公开(公告)号：US20170171975A1

公开(公告)日：2017-06-15

申请号：US15426062

申请日：2017-02-07

申请人： Unimicron Technology Corp.

发明人： Shu-Sheng Chiang ,  Ming-Hao Wu ,  Wei-Ming Cheng

IPC分类号： H05K1/11 ,  H05K3/46 ,  H05K3/00

CPC分类号： H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

摘要： A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening connecting the cavity and exposing a portion of the first patterned circuit layer. A hole diameter of the opening is smaller than a hole diameter of cavity. A height difference is between an inner surface of the inner dielectric layer exposed by the cavity and a top surface of the first patterned circuit layer exposed by the opening.

公开(公告)号：US20170171973A1

公开(公告)日：2017-06-15

申请号：US15287718

申请日：2016-10-06

申请人： Unimicron Technology Corp.

发明人： Ming-Hao Wu ,  Shu-Sheng Chiang ,  Wei-Ming Cheng

IPC分类号： H05K1/11 ,  H05K3/40 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/111 ,  H05K1/0266 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/0073 ,  H05K3/4038 ,  H05K3/4092 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/094 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0376 ,  H05K2203/163

摘要： A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. The first build-up circuit structure at least has a cavity and an inner dielectric layer. The inner dielectric layer has an opening communicating the cavity and a pad of the first patterned circuit layer is located in the opening. A hole diameter of the opening is smaller than a hole diameter of cavity. An inner surface of the inner dielectric layer exposed by the cavity and a top surface of the pad are coplanar or have a height difference.

公开(公告)号：US09572250B2

公开(公告)日：2017-02-14

申请号：US13997464

申请日：2011-12-23

申请人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

发明人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/06 ,  H05K3/38 ,  H05K3/42

CPC分类号： H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 ，其中所述通孔包括第一部分，在所述第一部分下方的第二部分，所述第一部分和所述第二部分之间的第三部分，以及包含不同于所述第一至第三部分的金属的金属的至少一个阻挡层。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US20160262269A1

公开(公告)日：2016-09-08

申请号：US14640993

申请日：2015-03-06

申请人： KINSUS INTERCONNECT TECHNOLOGY CORP.

发明人： Ting-Hao Lin ,  Chiao-Cheng Chang ,  Yi-Nong Lin

IPC分类号： H05K3/18 ,  H05K3/06

CPC分类号： H05K3/205 ,  H05K2201/0376 ,  H05K2203/0376

摘要： Disclosed is a copper etching method for manufacturing a circuit board, including steps of electroplating a metal copper support layer, coating a thermal sensitive photo resist layer, coating a photo resist layer, performing a process of pattern transfer, removing part of the photo resist layer to form a photo resist pattern, electroplating a metal copper layer to form a circuit pattern, peeling off the photo resist layer, pressing a stacked body composed of a stacked substrate and a stacked material layer onto the circuit pattern to embed the circuit pattern in the stacked material layer, removing the base layer, performing a copper etching process to removing the metal copper support layer, and removing the thermal sensitive photo resist layer to expose the circuit pattern. In particular, the circuit pattern protrudes from the stacked material layer so as to facilitate the subsequent process of forming solder balls.

摘要翻译： 公开了一种用于制造电路板的铜蚀刻方法，包括以下步骤：电镀金属铜支撑层，涂覆热敏光致抗蚀剂层，涂覆光致抗蚀剂层，执行图案转印工艺，去除部分光致抗蚀剂层 以形成光刻胶图形，电镀金属铜层以形成电路图案，剥离光致抗蚀剂层，将由堆叠的基板和堆叠的材料层组成的堆叠体压在电路图案上，以将电路图案嵌入到 层叠材料层，去除基底层，进行铜蚀刻工艺以除去金属铜载体层，以及去除热敏光刻胶层以暴露电路图案。 特别地，电路图案从堆叠的材料层突出，以便于随后的形成焊球的工艺。

公开(公告)号：US09345143B2

公开(公告)日：2016-05-17

申请号：US14741545

申请日：2015-06-17

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kotaro Kodani ,  Kentaro Kaneko ,  Kazuhiro Kobayashi

IPC分类号： H05K3/02 ,  H05K3/10 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K3/20

CPC分类号： H05K3/10 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15174 ,  H05K1/113 ,  H05K3/00 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2201/09472 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/1184 ,  Y10T29/49155 ,  H01L2224/0401

摘要： A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad.

公开(公告)号：US09210808B2

公开(公告)日：2015-12-08

申请号：US13616348

申请日：2012-09-14

申请人： Kentaro Kaneko ,  Toshimitsu Omiya ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

发明人： Kentaro Kaneko ,  Toshimitsu Omiya ,  Kotaro Kodani ,  Junichi Nakamura ,  Kazuhiro Kobayashi

IPC分类号： H05K1/11 ,  H05K3/46 ,  H01L23/00 ,  H01L23/544 ,  H01L21/683 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

CPC分类号： H05K3/188 ,  C25D5/022 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/0017 ,  H05K3/46 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/06 ,  Y10T29/49155 ,  H01L2924/00

摘要： A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

摘要翻译： 布线基板包括绝缘层，埋置在绝缘层中的连接焊盘，该连接焊盘处于连接焊盘的上表面从绝缘层的上表面露出的状态以及下表面和侧表面的至少一部分 所述连接焊盘与所述绝缘层接触，以及形成在所述绝缘层中的所述连接焊盘的外周部分的凹陷高度差部分，其中所述连接焊盘的上表面和所述绝缘层的上表面被布置在 相同的高度

公开(公告)号：US20150206833A1

公开(公告)日：2015-07-23

申请号：US14673981

申请日：2015-03-31

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kotaro KODANI ,  Junichi NAKAMURA

IPC分类号： H01L23/498 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2201/10674 ,  H05K2203/0376 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate.

摘要翻译： 制造布线基板的方法包括在支撑构件的表面上形成第一金属层，所述第一金属层具有至少一个柱状通孔，所述柱状通孔暴露所述支撑构件的表面，形成填充柱状的柱状金属层 在所述柱状金属层和所述第一金属层上形成绝缘层，在所述绝缘层的第一表面上形成互连层，使得所述互连层通过所述绝缘层与所述柱状金属层电连接，以及 通过至少移除所述支撑构件和所述第一金属层来形成包括所述柱状金属层的至少一部分的突出部分，所述突出部分从所述绝缘层的与所述第一表面相对的第二表面突出并且用作所述第一金属层的至少一部分 接线基板的连接端子。

公开(公告)号：US09018538B2

公开(公告)日：2015-04-28

申请号：US13892416

申请日：2013-05-13

申请人： Shinko Electric Industries Co., Ltd.

发明人： Kotaro Kodani ,  Junichi Nakamura

IPC分类号： H05K1/16 ,  H05K1/18 ,  H05K1/11 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H05K3/40 ,  H01L21/56 ,  H05K3/20 ,  H05K3/46

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2201/10674 ,  H05K2203/0376 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of making a wiring substrate includes forming a first metal layer on a surface of a support member, the first metal layer having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer such that the interconnection layer is electrically connected to the columnar metal layer through the insulating layer, and forming a protruding part including at least part of the columnar metal layer by removing at least the support member and the first metal layer, the protruding part protruding from a second surface of the insulating layer opposite the first surface and serving as at least part of a connection terminal of the wiring substrate.

摘要翻译： 制造布线基板的方法包括在支撑构件的表面上形成第一金属层，所述第一金属层具有至少一个柱状通孔，所述柱状通孔暴露所述支撑构件的表面，形成填充柱状的柱状金属层 在所述柱状金属层和所述第一金属层上形成绝缘层，在所述绝缘层的第一表面上形成互连层，使得所述互连层通过所述绝缘层与所述柱状金属层电连接，以及 通过至少移除所述支撑构件和所述第一金属层来形成包括所述柱状金属层的至少一部分的突出部分，所述突出部分从所述绝缘层的与所述第一表面相对的第二表面突出并且用作所述第一金属层的至少一部分 接线基板的连接端子。

公开(公告)号：US20140060893A1

公开(公告)日：2014-03-06

申请号：US13997569

申请日：2011-12-23

申请人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

发明人： Sang Myung Lee ,  Sung Woon Yoon ,  Hyuk Soo Lee ,  Sung Won Lee ,  Ki Do Chun

IPC分类号： H05K1/02 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/46 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 。 通孔包括第一部分，第一部分下面的第二部分和第一和第二部分之间的第三部分，第三部分包括不同于第一和第二部分的金属的金属。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：US08555494B2

公开(公告)日：2013-10-15

申请号：US11865261

申请日：2007-10-01

申请人： Houssam Jomaa

发明人： Houssam Jomaa

IPC分类号： H01K3/10

CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/205 ,  H05K3/243 ,  H05K3/28 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0571 ,  H05K2203/0733

摘要： Disclosed are a coreless substrate and a method of manufacturing the same. The coreless substrate includes a solder resist layer capable of being formed on each of on a first side and a second side of a metal panel. The solder resist layer includes at least one opening. A copper layer may be plated in the at least one opening such that a height of the copper layer exceeds a height of the solder resist layer. Further, at least one dielectric layer is deposited above the copper layer, and at least one microvia drilled in the dielectric layer. The at least one microvia enables an electrical connection between at least one of the first side and the second side of the metal panel and a lower surface of the coreless substrate.

摘要翻译： 公开了一种无芯基板及其制造方法。 无芯基板包括能够形成在金属板的第一侧和第二侧上的阻焊层。 阻焊层包括至少一个开口。 铜层可以镀在至少一个开口中，使得铜层的高度超过阻焊层的高度。 此外，至少一个电介质层沉积在铜层之上，并且在介电层中钻出至少一个微孔。 所述至少一个微孔使得能够在金属板的第一侧和第二侧中的至少一个与无芯基板的下表面之间形成电连接。