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    Remote optical engine for virtual reality or augmented reality headsets
    2.
    发明授权
    Remote optical engine for virtual reality or augmented reality headsets 有权

    公开(公告)号：US10802285B2

    公开(公告)日：2020-10-13

    申请号：US16292705

    申请日：2019-03-05

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Rajesh Katkar

    IPC: G09G5/00 ,  G02B27/01

    Abstract: A virtual reality/augmented reality (VR/AR) headset system (including the capability for one or both of virtual reality and augmented reality) includes a remote optical engine. The remote disposition of the optical engine removes many or all of the components of the VR/AR headset system that add weight, heat, and other characteristics that can add to user discomfort in using the system from the headset. An electronic image is received and/or generated remotely at the optical engine, and is transmitted optically from the remote location to the headset to be viewed by the user. One or more optical waveguides may be used to transmit the electronic image to one or more passive displays of the headset, from the remote optical engine.

    Fan-out wafer level package with resist vias
    3.
    发明授权
    Fan-out wafer level package with resist vias 有权

    公开(公告)号：US10593563B2

    公开(公告)日：2020-03-17

    申请号：US15873218

    申请日：2018-01-17

    Applicant: Invensas Corporation

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Rajesh Katkar

    IPC: H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L21/683 ,  H01L23/31

    Abstract: Fan-out wafer level packages with resist vias are provided. In an implementation, an example wafer level process or panel fabrication process includes adhering a die to a carrier, applying a temporary resist layer over the die and the carrier, developing the resist layer to form channels or spaces, filling the channels or the spaces with a molding material, removing the remaining resist to create vias in the molding material, and metalizing the vias in the molding material to provide conductive vias for the microelectronics package. The methods automatically create good via and pad alignment. In another implementation, an example process includes adhering a die to a carrier, applying a permanent resist layer over the die and the carrier, developing the resist layer to form vias in the resist layer, and metalizing the vias in the remaining resist of the permanent resist layer to provide conductive vias for the microelectronics package. Assemblies may be constructed with the semiconductor dies face-up or face-down. One or more redistribution layers (RDLs) may be built on one or both sides of an assembly with resist vias.

    Micro mechanical anchor for 3D architecture
    8.
    发明授权
    Micro mechanical anchor for 3D architecture 有权

    公开(公告)号：US09832887B2

    公开(公告)日：2017-11-28

    申请号：US13961217

    申请日：2013-08-07

    Applicant: Invensas Corporation

    Inventor： Liang Wang ,  Ilyas Mohammed ,  Belgacem Haba

    IPC: H05K3/40 ,  H05K3/42 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K3/42 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H05K1/0296 ,  H05K1/11 ,  Y10T29/49204

    Abstract: Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

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