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15 条记录 (耗时 0.019 秒)

    Through-hole structure and printed circuit board including the through-hole structure
    3.
    发明授权
    Through-hole structure and printed circuit board including the through-hole structure 有权
    通孔结构和印刷电路板包括通孔结构

    公开(公告)号：US06486414B2

    公开(公告)日：2002-11-26

    申请号：US09921245

    申请日：2001-08-01

    申请人： Kaoru Kobayashi ,  Hiroyuki Mori ,  Kimihiro Yamanaka

    发明人： Kaoru Kobayashi ,  Hiroyuki Mori ,  Kimihiro Yamanaka

    IPC分类号： H05K111

    CPC分类号： H05K1/0222 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/09809

    摘要： The present invention provides a through-hole structure for connecting a connector to a printed circuit board, the through-hole structure comprising a signal through-hole having a conductive layer therein for supplying a signal to the printed circuit board, power through-holes having a conductive layer therein for supplying power to the printed circuit board, and dielectric constant adjusting portions formed among the signal through-hole and the power through-holes. Moreover, the present invention provides a printed circuit board having the above-described through-hole structure formed therein.

    摘要翻译： 本发明提供一种用于将连接器连接到印刷电路板的通孔结构，该通孔结构包括其中具有用于向印刷电路板提供信号的导电层的信号​​通孔，具有用于向印刷电路板提供信号的电力通孔， 用于向印刷电路板供电的导电层，以及形成在信号通孔和电源通孔之间的介电常数调节部。 此外，本发明提供一种其中形成有上述通孔结构的印刷电路板。

    Method of making substrate member having electrical lines and apertured insulating film
    9.
    发明授权
    Method of making substrate member having electrical lines and apertured insulating film 失效
    制造具有电线和多孔绝缘膜的基片部件的方法

    公开(公告)号：US5517756A

    公开(公告)日：1996-05-21

    申请号：US247538

    申请日：1994-05-23

    申请人： Masaharu Shirai ,  Kimihiro Yamanaka

    发明人： Masaharu Shirai ,  Kimihiro Yamanaka

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34 ,  H05K3/02

    CPC分类号： H01L23/5386 ,  H01L21/4846 ,  H05K3/3452 ,  H01L2924/0002 ,  H05K1/117 ,  H05K2201/0989 ,  H05K2201/099 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.

    摘要翻译： 在衬底构件（例如电路板）中，在覆盖形成在衬底11上的电线（12）的绝缘膜（14）中形成多个开口（15），衬垫构成（接触）部分（13） 所选择的电线被暴露。 在一个示例中，焊盘构造部分（即将要发生最终连接的焊盘的部分，例如通过焊料发生到半导体器件）被设置为具有小于对应的尺寸的第一尺寸（例如，长度） 尺寸原始长度。 薄膜开口也被设定为具有比垫构成部分的对应尺寸大的容许尺寸的另一尺寸。 因此，与相应的衬垫相比，开口的尺寸足够大，以便确保在衬底构件的制造期间可能发生的至少两个（例如，X和Y）方向上的膜定位偏差的有效的公差补偿。

    Substrate member having electric lines and apertured insulating film
    10.
    发明授权
    Substrate member having electric lines and apertured insulating film 失效
    具有电线和多孔绝缘膜的基片部件

    公开(公告)号：US5252781A

    公开(公告)日：1993-10-12

    申请号：US859750

    申请日：1992-03-30

    申请人： Masaharu Shirai ,  Kimihiro Yamanaka

    发明人： Masaharu Shirai ,  Kimihiro Yamanaka

    IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34 ,  H05K1/00

    CPC分类号： H01L23/5386 ,  H01L21/4846 ,  H05K3/3452 ,  H01L2924/0002 ,  H05K1/117 ,  H05K2201/0989 ,  H05K2201/099 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： In a substrate member (e.g., circuit board), a plurality of openings (15) are formed in an insulating film (14) which covers electric lines (12) formed on a substrate 11, with pad constructing (contacting) portions (13) of selected ones of the electric lines being exposed. In one example, the pad constructing portion (that portion of the pad to which final connection is to occur, e.g., by solder to a semiconductor device), is set to a first dimension (e.g., length) having a dimension less than a corresponding dimension of the original length. The film openings are also set to another dimension having an allowance size larger than a corresponding dimension of the pad constructing portion. The opening is thus of sufficiently large size in comparison to the respective pad being exposed so as to assure effective tolerance compensation for film positioning deviations in at least two (e.g., X and Y) directions as might occur during production of the substrate member.