公开(公告)号：JP2007242743A

公开(公告)日：2007-09-20

申请号：JP2006060432

申请日：2006-03-07

Applicant: Hitachi Ltd ,  株式会社日立製作所

Inventor： NAKATSUKA TETSUYA ,  SERIZAWA KOJI

IPC: H01L23/50

CPC classification number: H01L23/49537 ,  H01L23/3107 ,  H01L23/49579 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/19041 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10848 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To solve the problem that a flow process executed after a reflow soldering process causes a warp of a board, solder remelting, etc., due to heat from flow soldering, thus leading to the separation of an electronic component. SOLUTION: A semiconductor device includes a semiconductor chip having a plurality of electrodes, a plurality of leads connected electrically to the electrodes of the semiconductor chip via bonding wires, and a resin on which the semiconductor chip is mounted. The leads is composed of two or more kinds of leads different in rigidity. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了解决在回流焊接过程之后执行的流程过程由于来自流动焊接的热而引起板的翘曲，焊料重熔等问题，从而导致电子 零件。 解决方案：半导体器件包括具有多个电极的半导体芯片，通过接合线电连接到半导体芯片的电极的多个引线以及安装半导体芯片的树脂。 引线由两种或更多种刚性不同的引线组成。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP3939467B2

公开(公告)日：2007-07-04

申请号：JP22917099

申请日：1999-08-13

Applicant: フォームファクター, インコーポレイテッド

Inventor： アイゴアー・ワイ・カンドロス ,  ゲタン・エル・マシュー

IPC: H01L21/60 ,  H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

公开(公告)号：JP2006040842A

公开(公告)日：2006-02-09

申请号：JP2004223418

申请日：2004-07-30

Applicant: Toyota Motor Corp ,  Tyco Electronics Amp Kk ,  タイコエレクトロニクスアンプ株式会社 ,  トヨタ自動車株式会社

Inventor： YAMAGAMI HIDEHISA ,  FURUYAMA TAKESHI ,  NISHIDA ATSUSHI ,  NAMIKATA MASATO ,  KOBAYASHI HIROSHI

IPC: H01R13/03

CPC classification number: H01R13/03 ,  H01R4/02 ,  H01R12/716 ,  H01R43/0256 ,  H05K3/3447 ,  H05K2201/10909

Abstract: PROBLEM TO BE SOLVED: To provide a substrate mounted type electric connector capable of maintaining good solderability of a connection part of a terminal for a long period and preventing the occurrence of a whisker in a bent part of a terminal. SOLUTION: This electric connector is provided with a plurality of terminals 12 having a contact part 12b contacting with a mating contact at one end and a connection part 12e to be connected with a circuit board at the other end and having bent parts 12d at the intermediate segment between the contact part 12b and the connection part 12e, and an insulating housing 11 holding the plurality of terminals 12. A gloss tin plating layers 12f and a semigloss tin plating layer 12g are formed on each surface of the contact part 12b and the connection part 12e except the surface of the intermediate segment of each terminal 12 so that the semigloss tin plating layer 12g is thicker than the gloss tin plating layers 12f. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够长期保持端子的连接部分的良好可焊性并防止在端子的弯曲部分中发生晶须的基板安装型电连接器。 解决方案：该电连接器设置有多个端子12，其具有与一端的配合触点接触的接触部分12b和与另一端的电路板连接的连接部分12e，并且具有弯曲部分12d 在接触部12b和连接部12e之间的中间部分以及保持多个端子12的绝缘壳体11.在接触部12b的每个表面上形成光泽锡镀层12f和半镀锡层12g 以及除了每个端子12的中间段的表面之外的连接部12e，使得半导体镀锡层12g比光泽锡镀层12f厚。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP3727540B2

公开(公告)日：2005-12-14

申请号：JP2000585681

申请日：1999-12-02

Applicant: フォームファクター,インコーポレイテッド

Inventor： エルドリッジ，ベンジャミン，エヌ ,  グルーブ，ゲーリー，ダブリュー ,  マシュー，ゲータン，エル

IPC: G01R31/26 ,  B23K20/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: B23K20/004 ,  B23K2201/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.

公开(公告)号：JP2005252313A

公开(公告)日：2005-09-15

申请号：JP2005162980

申请日：2005-06-02

Applicant: Formfactor Inc ,  フォームファクター,インコーポレイテッド

Inventor： KHANDROS IGOR Y ,  GETAN L MATTHEW

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

CPC classification number: H05K7/1069 ,  B23K2201/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor package assembly having an improved contact structure. SOLUTION: A semiconductor assembly 611 includes; a substrate 612 made of an insulating material which has conductive contact pads formed on its first surface and second surface; a plurality of semiconductor devices 612 having contact pads opposite to the contact pads on the first and second surfaces of the substrate 612; a spring contact structure 626 for electrically interconnecting the contact pads of the semiconductor devices 612 and the contact pads held by the substrate 612 and for supporting the semiconductor devices at positions spaced from the surface of the substrate 612 such that the semiconductor devices 612 are placed on the first and second planes in parallel each other which are both sides of the substrate 612; and a contact means 616 held by the substrate 612 for forming an electrical contact to the semiconductor devices 612 through the contact structure 626. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供具有改进的接触结构的半导体封装组件。 解决方案：半导体组件611包括： 由绝缘材料制成的基板612，其具有形成在其第一表面和第二表面上的导电接触焊盘; 具有与衬底612的第一和第二表面上的接触焊盘相对的接触焊盘的多个半导体器件612; 弹簧接触结构626，用于将半导体器件612的接触焊盘和由衬底612保持的接触焊盘电互连，并用于将半导体器件支撑在与衬底612的表面隔开的位置处，使得半导体器件612放置在 第一平面和第二平面彼此是基板612的两侧; 以及由衬底612保持的接触装置616，用于通过接触结构626形成与半导体器件612的电接触。版权所有：（C）2005，JPO＆NCIPI

公开(公告)号：JP3622462B2

公开(公告)日：2005-02-23

申请号：JP34681197

申请日：1997-12-16

Applicant: 株式会社日立製作所

Inventor： 英恵 下川 ,  哲也 中塚 ,  弘明 奥平 ,  太佐男 曽我 ,  寿治 石田 ,  吉治 稲葉 ,  朝雄 西村

IPC: B23K1/00 ,  B23K35/00 ,  B23K35/26 ,  C22C13/02 ,  H01L23/50 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2201/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn-Ag-Bi alloy solder is applied to an electrode through an Sn-Bi alloy layer. The Sn-Bi alloy, preferably, comprises 1 to 20 wt% Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn-Bi alloy layer thereby obtaining an enough bonding strength.

公开(公告)号：JP2003318524A

公开(公告)日：2003-11-07

申请号：JP2002118905

申请日：2002-04-22

Applicant: Nec Corp ,  日本電気株式会社

Inventor： MOMOKAWA HIROKI

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: PROBLEM TO BE SOLVED: To inexpensively prevent peeling of a land even when lead-free solder is used. SOLUTION: A wiring board is provided with a substrate 11 having a through hole 12, a first conductive film 13 coating the internal surface of the hole 12, and the land 15 formed on the surface of the substrate 11 around the opening of the hole 12 and composed of a second conductive film connected to the first conductive film 13. The wiring board is also provided with circuit wiring 16 formed on the surface of the substrate 11 and connected to the land 15, a protective film 17 covering the wiring 16, and a coating member 18 coating at least part of the outer peripheral edge 15A of the land 15. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：即使使用无铅焊料，也能廉价地防止焊盘的剥离。 解决方案：布线板设置有具有通孔12的基板11，涂覆孔12的内表面的第一导电膜13和形成在基板11的表面周围的开口 孔12，由与第一导电膜13连接的第二导电膜构成。布线基板还设置有电路布线16，其形成在基板11的表面上并与凸台15连接，保护膜17覆盖布线 16，以及涂覆部分18，其涂覆了陆地15的外周边缘15A的至少一部分。版权所有（C）2004，JPO

公开(公告)号：JP3376970B2

公开(公告)日：2003-02-17

申请号：JP25387099

申请日：1999-09-08

Applicant: 株式会社村田製作所

Inventor： 卓二 中川 ,  徹 渡辺 ,  康信 米田 ,  義一 高木

IPC: H01G4/12 ,  H01G2/14 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G4/232 ,  H01G2/065 ,  H01G2/14 ,  H01G4/005 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10909 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ceramic electronic component includes at least one component body having two end faces opposing each other and side faces connecting the two end faces, and terminal electrodes formed on the component body. Each of the terminal electrodes extends from each end face to edge portions of each side face of the component body. Each of the terminal electrodes includes a metal layer formed on at least each end face of the component body, a conductive resin layer for covering at least portions of the side faces of the component body, and a metal plating film covering the outer surface of the terminal electrode. The conductive resin layer extends from the metal layer including the edge of the metal layer to the portions of the side faces, and includes a conductive resin containing metal powder and resin. The thickness of the conductive resin layer above the side faces is at least about 10 mum.

公开(公告)号：JPS5929414A

公开(公告)日：1984-02-16

申请号：JP12753383

申请日：1983-07-13

Applicant: Corning Glass Works

Inventor： BIRII BOBU UOOMATSUKU

IPC: H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G4/2325 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2201/10909 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：JP2018511937A

公开(公告)日：2018-04-26

申请号：JP2017545252

申请日：2015-12-21

Applicant: エプコス アクチエンゲゼルシャフト ,  EPCOS AG

Inventor： コイニ,マルクス ,  コンラッド,ユルゲン ,  リンナー,フランツ ,  プフ,マルクス ,  シュタットローバー,モニカ ,  キュゲール,ゲオルク ,  ビッペル,トーマス

IPC: H01G4/38 ,  H01G2/04 ,  H01G4/228

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: 複数の部分体(2)と、これらの部分体(2)が上に配置されている台座(3)と、部分体(2)を担体(13)に電気的に接続するための少なくとも1つの接続用接点(4、5)とを有する電気素子(1)を示す。さらに、1つまたは複数の部分体(2)を備えた電気素子(1)の製造方法を示す。