公开(公告)号：US07972460B2

公开(公告)日：2011-07-05

申请号：US12408366

申请日：2009-03-20

申请人： Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

发明人： Myung-Sam Kang ,  Jung-Hyun Park ,  Jeong-Woo Park ,  Ji-Eun Kim

IPC分类号： B32B37/02 ,  H05K1/02 ,  H01L21/70

CPC分类号： B32B38/04 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2309/105 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/108 ,  H05K3/421 ,  H05K3/428 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1064 ,  Y10T156/1082

摘要： Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.

摘要翻译： 公开了印刷电路板的制造方法。 制造具有用于将一层连接到另一层的通路的印刷电路板的制造方法可以包括在载体的一个表面上形成电路图案; 在载体的一个表面上处理与通孔对应的孔; 将载体的表面压缩到绝缘体的一个表面中; 移除载体; 处理绝缘体上的通孔，对应于孔的位置; 并且在通孔中形成导电材料，从而容易地加工用于形成通孔的孔，并具有高的设计自由度。

公开(公告)号：US07937833B2

公开(公告)日：2011-05-10

申请号：US11976072

申请日：2007-10-19

申请人： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

IPC分类号： H03K3/02

CPC分类号： H05K3/20 ,  H05K3/0058 ,  H05K3/108 ,  H05K3/4611 ,  H05K3/4682 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.

摘要翻译： 公开了一种制造电路板的方法。 一种制造电路板的方法，包括在载体的绝缘层上形成第一电路图案，其中绝缘层和第一种子层依次层叠; 堆叠并按压载体和绝缘板，其中载体侧具有面向绝缘板的第一电路图案; 移除载体以将第一电路图案和绝缘层转移到绝缘板上; 并且在转移到绝缘板的绝缘层上形成第二电路图案，允许精细的间距电路图案能够在板上制造高密度的精细电路图案，并且允许制造具有简单的多层电路板 处理。

公开(公告)号：US07858437B2

公开(公告)日：2010-12-28

申请号：US11706186

申请日：2007-02-15

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

IPC分类号： H01L21/44

CPC分类号： H01L21/481 ,  H01L23/13 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K3/205 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An aspect of the present invention features a method for manufacturing a substrate having a cavity. The method can comprises: (a) forming an upper layer circuit on an upper seed layer; (b) laminating a dry film on a portion of the upper seed layer where a cavity is to be formed; (c) fabricating an upper outer layer by forming an insulation layer on top of the upper seed layer and on top and sides of the upper layer circuit; (d) stacking the upper outer layer on one side of a core layer where an internal circuit is formed; (e) removing the upper seed layer; and (f) forming the cavity by removing the dry film. The method for manufacturing a substrate with a cavity according to the present invention can reduce the total thickness of the substrate while the thickness of an insulation layer remains the same, by forming the insulation layer on sides of an external circuit.

摘要翻译： 本发明的一个方面的特征在于一种用于制造具有腔的衬底的方法。 该方法可以包括：（a）在上部种子层上形成上层电路; （b）在要形成空腔的上种子层的一部分上层压干膜; （c）通过在上部种子层的顶部和上层电路的顶部和侧面上形成绝缘层来制造上部外层; （d）在形成有内部电路的芯层的一侧堆叠上外层; （e）去除上部种子层; 和（f）通过去除干膜形成空腔。 根据本发明的用于制造具有腔的衬底的方法可以通过在外部电路的侧面上形成绝缘层来减小衬底的总厚度，同时绝缘层的厚度保持相同。

公开(公告)号：US20100024212A1

公开(公告)日：2010-02-04

申请号：US12588259

申请日：2009-10-08

申请人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

发明人： Shuhichi Okabe ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Myung Sam Kang ,  Jung Hyun Park ,  Ji Hong Jo ,  Jin Yong An ,  Soon Oh Jung

IPC分类号： H05K3/06 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K3/205 ,  H05K3/062 ,  H05K3/108 ,  H05K3/462 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

摘要翻译： 一种制造多层印刷电路板的方法，其能够形成能够通过使用CTE的半添加工艺和难以传送的薄基板上的金属载体的刚性来实现的微电路。

公开(公告)号：US20090233400A1

公开(公告)日：2009-09-17

申请号：US12453832

申请日：2009-05-22

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

IPC分类号： H01L21/98 ,  B32B38/10

CPC分类号： H05K3/4691 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K1/189 ,  H05K3/4623 ,  H05K2201/055 ,  H05K2201/09536 ,  H05K2201/10515 ,  H05K2203/049 ,  H05K2203/063 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method for rigid-flexible multi-layer printed circuit board including: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on both sides and a cavity within which a semiconductor chip is mounted is formed; and a bonding sheet adhering the flexible substrate and the rigid substrate and having a insulating property. When the same numbers of the semiconductor chips are mounted or the POP is embodied, the whole thickness of the package can be lower. Also, two more semiconductor chips can be mounted using the space as the thickness of the core layer, and the structure impossible when the number of semiconductor chip mounted on the bottom substrate becomes two from one in conventional technology can be embodied.

摘要翻译： 一种刚性柔性多层印刷电路板的制造方法，包括：柔性基板，其两侧形成有可弯曲的电路; 层叠在柔性基板上的刚性基板和电路形成在两侧，并且形成有安装半导体芯片的空腔; 以及粘合柔性基板和刚性基板并具有绝缘性的粘合片。 当安装相同数量的半导体芯片或实施POP时，封装的整体厚度可以更低。 此外，可以使用空间作为芯层的厚度来安装另外两个半导体芯片，并且可以实现当传统技术中安装在底部基板上的半导体芯片的数量变为二倍时的结构不可行。

公开(公告)号：US07494844B2

公开(公告)日：2009-02-24

申请号：US11524402

申请日：2006-09-21

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Jung-Hyun Park

IPC分类号： H01L21/44

CPC分类号： H05K3/4652 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/183 ,  H05K3/205 ,  H05K3/4697 ,  H05K2201/09536 ,  H05K2203/0574 ,  H05K2203/063 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A method for manufacturing a substrate having a cavity is disclosed. The method comprises: (a) forming a first circuit pattern on one side of a seed layer by use of a first dry film; (b) laminating a second dry film on the first dry film, the thickness of the second dry film corresponding to the depth of the cavity to be formed; (c) laminating a dielectric layer on an area outside of where the cavity is to be formed, the thickness of the dielectric layer corresponding to the depth of the cavity to be formed; (d) laminating on the seed layer a copper foil laminated master having a second circuit pattern; and (e) forming the cavity by peeling off the first dry film and the second dry film after removing the seed layer. The method in accordance with the present invention can mount a plurality of integrated circuits by reducing the thickness of a substrate on a package on package.

摘要翻译： 公开了一种用于制造具有空腔的衬底的方法。 该方法包括：（a）通过使用第一干膜在种子层的一侧上形成第一电路图案; （b）在第一干膜上层压第二干膜，第二干膜的厚度对应于待形成的空腔的深度; （c）在要形成空腔的区域外的区域上层叠电介质层，所述电介质层的厚度对应于待形成的空腔的深度; （d）在种子层上层叠具有第二电路图案的铜箔层叠主板; 和（e）通过在去除种子层之后剥离第一干膜和第二干膜来形成空腔。 根据本发明的方法可以通过减小封装上的封装上的衬底的厚度来安装多个集成电路。

公开(公告)号：US20080105458A1

公开(公告)日：2008-05-08

申请号：US11976762

申请日：2007-10-26

申请人： Myung-Sam Kang ,  Jung-Hyun Park ,  Sang-Duck Kim ,  Ji-Eun Kim ,  Jong-Gyu Choi

发明人： Myung-Sam Kang ,  Jung-Hyun Park ,  Sang-Duck Kim ,  Ji-Eun Kim ,  Jong-Gyu Choi

IPC分类号： H05K1/09 ,  H05K3/00

CPC分类号： H01L23/13 ,  H01L21/4853 ,  H01L23/3114 ,  H01L23/49816 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/107 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49147 ,  H01L2224/29099 ,  H01L2924/00

摘要： A substrate for mounting a flip chip and a method of manufacturing the substrate method of manufacturing the substrate are disclosed. Using a method of manufacturing a substrate for flip chip mounting that includes providing an insulating layer, in which a circuit pattern is buried, and forming at least one bump pad shaped as an indentation by removing at least one portion of the circuit pattern, the bumps pads can be formed by removing portions of a circuit pattern in the shape of indentations, to prevent solder bumps from flowing to the insulating layer portions and reduce the pitch between bumps.

摘要翻译： 公开了一种用于安装倒装芯片的基板和制造基板的制造方法的方法。 使用制造用于倒装芯片安装的衬底的方法，其包括提供绝缘层，其中埋置电路图案，并且通过去除电路图案的至少一部分形成形成凹陷的至少一个凸块焊盘，所述凸块 可以通过去除凹陷形状的电路图案的部分来形成焊盘，以防止焊料凸块流到绝缘层部分并降低凸块之间的间距。

公开(公告)号：USD567203S1

公开(公告)日：2008-04-22

申请号：US29269995

申请日：2006-12-12

申请人： Jung-Hyun Park

设计人： Jung-Hyun Park

公开(公告)号：US20080061649A1

公开(公告)日：2008-03-13

申请号：US11645182

申请日：2006-12-26

申请人： Han Gee Kim ,  Jung Hyun Park

发明人： Han Gee Kim ,  Jung Hyun Park

IPC分类号： H02K21/12 ,  H02K1/22

CPC分类号： H02K21/24 ,  H02K1/14

摘要： Disclosed is an axial gap motor in which a stator and a rotor are arranged parallel to a rotating shaft. More particularly, an axial gap motor, which can be easily manufactured and achieve an improvement in efficiency, is disclosed. In the axial gap motor the stator includes a back yoke defining a magnetic path, a plurality of stator cores each having a central portion parallel to the rotating shaft, each of the plurality of stator cores being coupled to the back yoke, and a plurality of stator coils each wound around the central portion of a corresponding one of the stator cores.

摘要翻译： 公开了一种轴向间隙电动机，其中定子和转子平行于旋转轴设置。 更具体地，公开了可以容易地制造并实现效率提高的轴向间隙电动机。 在轴向间隙电动机中，定子包括限定磁路的后轭，多个定子铁心，每个定子铁芯具有平行于转轴的中心部分，多个定子铁芯中的每一个都与后轭联接， 定子线圈分别围绕对应的一个定子芯的中心部分。

公开(公告)号：US20070190764A1

公开(公告)日：2007-08-16

申请号：US11706186

申请日：2007-02-15

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

IPC分类号： H01L21/20

CPC分类号： H01L21/481 ,  H01L23/13 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K3/205 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An aspect of the present invention features a method for manufacturing a substrate having a cavity. The method can comprises: (a) forming an upper layer circuit on an upper seed layer; (b) laminating a dry film on a portion of the-upper seed layer where a cavity is to be formed; (c) fabricating an upper outer layer by forming an insulation layer on top of the upper seed layer and on top and sides of the upper layer circuit; (d) stacking the upper outer layer on one side of a core layer where an internal circuit is formed; (e) removing the upper seed layer; and (f) forming the cavity by removing the dry film. The method for manufacturing a substrate with a cavity according to the present invention can reduce the total thickness of the substrate while the thickness of an insulation layer remains the same, by forming the insulation layer on sides of an external circuit.

摘要翻译： 本发明的一个方面的特征在于一种用于制造具有腔的衬底的方法。 该方法可以包括：（a）在上种子层上形成上层电路; （b）在要形成空腔的上部种子层的一部分上层叠干膜; （c）通过在上部种子层的顶部和上层电路的顶部和侧面上形成绝缘层来制造上部外层; （d）在形成有内部电路的芯层的一侧堆叠上外层; （e）去除上部种子层; 和（f）通过去除干膜形成空腔。 根据本发明的用于制造具有腔的衬底的方法可以通过在外部电路的侧面上形成绝缘层来减小衬底的总厚度，同时绝缘层的厚度保持相同。