公开(公告)号：US20180025967A1

公开(公告)日：2018-01-25

申请号：US15715725

申请日：2017-09-26

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/50 ,  H01L25/10 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/13 ,  H01L25/18

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1047 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/15151 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15172 ,  H01L2924/15182 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

公开(公告)号：US09461015B2

公开(公告)日：2016-10-04

申请号：US14270885

申请日：2014-05-06

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H05K1/11 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L27/146

CPC分类号： H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

摘要翻译： 微电子组件包括具有第一和第二表面的电介质元件，第一和第二孔在第一和第二表面之间延伸并且限定第一和第二孔之间的第一表面的中心区域，第一和第二微电子元件以及从 在第一和第二微电子元件的相应前表面处暴露在中央区域的中心端子的触点。 第一微电子元件的前表面可面向电介质元件的第二表面。 第二微电子元件的前表面可面对第一微电子元件的后表面。 第二微电子元件的触点可突出超过第一微电子元件的边缘。 至少第一和第二引线可以将中心端子的第一中心端子与第一和第二微电子元件中的每一个电互连。

公开(公告)号：US08759982B2

公开(公告)日：2014-06-24

申请号：US13950912

申请日：2013-07-25

申请人： Tessera, Inc.

发明人： Richard Dewitt Crisp ,  Belgacem Haba ,  Wael Zohni

IPC分类号： H01L23/52

CPC分类号： H01L23/48 ,  G11C5/06 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/157 ,  H01L2924/15786 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package may have a plurality of terminals disposed at a face thereof which are configured for connection to at least one external component. e.g., a circuit panel. First and second microelectronic elements can be affixed with packaging structure therein. A first electrical connection can extend from a respective terminal of the package to a corresponding contact on the first microelectronic element, and a second electrical connection can extend from the respective terminal to a corresponding contact on the second microelectronic element, the first and second connections being configured such that a respective signal carried by the first and second connections in each group is subject to propagation delay of the same duration between the respective terminal and each of the corresponding contacts coupled thereto.

摘要翻译： 微电子封装可以具有设置在其面上的多个端子，其被配置为连接到至少一个外部部件。 例如电路板。 第一和第二微电子元件可以用其中的包装结构固定。 第一电连接可以从封装的相应端子延伸到第一微电子元件上的相应触点，并且第二电连接可以从相应端子延伸到第二微电子元件上的相应触点，第一和第二连接是 被配置为使得由每个组中的第一和第二连接承载的相应信号在相应的终端和与其耦合的每个对应的触点之间经历相同持续时间的传播延迟。

公开(公告)号：US20130127062A1

公开(公告)日：2013-05-23

申请号：US13741890

申请日：2013-01-15

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC分类号： H01L23/492

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

公开(公告)号：US20130056870A1

公开(公告)日：2013-03-07

申请号：US13668974

申请日：2012-11-05

申请人： TESSERA, INC.

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/498

CPC分类号： H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

摘要： A microelectronic assembly can include a substrate having oppositely-facing first and second surfaces and a first aperture extending between the first and second surfaces, a first microelectronic element having a surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, signal leads connected to contacts of the second microelectronic element and extending through the first aperture to at least some of a plurality of electrically conductive elements on the substrate, and at least one power regulation component having active circuit elements therein disposed between the first surface of the substrate and the front surface of the second microelectronic element. The first microelectronic element can have another surface remote from the surface of the first microelectronic element, and an edge extending between the surfaces thereof. The contacts of the second microelectronic element can project beyond the edge of the first microelectronic element.

摘要翻译： 微电子组件可以包括具有相对面对的第一和第二表面的基板和在第一和第二表面之间延伸的第一孔，第一微电子元件具有面向第一表面的表面，第二微电子元件具有面向第一和第二表面的前表面 微电子元件，信号引线连接到第二微电子元件的触点并且延伸穿过第一孔至衬底上的多个导电元件中的至少一些，并且至少一个功率调节元件具有其中的有源电路元件， 基板的表面和第二微电子元件的前表面。 第一微电子元件可以具有远离第一微电子元件的表面的另一表面，以及在其表面之间延伸的边缘。 第二微电子元件的触点可突出超过第一微电子元件的边缘。

公开(公告)号：US20150243631A1

公开(公告)日：2015-08-27

申请号：US14679735

申请日：2015-04-06

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L25/065 ,  H01L23/04 ,  H01L23/31 ,  H01L23/00 ,  H01L23/482

CPC分类号： H01L25/0652 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4822 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/48265 ,  H01L2224/49109 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/386 ,  H01L2924/00 ,  H01L2224/7826 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A microelectronic package includes a subassembly including a first substrate and first and second microelectronic elements having contact-bearing faces facing towards oppositely-facing first and second surfaces of the first substrate and each having contacts electrically connected with the first substrate. The contact-bearing faces of the first and second microelectronic elements at least partially overlie one another. Leads electrically connect the subassembly with a second substrate, at least portions of the leads being aligned with an aperture in the second substrate. The leads can include wire bonds extending through an aperture in the first substrate and joined to contacts of the first microelectronic element aligned with the first substrate aperture. In one example, the subassembly can be electrically connected with the second substrate using electrically conductive spacer elements.

摘要翻译： 微电子封装包括包括第一基板和第一和第二微电子元件的子组件，所述第一和第二微电子元件具有面向第一基板的相对面向的第一和第二表面的接触轴承面，并且每个具有与第一基板电连接的触点。 第一和第二微电子元件的接触面至少部分地彼此覆盖。 引线将子组件与第二衬底电连接，引线的至少部分与第二衬底中的孔对齐。 引线可以包括延伸穿过第一基板中的孔并且连接到与第一基板孔对准的第一微电子元件的触点的引线键合。 在一个示例中，子组件可以使用导电间隔元件与第二衬底电连接。

公开(公告)号：US20150221617A1

公开(公告)日：2015-08-06

申请号：US14689346

申请日：2015-04-17

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC分类号： H01L25/065 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

摘要翻译： 微电子组件可以包括具有第一和第二表面的基底，每个第一表面和第二表面各自沿第一和第二横向方向延伸，沿第二方向延伸的周边边缘，在第一和第二表面之间延伸的第一和第二开口以及第二表面的周边区域 在周边边缘和其中一个开口之间延伸。 组件还可以包括具有面向第一表面的前表面的第一微电子元件，与其相对的后表面以及在前表面和后表面之间延伸的边缘。 组件还可以包括具有面向第一微电子元件的后表面的前表面并突出超过第一微电子元件的边缘的第二微电子元件。 组件还可以包括在第二表面处暴露的多个端子，至少一个端子至少部分地设置在周边区域内。

公开(公告)号：US09013033B2

公开(公告)日：2015-04-21

申请号：US13741890

申请日：2013-01-15

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp ,  Ilyas Mohammed ,  Frank Lambrecht

IPC分类号： H01L23/498 ,  H01L23/492 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/31

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/492 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/09 ,  H01L24/32 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/06155 ,  H01L2224/06156 ,  H01L2224/0912 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/50 ,  H01L2224/73215 ,  H01L2224/73219 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

摘要翻译： 微电子组件可以包括具有第一和第二表面的基底，每个第一表面和第二表面各自沿第一和第二横向方向延伸，沿第二方向延伸的周边边缘，在第一和第二表面之间延伸的第一和第二开口以及第二表面的周边区域 在周边边缘和其中一个开口之间延伸。 组件还可以包括具有面向第一表面的前表面的第一微电子元件，与其相对的后表面以及在前表面和后表面之间延伸的边缘。 组件还可以包括具有面向第一微电子元件的后表面的前表面并突出超过第一微电子元件的边缘的第二微电子元件。 组件还可以包括在第二表面处暴露的多个端子，至少一个端子至少部分地设置在周边区域内。

公开(公告)号：US20140239513A1

公开(公告)日：2014-08-28

申请号：US14270885

申请日：2014-05-06

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L25/065

CPC分类号： H01L25/065 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/14618 ,  H01L2223/6611 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48096 ,  H01L2224/4824 ,  H01L2224/48477 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49174 ,  H01L2224/4945 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.

摘要翻译： 微电子组件包括具有第一和第二表面的电介质元件，第一和第二孔在第一和第二表面之间延伸并且限定第一和第二孔之间的第一表面的中心区域，第一和第二微电子元件以及从 在第一和第二微电子元件的相应前表面处暴露在中央区域的中心端子的触点。 第一微电子元件的前表面可面向电介质元件的第二表面。 第二微电子元件的前表面可面对第一微电子元件的后表面。 第二微电子元件的触点可突出超过第一微电子元件的边缘。 至少第一和第二引线可以将中心端子的第一中心端子与第一和第二微电子元件中的每一个电互连。

公开(公告)号：US20140042644A1

公开(公告)日：2014-02-13

申请号：US14058908

申请日：2013-10-21

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L25/07

CPC分类号： H01L25/071 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32245

摘要： A microelectronic assembly can include a substrate having an aperture extending between first and second surfaces thereof, the substrate having substrate contacts at the first surface and terminals at the second surface. The microelectronic assembly can include a first microelectronic element having a front surface facing the first surface, a second microelectronic element having a front surface facing the first microelectronic element, and leads electrically connecting the contacts of the second microelectronic element with the terminals. The second microelectronic element can have contacts exposed at the front surface thereof beyond an edge of the first microelectronic element. The first microelectronic element can be configured to regenerate at least some signals received by the microelectronic assembly at the terminals and to transmit said signals to the second microelectronic element. The second microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function.

摘要翻译： 微电子组件可以包括具有在其第一和第二表面之间延伸的孔的衬底，衬底在第一表面具有衬底触点，在第二表面具有端子。 微电子组件可以包括具有面向第一表面的前表面的第一微电子元件，具有面向第一微电子元件的前表面的第二微电子元件，以及将第二微电子元件的触点与端子电连接的引线。 第二微电子元件可以具有在其前表面处暴露于第一微电子元件的边缘之外的触点。 第一微电子元件可以被配置为在端子处再生由微电子组件接收的至少一些信号，并将所述信号传输到第二微电子元件。 第二微电子元件可以体现更多数量的有源器件以提供比任何其他功能的存储器阵列功能。