公开(公告)号：EP2409189A1

公开(公告)日：2012-01-25

申请号：EP10706902.3

申请日：2010-01-21

申请人： U2t Photonics Ag

发明人： MATISS, Andreas ,  JACOB, Alexander ,  LEONHARDT, Christoph

IPC分类号： G02B6/42

CPC分类号： H05K1/0243 ,  G02B6/4201 ,  G02B6/4274 ,  H05K1/024 ,  H05K3/3421 ,  H05K2201/09909 ,  H05K2201/10121 ,  H05K2201/10977 ,  Y10T29/49144

摘要： The invention relates, among other things, to an assembly (10), comprising an electric conductive track carrier (20) and a component (30) arranged on the conductive track carrier. According to the invention, the component is a fiber-optoelectronic component and comprises: a housing (40), at least one electro-optic or optoelectronic component (50), at least one fiber-optic interface (60) connected to the electro-optic or optoelectronic component, and at least one electric interface (80) for connecting the component to the conductive track carrier, wherein the electric interface comprises at least one bent electric soldered connection element (100), the one end (110) of which is attached to a bottom connection section (120) of the housing bottom (125) and from there extends laterally outwardly such that the other end (130) of the soldered connection element – as viewed from above – protrudes laterally and is laterally soldered to the conductive track carrier outside of the outer housing contour (140), and wherein the soldered connection element is bent away from the bottom connection section such that the bottom connection section has a distance (A) from the conductive track carrier.

公开(公告)号：EP1937040B1

公开(公告)日：2011-02-23

申请号：EP07123279.7

申请日：2007-12-14

申请人： SIEMENS AKTIENGESELLSCHAFT

发明人： Kornbichler, Andreas ,  Nalezinski, Martin ,  Richter, Olaf ,  Ziroff, Andreas Dr.

IPC分类号： H05K1/02

CPC分类号： H05K1/0243 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3442 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/10371

公开(公告)号：EP2258022A1

公开(公告)日：2010-12-08

申请号：EP09722528.8

申请日：2009-03-17

申请人： Cheng, Shi ,  Kratz, Karl Henrik ,  Yousef, Hanna Ali

发明人： Cheng, Shi ,  Kratz, Karl Henrik ,  Yousef, Hanna Ali

IPC分类号： H01P11/00 ,  B81C1/00 ,  H01P3/12 ,  H05K1/02 ,  H05K3/40

CPC分类号： H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/037 ,  H05K2201/09618 ,  H05K2203/092 ,  H05K2203/1572 ,  Y10T29/49016

摘要： A substrate integrated waveguide (10) comprises a top conductive layer (14) and a bottom conductive layer (15) provided on either sides a substrate (11). At least one wall (12, 13) of conductive material is provided in the substrate (11) to define, together with the top and bottom layers (14, 15), the waveguide. The at least one wall (12, 13) comprise a multitude of thin conductive wires densely arranged close to each other in the substrate (11) and having respective short ends connected to the top and bottom layers (14, 15). The high number of wires per surface unit in the wall (12, 13) effectively prevent significant amount of power leakage through the wall (12, 13) during operation of the substrate integrated waveguide (10).

公开(公告)号：EP0991082B1

公开(公告)日：2010-11-24

申请号：EP99913681.5

申请日：1999-04-16

申请人： TDK Corporation ,  NOF CORPORATION

发明人： YAMADA, Toshiaki ,  HASEGAWA, Hiroaki ,  YASUKAWA, Yoshiyuki ,  ENDOU, Kenji ,  YAMADA, Michihisa ,  MORIYA, Yasuo ,  YAMADA, Tomiho ,  ITO, Tetsuya

IPC分类号： H01B3/18 ,  H01B3/44 ,  C08K3/00

CPC分类号： H01B3/442 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0373 ,  H05K2201/0209

摘要： Intended to provide a composite dielectric material composition which, in the high frequency band, is capable of having an arbitrary dielectric constant over a relatively wide range thereof and has a low dielectric loss tangent, and a film, a substrate, electronic parts and moldings produced using the composition. A composite dielectric material composition comprising a filler and a heat-resistant polymer material of low dielectric property which comprises a resin composition composed of at least one resin having a weight average absolute molecular weight of 1,000 or more, wherein the sum of the number of carbon atoms and hydrogen atoms accounts for 99 % or more of the number of the total atoms of the resin composition and some or all of the molecules constituting the resin are chemically bonded to one another, and a film, a substrate, electronic parts and moldings produced using the composite dielectric material composition are provided.

公开(公告)号：EP2181978A1

公开(公告)日：2010-05-05

申请号：EP09170261.3

申请日：2009-09-15

申请人： Micro Systems Engineering GmbH

发明人： Schwanke, Dieter ,  Harnack, Mirco ,  Bittner, Achim ,  Schmid, Ulrich

IPC分类号： C04B41/91 ,  C03C15/00 ,  H01Q1/38 ,  H05K1/03 ,  C03C17/00

CPC分类号： C03C15/00 ,  C03C17/02 ,  C03C17/28 ,  C03C17/34 ,  C03C17/38 ,  C03C2218/113 ,  C03C2218/116 ,  C03C2218/119 ,  C03C2218/31 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/00844 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2203/1147 ,  C04B41/4582 ,  C04B41/5023 ,  C04B41/5353 ,  C04B41/4539 ,  C04B41/5022 ,  C04B41/4537 ,  C04B41/522 ,  C04B41/488 ,  C04B35/00

摘要： Die vorliegende Erfindung betrifft ein keramisches Substratmaterial mit einer ersten Schicht und mindestens einer weiteren, zumindest bereichsweise auf der ersten Schicht angeordneten zweiten Schicht, wobei die erste Schicht aus mindestens einer ersten Komponente aus einem kristallinen Keramikmaterial und/oder einem Glasmaterial als Matrix besteht, wobei die erste Schicht eine zweite Komponente aus einem weiteren kristallinen Keramikmaterial enthält, wobei Mantelbereiche der Kristalle und/oder Kristallagglomerate der zweiten Komponente mindestens bereichsweise derart herausgeätzt sind, dass eine Hohlraumstruktur, vorzugsweise in Form einer Poren- und/oder Röhrenstruktur vorliegt. Um auf die Hohlraumstruktur Dünnschicht-Strukturen aufbringen zu können, ist die zweite Schicht als Versiegelungsschicht ausgebildet, welche die Oberfläche der ersten Schicht in den Bereichen versiegelt, auf denen sie angeordnet ist.

摘要翻译： 陶瓷基板材料包括第一层（10）和在区域方式的方式，在设置在第一层上的第二层，其中第一组分的第一层besteht由结晶陶瓷材料和/或玻璃材料制成，并且包含一第二 由另外的结晶陶瓷材料的组成部分。 结晶和/或第二组分的附聚物结晶的侧面区域中蚀刻出到区域方式的方式，如此做了一个空腔结构（12）呈现的孔结构和/或管状结构的形式。 第二层形成为（14）的密封层。 陶瓷基板材料包括第一层（10）和在区域方式的方式，在设置在第一层上的第二层，其中第一组分的第一层besteht由结晶陶瓷材料和/或玻璃材料制成，并且包含一第二 由另外的结晶陶瓷材料的组成部分。 结晶和/或第二组分的附聚物结晶的侧面区域中蚀刻出到区域方式的方式，如此做了一个空腔结构（12）呈现的孔结构和/或管状结构的形式。 第二层形成为密封第一层的表面上，具有5微米的层厚度，包含有机材料，陶瓷材料和/或玻璃材料的密封层（14）：如聚酰亚胺，并通过屏幕产生 印刷过程中，旋涂法或溶胶 - 凝胶过程。 蚀刻的空腔结构仅呈现在所述第一层的预定区域和在所述第一层的预定深度一直达到。 第一层与由低温共烧陶瓷技术的第三层一起生产。 金属化层存在的密封层上，通过薄层技术产生并从空心与中空空腔结构中至多在区域permeably运行区域而不腔结构。 一个独立的claimsoft包括用于制造陶瓷基板材料的方法。

公开(公告)号：EP1615267A4

公开(公告)日：2010-02-10

申请号：EP04727676

申请日：2004-04-15

申请人： DENKI KAGAKU KOGYO KK

发明人： YONEMURA NAOMI ,  YASHIMA KATUNORI ,  TSUJIMURA YOSHIHIKO ,  ISHIKURA HIDENORI ,  SAIKI TAKASHI

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L23/14 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H01L25/04 ,  H01L25/16 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/44

CPC分类号： H01L23/66 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05666 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48472 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48666 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48766 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/4886 ,  H01L2224/48866 ,  H01L2224/4911 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/8546 ,  H01L2224/85466 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19051 ,  H01L2924/30105 ,  H05K1/0224 ,  H05K1/024 ,  H05K1/025 ,  H05K3/0061 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09745 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/4876 ,  H01L2224/4866

公开(公告)号：EP2145337A1

公开(公告)日：2010-01-20

申请号：EP08718986.6

申请日：2008-04-04

申请人： MBDA UK Limited

发明人： DUNLEAVY, Michael ,  HAQ, Sajad ,  DAVIES, Joseph, Maurice ,  REW, Jason, Karl

IPC分类号： H01B3/00

CPC分类号： B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

摘要： A bulk dielectric material comprises a solid composite material comprising a solid matrix material and a plurality of filler elements distributed within the matrix material. The bulk dielectric material has, at a frequency greater than 1 MHz, (i) a permittivity having a real part of magnitude greater than 10 and an imaginary part of magnitude less than 3, and (ii) an electrical breakdown strength greater than 5 kV/mm and has a minimum dimension greater than 2 mm.

公开(公告)号：EP2141198A1

公开(公告)日：2010-01-06

申请号：EP08752084.7

申请日：2008-04-25

申请人： Hitachi Chemical Company, Ltd.

发明人： FUJIMOTO, Daisuke ,  MIZUNO,Yasuyuki ,  DANJOUBARA, Kazutoshi ,  MURAI, Hikari

IPC分类号： C08L15/00 ,  B32B15/08 ,  C08J5/24 ,  C08K3/00 ,  C08L71/12 ,  H05K1/03

CPC分类号： H05K1/0353 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2274/00 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/726 ,  B32B2457/08 ,  C08J3/246 ,  C08J5/24 ,  C08J2387/00 ,  C08K3/013 ,  C08L9/00 ,  C08L15/00 ,  C08L21/00 ,  C08L47/00 ,  C08L71/00 ,  C08L71/12 ,  H05K1/024 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10T428/31696 ,  C08L2666/14

摘要： Provided is a process for producing a thermosetting resin varnish from which a printed circuit board can be produced wherein the printed circuit board has excellent dielectric properties in a high frequency band and can significantly reduce the transmission loss, and exhibits excellent heat resistance after moisture absorption and excellent thermal expansion properties and satisfies the metallic foil peeling strength.
A process for producing a thermosetting resin varnish containing a thermosetting resin composition, which contains an uncured semi-IPN composite, an inorganic filler, and a saturated thermoplastic elastomer, wherein the process comprises the steps of: (i) preliminary reacting (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified and (C) a crosslinking agent, in the presence of (A) a polyphenylene ether to obtain a polyphenylene ether-modified butadiene prepolymer which is an uncured semi-IPN composite; (ii) mixing together (D) an inorganic filler and (E) a saturated thermoplastic elastomer to obtain a mixture; and (iii) mixing together the obtained mixture and the polyphenylene ether-modified butadiene prepolymer, a resin varnish, a prepreg, and a metal-clad laminate provided using the same.

摘要翻译： 提供的是用于生产由哪一种热固性树脂清漆的印刷电路板可以worin印刷电路板来制造具有在高频带优异的介电性能，并且可以显着地减少传输损耗，并表现出优良的耐热性吸湿后的处理和 优异的热膨胀性能和SATIS外资企业金属箔剥离强度。 一种用于制造热固性树脂清漆含有热固性树脂组合物，其含有无机填料中的未固化的半IPN型复合，和饱和型热塑性弹性体，worin处理方法包括以下步骤：（i）初步使（B）一 丁二烯聚合物其中含有其分子在其侧链上具有1,2-乙烯基的1,2-丁二烯单元，的40％或更多中和所有未化学修饰的和（C）交联剂，在 （A）聚苯醚的存在下，得到聚苯醚改性丁二烯预聚物的所有这是在未固化的半IPN型复合; （II）（D）无机填料和（E）的饱和热塑性弹性体，得到混合物混合在一起; 和（iii）所获得的混合物和所述聚苯醚改性丁二烯预聚物，树脂清漆，预浸料坯和使用该提供的覆金属层压板一起混合。

公开(公告)号：EP2022825A1

公开(公告)日：2009-02-11

申请号：EP07742911.6

申请日：2007-05-07

申请人： Polyplastics Co., Ltd.

发明人： KUNIMOTO, Eiki ,  MIYAZAKI, Hirotaka

IPC分类号： C08L45/00 ,  B32B15/08 ,  C08L53/02 ,  C08L65/00

CPC分类号： C08L65/00 ,  C08F279/00 ,  C08L23/0823 ,  C08L53/02 ,  H05K1/024 ,  H05K1/0353 ,  H05K3/181 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/09118 ,  C08L2666/24 ,  C08L2666/04

摘要： A material is provided for high-frequency use electronic parts, in which the material has dielectric properties which make the material suitable for use in a high-frequency region while maintaining various properties of a cycloolefin resin. It further has suitability for plating, high adhesion to metal deposit layers, and superior impact resistance. Also provided is a high-frequency use electronic part which includes the material. The material is a composition including a cycloolefin resin (A) and an elastomer ingredient (B) in which the blending proportion of the cycloolefin resin (A) to the elastomer ingredient (B) and the proportion of unsaturated double bonds contained in the elastomer ingredient (B) are in specific ranges.

摘要翻译： 提供了一种用于高频用途电子部件，其中，所述材料具有介电性能，这使得该材料适合用于在高频区域，同时保持环状烯烃系树脂的各种性质的材料。 它具有用于电镀另外的适宜性，高粘合性的金属沉积层，以及优异的耐冲击性。 所以提供了一种高频用途电子部分，其包括所述材料。 所述材料是包含环状烯烃系树脂（A）的组合物和弹性体成分（B），其中包含在所述弹性体成分的环状烯烃系树脂（A）与弹性体成分（B）和不饱和双键的比例的配合比例 （B）是在特定范围内。

公开(公告)号：EP1698016B1

公开(公告)日：2008-09-03

申请号：EP04815964.4

申请日：2004-12-23

申请人： MOLEX INCORPORATED

发明人： BRUNKER, David, L.

IPC分类号： H01P1/04

CPC分类号： H05K1/0219 ,  H01P3/02 ,  H05K1/024 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09236

摘要： A reduced-cross-sectional area, triad transmission line is formed by plating or metallizing surface area of a substrate, along the edge of a slot cut through the substrate. The cross-sectional area of such conductors that faces each other is reduced, reducing the signal coupling between them when they are carrying high-frequency signals. An intervening ground plane between them is provided by metallization on the slot bottom that is held at ground potential.