f). The surface of the middle portion is not tin-plated.

Abstract translation: 本发明提供一种能够长期维持端子（12）的连接部（12e）的良好的焊接性，并且能够防止在端子的弯曲部（12d）内或其上发生晶须的板安装型电连接器（10） （12）。 电连接器（10）包括多个端子（12），每个端子在一端具有接触配合触点的接触部分（12b），并且在另一端具有连接到电路板（20）的连接部分（12e） ），并且在接触部（12b）和连接部（12e）之间的中间部分具有弯曲部（12d）;以及绝缘壳体（11），其保持多个端子，各端子（12） 具有在接触部分（12b）和连接部分（12e）的相应表面上形成的光亮镀锡层（12f）和半光亮锡镀层（12g），使得半光亮镀锡层（12g） 12g）比亮锡镀层（12f）厚。 中间部分的表面不镀锡。

公开(公告)号：EP1439397A2

公开(公告)日：2004-07-21

申请号：EP04005888.5

申请日：1995-11-15

Applicant: FormFactor, Inc.

Inventor： Khandros, Igor Y. ,  Mathieu, Gaetan L. ,  Eldridge, Benjamin N. ,  Grube, Gary W.

IPC: G01R31/316

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2201/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: A method of burning-in semiconductor devices, comprising permanently mounting a plurality of resilient contact structures on a plurality of unsingulated semiconductor devices on a semiconductor wafer; powering up at least a portion of the unsingulated semiconductor devices by making pressure connections to the resilient contact structures on the portion of the unsingulated semiconductor devices; and heating the semiconductor devices to a temperature of at least 150° C for less than 60 minutes.

Abstract translation: 一种烧入半导体器件的方法，包括将多个弹性接触结构永久性地安装在半导体晶片上的多个非绝缘半导体器件上; 通过与所述未弯曲的半导体器件的所述部分上的所述弹性接触结构进行压力连接来加电所述未调制的半导体器件的至少一部分; 并将半导体器件加热到至少150℃的温度少于60分钟。

公开(公告)号：EP1246305A3

公开(公告)日：2003-11-26

申请号：EP02007088.4

申请日：2002-03-27

Applicant: J.S.T. Mfg. Co., Ltd.

Inventor： Hosaka, Taiji, c/o J.S.T. Mfg. co., Ltd. ,  Miyasawa, Masaaki, c/o J.S.T. Mfg. co., Ltd.

IPC: H01R12/04 ,  H01R4/58 ,  H01R13/646 ,  H01R13/03 ,  H05K13/04 ,  H01R43/02

CPC classification number: H01R24/50 ,  H01R4/02 ,  H01R12/57 ,  H01R13/03 ,  H01R2103/00 ,  H05K3/3426 ,  H05K3/3442 ,  H05K13/0465 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/10909 ,  H05K2203/0425 ,  H05K2203/065 ,  H05K2203/1115 ,  Y02P70/613

Abstract: The objectives of the present invention include to mount an electric contact or an electric connector on a printed circuit board without conducting the soldering work, and to make mounting the electric contact on a printed circuit board by an automatic machine even when the electric contact is microminiaturized. The electric contact (100) using resin solder according to the present invention is connected to a printed circuit board (400), which has a conductor (410) being provided on a surface thereof. This electric contact (100) comprises a leg (110), which contacts the conductor (410) of the printed circuit board (400), and a connecting part (120), which is connected to the conductor of the counterpart member. At least a part of the leg (110), which contacts the conductor (410) of the printed circuit board (400), is made of a lead-free ultrahigh-conductive plastic being a conductive resin composite. The electric connector (C) comprises the electric contact (100) and an insulating housing (300), which holds the electric contact (100) so that the part of the leg (110), which contacts the conductor (410) of the printed circuit board (400), is exposed.

公开(公告)号：EP0297511B1

公开(公告)日：2003-10-08

申请号：EP88110305.5

申请日：1988-06-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LIMITED

Inventor： Sasame, Akira c/o Itami Works of Sumitomo ,  Sakanoue, Hitoyuki c/o Itami works of Sumitomo ,  Tekeuchi, Hisao c/o Itami works of Sumitomo ,  Miyake, Masaya c/o Itami works of Sumitomo ,  Yamakawa, Akira c/o Itami works of Sumitomo ,  Yushio, Yasuhisa c/o Itami works of Sumitomo ,  Akazawa, Hitoshi c/o Itami works of Sumitomo

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/14 ,  H01L23/08 ,  H01L23/10

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

公开(公告)号：EP1326079A2

公开(公告)日：2003-07-09

申请号：EP03003496.1

申请日：1999-12-02

Applicant: FORMFACTOR, INC.

Inventor： Eldridge, Benjamin N. ,  Grube, Gary W. ,  Mathieu, Gaetan L.

IPC: G01R1/073

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

Abstract translation: 提供探针卡（321）用于使电子部件与凸起的接触元件接触。 特别地，本发明对于使半导体晶片（310）与诸如弹簧的弹性接触元件（301）接触是有用的。 探针卡（321）设计成具有与晶片（310）上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器（324）制备成具有一侧的接触柱和相对侧上的端子。 具有弹簧触点（333,334）的插入器（325）将空间变压器（324）的相对侧上的触点（335）连接到探针卡（321）上的相应端子（332），该端子（332） 又连接到可连接到例如常规测试仪的测试装置的端子（331）。

公开(公告)号：EP0729652B1

公开(公告)日：2002-10-16

申请号：EP95901950.6

申请日：1994-11-16

Applicant: FormFactor, Inc.

Inventor： KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L.

IPC: H01R9/00 ,  H01R29/00 ,  B23K31/02 ,  H05K3/30 ,  H01L23/49 ,  H01L21/60 ,  H01L23/48 ,  H01L21/66 ,  H01L21/68 ,  H01L23/32

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.