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    Powder supply apparatus and plating system
    1.
    发明授权
    Powder supply apparatus and plating system 有权

    公开(公告)号：US12116687B2

    公开(公告)日：2024-10-15

    申请号：US17722879

    申请日：2022-04-18

    申请人： EBARA CORPORATION

    发明人： Shao Hua Chang ,  Jumpei Fujikata

    IPC分类号： C25D21/16 ,  C25D17/00 ,  C25D17/02 ,  C25D21/14 ,  C25D21/18

    CPC分类号： C25D21/16 ,  C25D17/00 ,  C25D17/02 ,  C25D21/14 ,  C25D21/18

    摘要： There is provided a powder supply apparatus that prevents powder from scattering as much as possible. There is provided the powder supply apparatus that supplies a powder containing a metal used for a plating to a plating solution. This powder supply apparatus includes a plating solution tank, a feed pipe, a gas supply line, and a spiral-air-flow-generating component. The plating solution tank is configured to house the plating solution. The feed pipe is configured to feed the powder into the plating solution tank. The gas supply line is configured to supply a gas. The spiral-air-flow-generating component is configured to receive the gas from the gas supply line to generate a spiral air flow heading toward the plating solution tank inside the feed pipe.

    WORKPIECE PLATING AND RINSE APPARATUS AND METHOD
    3.
    发明公开
    WORKPIECE PLATING AND RINSE APPARATUS AND METHOD 审中-公开

    公开(公告)号：US20240271314A1

    公开(公告)日：2024-08-15

    申请号：US18167755

    申请日：2023-02-10

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Wen-Hao CHENG ,  Hsuan-Chih CHU ,  Yen-Yu CHEN ,  Zong-Kun LIN

    IPC分类号： C25D21/08 ,  C25D17/02

    CPC分类号： C25D21/08 ,  C25D17/02

    摘要： The present disclosure is directed to a fluid head that is configured to eject a first fluid (e.g., a liquid state fluid) and a second fluid (e.g., a gaseous state fluid). The fluid head is movable in a rotatable-fashion and a translatable-fashion such that the fluid head may be utilized to increase a speed and decrease a period of time for cleaning and drying a workpiece after an electro-chemical polishing (ECP) process or step. The fluid head may also be utilized to increase a speed and decrease a period of time for beveling an edge of a conductive layer on the workpiece. The present disclosure is also directed to methods for cleaning and drying the workpiece as well as beveling the conductive layer of the workpiece utilizing the fluid head.

    PLATING DEVICE
    6.
    发明公开
    PLATING DEVICE 审中-公开

    公开(公告)号：US20240003040A1

    公开(公告)日：2024-01-04

    申请号：US18037157

    申请日：2021-10-25

    申请人： MITOMO SEMICON ENGINEERING CO., LTD.

    发明人： YUJI UCHIUMI

    IPC分类号： C25D17/02 ,  C25D17/10 ,  C25D17/00 ,  C25D21/14

    CPC分类号： C25D17/02 ,  C25D17/10 ,  C25D17/002 ,  C25D21/14

    摘要： Provided is a plating process that enables merits of an insoluble anode to be sufficiently enjoyed in a jet type plating equipment. Also provided is a plating equipment having a plating tank including an opening part; a solution supply piping; an insoluble anode; and an diaphragm, an diaphragm outer peripheral end being fixed to a plating tank inner wall, a through-hole being provided in an diaphragm center, a hole peripheral end of the through-hole being fixed to the solution supply piping, the diaphragm being arranged so as to be inclined upward in an outer circumferential direction from the solution supply piping. A silicon ring is firmly fixed to each of the outer peripheral end of the diaphragm and a hole edge of the through-hole of the diaphragm. The solution supply piping supplies the plating solution to an upper catholyte chamber in the plating tank, the upper catholyte chamber being formed by the diaphragm and the placed object to be plated. An annular flow passage including a solution ejection hole in an upper part thereof is provided in an outer circumference of the solution supply piping, and a lower anolyte chamber solution is supplied from the solution ejection hole to a lower anolyte chamber in the plating tank, the lower anolyte chamber being formed below the diaphragm, whereby a flow that moves from around the through-hole of the diaphragm toward the outer circumferential direction of the diaphragm is formed in the lower piping isolation chamber solution.

    Paddle chamber with anti-splashing baffles
    8.
    发明授权
    Paddle chamber with anti-splashing baffles 有权

    公开(公告)号：US11795566B2

    公开(公告)日：2023-10-24

    申请号：US17071806

    申请日：2020-10-15

    申请人： Applied Materials, Inc.

    发明人： Nolan L. Zimmerman

    IPC分类号： C25D17/02 ,  C25D21/10 ,  H01L21/288

    CPC分类号： C25D17/02 ,  C25D21/10 ,  H01L21/2885

    摘要： Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a vessel. The electroplating systems may include at least one of baffle positioned in the plating chamber. The at least one baffle may define a plurality of slots. The at least one baffle may be configured to limit or prevent fluid from splashing the rotor or the plating chamber during operation of the plating chamber.

    Plating apparatus
    10.
    发明授权
    Plating apparatus 有权

    公开(公告)号：US11725297B2

    公开(公告)日：2023-08-15

    申请号：US17504127

    申请日：2021-10-18

    申请人： EBARA CORPORATION

    发明人： Naoki Shimomura ,  Mizuki Nagai

    IPC分类号： C25D17/00 ,  C25D17/10 ,  C25D17/02

    CPC分类号： C25D17/10 ,  C25D17/007 ,  C25D17/02

    摘要： A plating apparatus including a thief electrode that can be suitably maintained is provided. The plating apparatus includes a substrate holder holding a substrate, a thief electrode supporter supporting a thief electrode to be disposed outside the substrate, a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment, a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank.