公开(公告)号：US08026616B2

公开(公告)日：2011-09-27

申请号：US12352056

申请日：2009-01-12

申请人： Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

发明人： Soon-yong Hur ,  Mo-rae Kim ,  Hyeong-seob Kim

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

摘要翻译： 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

公开(公告)号：US08129826B2

公开(公告)日：2012-03-06

申请号：US12355587

申请日：2009-01-16

申请人： Sang-Wook Park ,  Min-Young Son ,  Hyeong-Seob Kim

发明人： Sang-Wook Park ,  Min-Young Son ,  Hyeong-Seob Kim

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity.

摘要翻译： 提供了具有再分配层的半导体封装装置。 该装置包括至少一个或多个半导体芯片，保护半导体芯片的封装部分和支撑半导体芯片的支撑部件。 该设备还包括延伸到包装部分外部的外部端子，重新分配层安装在半导体芯片和支撑部分之间，并且包括再分配路径，第一信号发送单元和第二信号发送单元。 所述第一信号发送单元将从所述半导体芯片生成的电信号发送到所述再分配层的再分配路径，并且所述第二信号发送单元将所述电信号从所述再分配路径发送到所述外部终端。 因此，可以减小半导体封装装置的尺寸和厚度，并且可以简化工艺以提高生产率。

公开(公告)号：US07420129B2

公开(公告)日：2008-09-02

申请号：US11048870

申请日：2005-02-03

申请人： Hyeong-Seob Kim

发明人： Hyeong-Seob Kim

IPC分类号： H01R12/04

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85611 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/385 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.

摘要翻译： 公开了半导体封装中使用的半导体器件和半导体器件的制造方法和装置。 半导体器件可以包括具有一个或多个支撑层的主体，可以形成为多个内部连接焊盘的多个金属线和多个外部连接焊盘，最外面的树脂层图案形成在 主体，并且包括暴露多个外连接焊盘的多个开口，以及设置在多个金属线和最外层树脂层图案之间的金属氧化物层。 多个内外连接垫可以形成在主体的表面上。

公开(公告)号：US07105919B2

公开(公告)日：2006-09-12

申请号：US10982361

申请日：2004-11-03

申请人： Hyeong-Seob Kim

发明人： Hyeong-Seob Kim

IPC分类号： H01L23/48 ,  H01L23/12 ,  H01L23/053

CPC分类号： H01L23/36 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package having an ultra thin thickness and a method of manufacturing the same are provided. The ultra thin semiconductor package comprises a circuit board in which a through hole is formed. A semiconductor chip is located in the through hole and a connecting element electrically connects the circuit board and the semiconductor chip. An epoxy molding compound (EMC) covers the semiconductor chip and the connecting element and a supporter having a thermal expansion coefficient similar to the EMC is attached inside the through hole on a lower surface of the semiconductor chip. An external connecting terminal is attached to at least one side of the circuit board. Because of the inclusion of the supporter, warpage of the semiconductor package resulting from the curing of the EMC is prevented.

摘要翻译： 提供了具有超薄厚度的半导体封装及其制造方法。 超薄半导体封装包括其中形成有通孔的电路板。 半导体芯片位于通孔中，并且连接元件电连接电路板和半导体芯片。 环氧树脂模塑料（EMC）覆盖半导体芯片，并且连接元件和具有类似于EMC的热膨胀系数的支撑件被安装在半导体芯片的下表面上的通孔的内部。 外部连接端子连接到电路板的至少一侧。 由于包含支撑体，防止了由固化EMC引起的半导体封装的翘曲。

公开(公告)号：US20050285230A1

公开(公告)日：2005-12-29

申请号：US11048870

申请日：2005-02-03

申请人： Hyeong-Seob Kim

发明人： Hyeong-Seob Kim

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/58 ,  H05K3/28 ,  H05K3/38

CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/83951 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85611 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/385 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method and apparatus of manufacturing a semiconductor device and the semiconductor device used in a semiconductor package are disclosed. The semiconductor device may include a main body having one or more supporting layers, a plurality of metal wires that may be formed as a plurality of inner connection pads and a plurality of outer connection pads, an outermost resin layer pattern formed on the surface of the main body, and including a plurality of openings exposing the plurality of outer connection pads, and a metal oxide layer disposed between the plurality of metal wires and the outermost resin layer pattern. The plurality of inner and outer connection pads may be formed on a surface of the main body.

摘要翻译： 公开了半导体封装中使用的半导体器件和半导体器件的制造方法和装置。 半导体器件可以包括具有一个或多个支撑层的主体，可以形成为多个内部连接焊盘的多个金属线和多个外部连接焊盘，最外面的树脂层图案形成在 主体，并且包括暴露多个外连接焊盘的多个开口，以及设置在多个金属线和最外层树脂层图案之间的金属氧化物层。 多个内外连接垫可以形成在主体的表面上。

公开(公告)号：US06448661B1

公开(公告)日：2002-09-10

申请号：US10059932

申请日：2002-01-28

申请人： Hyeong-Seob Kim ,  Sa-Yoon Kang ,  Myung-Kee Chung ,  In-Ku Kang ,  Kwan-Jai Lee

发明人： Hyeong-Seob Kim ,  Sa-Yoon Kang ,  Myung-Kee Chung ,  In-Ku Kang ,  Kwan-Jai Lee

IPC分类号： H01L2348

CPC分类号： H01L24/83 ,  H01L23/481 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A three-dimensional, multi-chip package with chip selection pads formed at the chip-level and a manufacturing method thereof are provided. The three-dimensional, multi-chip package is formed by stacking a number (N) of semiconductor integrated circuit chips. Each chip comprises an integrated circuit die, a chip selection terminal, (N−1) chip selection pads, an insulation layer, (N−1) metal wirings, upper connection terminals, lower connection terminals, and trench wirings. The chip selection terminal of each chip is separated from the chip selection of the other chips by the chip selection pads formed at the chip-level.

摘要翻译： 提供了一种具有在芯片级形成的芯片选择焊盘的三维多芯片封装及其制造方法。 通过堆叠多个（N）个半导体集成电路芯片来形成三维多芯片封装。 每个芯片包括集成电路管芯，芯片选择端子（N-1）芯片选择焊盘，绝缘层，（N-1）金属布线，上连接端子，下连接端子和沟槽布线。 每个芯片的芯片选择端通过在芯片级形成的芯片选择焊盘与其他芯片的芯片选择分离。

公开(公告)号：US20110193228A1

公开(公告)日：2011-08-11

申请号：US12916677

申请日：2010-11-01

申请人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

发明人： Hae-jung Yu ,  Hyeong-seob Kim ,  Jong-ho Lee ,  Jin-woo Park

IPC分类号： H01L23/50

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/1225 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2203/1316

摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.

摘要翻译： 模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。 印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过 印刷电路板。 密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

公开(公告)号：US20090189271A1

公开(公告)日：2009-07-30

申请号：US12352056

申请日：2009-01-12

申请人： Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

发明人： Soon-yong HUR ,  Mo-rae Kim ,  Hyeong-seob Kim

IPC分类号： H01L23/498

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.

摘要翻译： 一种印刷电路板，其使用大容量半导体芯片，半导体封装和卡的封装以及使用半导体封装的系统提供高可靠性。 半导体封装包括具有第一表面和第二表面的衬底，安装在衬底的第一表面上的半导体芯片，设置在衬底的第二表面上的至少一个焊盘，并且其周边包括多个第一组弧 覆盖基板的第二表面并包括暴露至少一个焊盘的至少一个开口的掩模层和设置在至少一个焊盘上的至少一个外部端子，其中所述至少一个焊盘的一部分被覆盖 并且所述至少一个平台的另一部分的侧壁被所述至少一个开口暴露，并且所述至少一个开口的圆周包括多个第二组弧，并且所述最外弧的半径 多个第一组弧之间的距离等于多个第二组弧之中的最外弧的半径。

公开(公告)号：US20060249823A1

公开(公告)日：2006-11-09

申请号：US11458640

申请日：2006-07-19

申请人： Hyeong-Seob KIM

发明人： Hyeong-Seob KIM

IPC分类号： H01L23/495

CPC分类号： H01L23/36 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package having an ultra thin thickness and a method of manufacturing the same are provided. The ultra thin semiconductor package comprises a circuit board in which a through hole is formed. A semiconductor chip is located in the through hole and a connecting element electrically connects the circuit board and the semiconductor chip. An epoxy molding compound (EMC) covers the semiconductor chip and the connecting element and a supporter having a thermal expansion coefficient similar to the EMC is attached inside the through hole on a lower surface of the semiconductor chip. An external connecting terminal is attached to at least one side of the circuit board. Because of the inclusion of the supporter, warpage of the semiconductor package resulting from the curing of the EMC is prevented.

摘要翻译： 提供了具有超薄厚度的半导体封装及其制造方法。 超薄半导体封装包括其中形成有通孔的电路板。 半导体芯片位于通孔中，并且连接元件电连接电路板和半导体芯片。 环氧树脂模塑料（EMC）覆盖半导体芯片，并且连接元件和具有类似于EMC的热膨胀系数的支撑件被安装在半导体芯片的下表面上的通孔的内部。 外部连接端子连接到电路板的至少一侧。 由于包含支撑体，防止了由固化EMC引起的半导体封装的翘曲。

公开(公告)号：US5898226A

公开(公告)日：1999-04-27

申请号：US770248

申请日：1996-12-20

申请人： Ki-Kwon Jeong ,  Hyeong-Seob Kim

发明人： Ki-Kwon Jeong ,  Hyeong-Seob Kim

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/316 ,  H01L21/321

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/78301 ,  H01L2224/8503 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L24/45 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753

摘要： A semiconductor chip is provided comprising a semiconductor substrate having determined circuit elements on it, a surface-smoothing layer deposited on the substrate, a bonding pad formed on the smoothing layer and connected electrically to the circuit elements, a passivation layer formed on the surface-smoothing layer, the passivation layer having a window for exposing a part of the bonding pad, and a second metal layer having a same height as the passivation layer and occupying peripheral parts of the window to form a reduced bonding windows for the bonding pad.

摘要翻译： 提供一种半导体芯片，包括其上具有确定的电路元件的半导体衬底，沉积在衬底上的表面平滑层，形成在平滑层上并与电路元件电连接的焊盘，形成在表面平滑层上的钝化层， 所述钝化层具有用于暴露所述焊盘的一部分的窗口，以及与所述钝化层具有相同高度的第二金属层，并占据所述窗口的周边部分以形成所述接合焊盘的减小的接合窗口。