公开(公告)号：US07015590B2

公开(公告)日：2006-03-21

申请号：US10825199

申请日：2004-04-16

Applicant: Se-young Jeong ,  Nam-seog Kim ,  Oh-se Yong ,  Soon-bum Kim ,  Sun-young Park ,  Ju-hyun Lyu ,  In-young Lee

Inventor： Se-young Jeong ,  Nam-seog Kim ,  Oh-se Yong ,  Soon-bum Kim ,  Sun-young Park ,  Ju-hyun Lyu ,  In-young Lee

IPC: H01L21/461 ,  H01L21/469

CPC classification number: H01L24/13 ,  B23K3/0607 ,  B23K3/0623 ,  H01L21/2885 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/13012 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/243 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/048 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract translation: 在布置在半导体芯片上的接触焊盘和布置在安装基板上的球垫之间形成加强焊料凸块连接器结构。 半导体芯片包括从中间层的表面向上延伸的至少一个增强突起。 安装基板包括从球垫向上延伸的至少一个加强突起，来自芯片和基板的突起被嵌入在焊料凸块连接器内。 在一些构造中，来自接触垫和球垫的加强突起的尺寸和布置成具有重叠的下部。 这些重叠部分可采取各种各样的构造，其允许突起重叠而不彼此接触，包括针阵列以及周围和被包围的元件的组合。 在每种构造中，加强突起将倾向于抑制裂纹形成和/或裂纹扩展，从而提高可靠性。

公开(公告)号：US20060049519A1

公开(公告)日：2006-03-09

申请号：US11211764

申请日：2005-08-26

Applicant: Tetsuya Otsuki

Inventor： Tetsuya Otsuki

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/243 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A semiconductor device, comprises: a carrier substrate in which a semiconductor chip is mounted; and a land formed in the carrier substrate and arranged in a region different from the mounting face of the semiconductor chip, wherein a coarse face, the surface roughness of which is 20 through 100 μm, is formed in a bonding face of the land.

Abstract translation: 一种半导体器件，包括：其中安装有半导体芯片的载体基板; 以及形成在所述载体基板中并且布置在与所述半导体芯片的安装面不同的区域中的区域，其中在所述焊盘的接合面中形成表面粗糙度为20-100μm的粗糙面。

公开(公告)号：US20060022341A1

公开(公告)日：2006-02-02

申请号：US10902446

申请日：2004-07-28

Applicant: Jiun Sir ,  Eng Goh

Inventor： Jiun Sir ,  Eng Goh

IPC: H01L29/40 ,  H01L21/44

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/423 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2203/0733 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments include interconnect of electrically conductive material with a contact surface, and a dielectric layer overlying the contact surface with a trench and via in the dielectric layer, the via extending to the contact surface. An interlock material is in the via with an interlock opening extending through the interlock material and into the interconnect. A layer of electroless material is on the base of the trench and the surfaces of the via, interlock material, and interlock opening. An subsequent interconnect is formed on the electroless material, in the trench, via, and interlock openings. The structure can be repeated to form a stack or column of interconnects that resist delamination.

Abstract translation: 实施例包括导电材料与接触表面的互连以及覆盖接触表面的电介质层，其中沟槽和电介质层中的通孔延伸到接触表面。 互锁材料在通孔中，具有延伸穿过互锁材料并进入互连件的互锁开口。 无电解材料层位于沟槽的底部和通孔，互锁材料和互锁开口的表面上。 在无电解材料，沟槽，通孔和互锁开口中形成随后的互连。 可以重复该结构以形成抵抗分层的互连的堆叠或列。

公开(公告)号：US20060019418A1

公开(公告)日：2006-01-26

申请号：US10896808

申请日：2004-07-22

Applicant: John Tellkamp

Inventor： John Tellkamp

IPC: H01L21/66

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0005 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/162 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure design is evaluated to determine whether a volume of last solidification for the solder is centrally located with respect to the die pad and is located at or near an interface of the solder and the die pad. If the last solidification volume is centrally located and is located at or near the interface of the solder and the die pad, and if the die pad is delaminated from the die, the structure design is modified so that less metal of the heat sink member is centrally located than before the modifying.

Abstract translation: 提供了一种降低在使用焊料将散热构件附接到裸片焊盘期间用于结构设计的集成电路管芯封装中的管芯焊盘从管芯剥离的可能性的方法。 评估结构设计的样品结构以确定焊料的最后凝固体积是否相对于芯片焊盘位于中心位置，并且位于焊料和管芯焊盘的界面处或附近。 如果最后一个凝固体位于中心位置并且位于焊料和管芯焊盘的界面处或附近，并且如果管芯焊盘从模具分层，则结构设计被修改，使得散热构件的金属少于 位于中心位置比修改前。

公开(公告)号：US20050275090A1

公开(公告)日：2005-12-15

申请号：US11147158

申请日：2005-06-08

Applicant: Taibo Nakazawa

Inventor： Taibo Nakazawa

IPC: H01L21/60 ,  H01L23/48 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/321 ,  H05K2201/09745 ,  H05K2201/10484 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A chip-component-mounted device comprises a print wiring board or lead frame, an electrically conductive adhesive and a chip component, said chip component being mounted on said print wiring board or lead frame through said electrically conductive adhesive, said chip component having a corner part, a ridgeline of said corner part facing a connected part side of said print wiring board or lead frame, an angle made by a face adjacent to said ridgeline and a face of said connected part being acute.

Abstract translation: 芯片部件安装的装置包括印刷线路板或引线框架，导电粘合剂和芯片部件，所述芯片部件通过所述导电粘合剂安装在所述印刷线路板或引线框架上，所述芯片部件具有角部 所述角部的脊线面对所述印刷布线板或引线框架的连接部分侧，由与所述棱线相邻的面形成的角度和所述连接部分的表面是锐角的。

公开(公告)号：US06974909B2

公开(公告)日：2005-12-13

申请号：US10443789

申请日：2003-05-23

Applicant: Junichi Tanaka ,  Hiroyuki Takubo ,  Shigenobu Abe

Inventor： Junichi Tanaka ,  Hiroyuki Takubo ,  Shigenobu Abe

IPC: B42D15/10 ,  G06K17/00 ,  G06K19/07 ,  G06K19/077 ,  H05K1/02 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K5/06 ,  H01L23/28

CPC classification number: G06K19/0726 ,  G06K19/0723 ,  G06K19/07749 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K3/202 ,  H05K3/328 ,  H05K3/3442 ,  H05K2201/09745 ,  H05K2201/10636 ,  H05K2201/10924 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.

Abstract translation: IC模块包括具有要连接到IC卡的天线线圈的端子的引线框架，以及安装在引线框架上并用树脂封装的用于调谐的IC芯片和多层片式电容器。 多层片式电容器安装在引线框架上的凹槽中。

公开(公告)号：US06933443B2

公开(公告)日：2005-08-23

申请号：US10766352

申请日：2004-01-28

Applicant: Bayard J. Osthaus

Inventor： Bayard J. Osthaus

IPC: H01L23/367 ,  H01L23/373 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/068 ,  H05K2201/09745 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An electronic device and method of forming said device are presented, in which the device comprises a base having a pair of elongate flanges and a channel portion defined therebetween, wherein the channel portion has a substantially planar first surface, and wherein the pair of flanges extend generally perpendicularly from the first surface. The device further comprises a ceramic circuit board having a substantially planar second surface, wherein the second surface is substantially parallel to the first surface, and wherein the second surface is operable to mate with the first surface within the channel. An adhesive layer generally resides between the first surface and the second surface, wherein the adhesive layer fixedly couples the first surface of the base to the second surface of the circuit board, wherein the pair of flanges substantially maintain the planarity of the first surface and the second surface during a thermal expansion or contraction of one or more of the base and the circuit board.

Abstract translation: 提出了一种形成所述装置的电子装置和方法，其中所述装置包括具有一对细长凸缘和在其间限定的通道部分的底座，其中所述通道部分具有​​基本上平面的第一表面，并且其中所述一对凸缘延伸 一般垂直于第一表面。 该装置还包括具有基本平坦的第二表面的陶瓷电路板，其中第二表面基本上平行于第一表面，并且其中第二表面可操作以与通道内的第一表面配合。 粘合剂层通常位于第一表面和第二表面之间，其中粘合剂层将基底的第一表面固定地连接到电路板的第二表面，其中该对凸缘基本上保持第一表面的平面度， 在基板和电路板中的一个或多个的热膨胀或收缩过程中的第二表面。

公开(公告)号：US20050160679A1

公开(公告)日：2005-07-28

申请号：US11080276

申请日：2005-03-15

Applicant: Jean Nicolai ,  Marc Duarte ,  Dung Kong-A-Siou

Inventor： Jean Nicolai ,  Marc Duarte ,  Dung Kong-A-Siou

IPC: H05K3/32 ,  H05K3/44 ,  H05K9/00 ,  E04D13/00

CPC classification number: H05K9/0022 ,  H05K3/326 ,  H05K3/44 ,  H05K2201/09745 ,  H05K2201/10371 ,  H05K2203/0323 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49151 ,  Y10T29/49922 ,  Y10T29/53252 ,  Y10T29/5327

Abstract: The invention proposes an assembly including a printed-circuit electronics card (2) mounted on a metal substrate (1), as well as a metal screening cover (3) electrically connected to the substrate (1). The substrate (1) exhibits a recessed gutter (4) in which the edge of the cover (3) is accommodated. The said edge is crimped onto the said substrate (1) in the gutter (4). The invention also proposes a method of producing such an assembly.

Abstract translation: 本发明提出了一种组件，其包括安装在金属基板（1）上的印刷电路电子卡（2）以及电连接到基板（1）的金属屏蔽盖（3）。 衬底（1）具有凹槽（4），盖子（3）的边缘被容纳在凹槽中。 所述边缘被压接在所述沟槽（4）中的所述基板（1）上。 本发明还提出了一种制造这种组件的方法。

公开(公告)号：US06890844B2

公开(公告)日：2005-05-10

申请号：US10630051

申请日：2003-07-30

Applicant: Warren M. Farnworth

Inventor： Warren M. Farnworth

IPC: B22F9/08 ,  B23K35/02 ,  B23K35/14 ,  H05K3/12 ,  H05K3/34 ,  H01L21/44 ,  B02K35/14

CPC classification number: H05K3/3484 ,  B22F9/08 ,  B22F2009/0808 ,  B23K35/0244 ,  H05K3/1216 ,  H05K3/3478 ,  H05K2201/09745 ,  H05K2201/2081 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557

Abstract: Methods and apparatus for forming a plurality of uniformly sized solder balls utilize a stencil having a plurality of holes of uniform volume disposed on a substrate. Solder is disposed in the holes of the stencil on the substrate. Typically, the solder is in the form of solder paste which is distributed into the holes using a squeegee. While within the holes of the stencil on the substrate, the solder is melted to form solder balls. The stencil may then be removed to leave the solder balls on the substrate, or the solder balls may be removed while the stencil remains on the substrate.

Abstract translation: 用于形成多个均匀尺寸的焊球的方法和设备利用具有设置在基板上的具有均匀体积的多个孔的模版。 焊料设置在基板上的模板的孔中。 通常，焊料是焊膏的形式，其使用刮刀分配到孔中。 在衬底上的模板的孔内，焊料熔化形成焊球。 然后可以去除模板以将焊球留在衬底上，或者当模板保留在衬底上时可以去除焊球。

公开(公告)号：US06871392B2

公开(公告)日：2005-03-29

申请号：US10255454

申请日：2002-09-26

Applicant: Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

Inventor： Tatsumi Tsuchiya ,  Yuhsuke Matsumoto ,  Takaaki Murokawa ,  Naoki Fujii ,  Takuya Satoh ,  Yasuhiro Mita ,  Hiroyasu Tsuchida ,  Yoshio Uematsu

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/18 ,  H05K3/34 ,  G11B5/127 ,  H04R31/00

CPC classification number: G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H01L2224/742 ,  H05K1/189 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2203/041 ,  H05K2203/107 ,  H05K2203/159 ,  Y02P70/613 ,  Y10T29/49025 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49046 ,  Y10T29/49144 ,  Y10T29/49179

Abstract: An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.

Abstract translation: 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。