公开(公告)号：US07108546B2

公开(公告)日：2006-09-19

申请号：US09886521

申请日：2001-06-20

Applicant: Charles A. Miller ,  Benjamin N. Eldridge

Inventor： Charles A. Miller ,  Benjamin N. Eldridge

IPC: H01R9/05

CPC classification number: G01R1/0466 ,  H01R13/025 ,  H01R13/40 ,  H01R2201/20

Abstract: An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.

公开(公告)号：US07086149B2

公开(公告)日：2006-08-08

申请号：US09846490

申请日：2001-04-30

Applicant: Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin Niles Eldridge ,  Gary William Grube ,  Igor Yan Khandros ,  Gaetan L. Mathieu

IPC: H01R43/20

CPC classification number: H05K7/1069 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05085 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20757 ,  H01L2224/05599

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器 空间变压器和探针卡之间。 空间变换器和插入器“堆叠”，从而可以调节空间变压器的方向，从而可以调节探针元件的尖端的方向，而不改变探针卡的方向。 公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。 插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调整范围内在空间变压器和探针卡之间保持电连接。 使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。 作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

公开(公告)号：US20060170435A1

公开(公告)日：2006-08-03

申请号：US11048167

申请日：2005-01-31

Applicant: Dane Granicher ,  Roy Henson ,  Charles Miller

Inventor： Dane Granicher ,  Roy Henson ,  Charles Miller

IPC: G01R31/02

CPC classification number: G01R31/31926 ,  G01R1/07385 ,  G01R31/2889

Abstract: A probe card of a wafer test system includes one or more programmable ICs, such as FPGAs, to provide routing from individual test signal channels to one of multiple probes. The programmable ICs can be placed on a base PCB of the probe card, or on a daughtercard attached to the probe card. With programmability, the PCB can be used to switch limited test system channels away from unused probes. Programmability further enables a single probe card to more effectively test devices having the same pad array, but having different pin-outs for different device options. Reprogrammability also allows test engineers to re-program as they are debugging a test program. Because the programmable IC typically includes buffers that introduce an unknown delay, in one embodiment measurement of the delay is accomplished by first programming the programmable IC to provide a loop back path to the test system so that buffer delay can be measured, and then reprogramming the programmable IC now with a known delay to connect to a device being tested.

Abstract translation: 晶片测试系统的探针卡包括一个或多个可编程IC（例如FPGA），以提供从各个测试信号通道到多个探针之一的路由。 可编程IC可以放置在探针卡的基板上，也可以放置在与探针卡相连的子卡上。 具有可编程性，PCB可用于将有限的测试系统通道切换为未使用的探头。 可编程性进一步使单个探针卡能够更有效地测试具有相同焊盘阵列但具有针对不同器件选项的不同引脚的器件。 可重编程序还允许测试工程师在调试测试程序时进行重新编程。 因为可编程IC通常包括引入未知延迟的缓冲器，在一个实施例中，通过首先对可编程IC进行编程以提供到测试系统的回送路径来实现延迟的测量，从而可以测量缓冲器延迟，然后重新编程 可编程IC现在具有已知的延迟以连接到被测试的设备。

公开(公告)号：US07071715B2

公开(公告)日：2006-07-04

申请号：US10771099

申请日：2004-02-02

Applicant: Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

Inventor： Makarand S. Shinde ,  Richard A. Larder ,  Timothy E. Cooper ,  Ravindra V. Shenoy ,  Benjamin N. Eldridge

IPC: G01R31/02 ,  G01R31/26 ,  H05K7/02 ,  H01R12/04

CPC classification number: G01R31/2889 ,  G01R1/07378

Abstract: A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.

Abstract translation: 提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。 通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

公开(公告)号：US07065870B2

公开(公告)日：2006-06-27

申请号：US10667689

申请日：2003-09-22

Applicant: Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

Inventor： Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

IPC: H01R43/02

CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

公开(公告)号：US20060132158A1

公开(公告)日：2006-06-22

申请号：US11018211

申请日：2004-12-21

Applicant: Charles Miller

Inventor： Charles Miller

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R31/31713

Abstract: An emitter follower or source follower transistor is provided in the channel of a wafer test system between a DUT and a test system controller to enable a low power DUT to drive a test system channel. A bypass resistor is included between the base and emitter of the emitter follower transistor to enable bidirectional signals to be provided between the DUT channel and test system controller, as well as to enable parametric tests to be performed. The emitter follower transistor and bypass resistor can be provided on the probe card, with a pull down termination circuit included in the test system controller. The test system controller can provide compensation for the base to emitter voltage drop of the emitter follower transistor.

Abstract translation: 在DUT和测试系统控制器之间的晶片测试系统的通道中提供射极跟随器或源极跟随器晶体管，以使低功率DUT能够驱动测试系统通道。 旁路电阻包括在射极跟随器晶体管的基极和发射极之间，以便在DUT通道和测试系统控制器之间提供双向信号，以及执行参数测试。 射极跟随器晶体管和旁路电阻可以在探针卡上提供，测试系统控制器中包含一个下拉终端电路。 测试系统控制器可以为射极跟随器晶体管的基极到发射极电压降提供补偿。

公开(公告)号：US07063541B2

公开(公告)日：2006-06-20

申请号：US09746716

申请日：2000-12-22

Applicant: Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R12/00

CPC classification number: G01R1/06727 ,  G01R1/06744 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/10 ,  H01L24/72 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/20 ,  H05K3/3421 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An improved microelectronic spring structure, and method of making the same, are disclosed. The improvement comprises, in a spring contact of the type comprising a beam attached to a post, of replacing the post with a plurality of column elements. The beam component is thus provided with one or more column elements which both structurally support and electrically connect one end of the beam to an electronic component. The column elements are preferably comprised of relatively straight segments of wire elements that are ball-bonded to a substrate and are over-coated with suitable structural and/or conducting materials. In the alternative, the improvement comprises a single column element comprised of a relatively straight segment of wire that is ball-bonded to a substrate and over-coated with suitable structural and conducting materials, wherein the column element is essentially rigid. The improved spring structures are especially useful for use as spring contacts on substrates such as probe cards, interposers, semiconductor devices, and other electronic components.

Abstract translation: 公开了一种改进的微电子弹簧结构及其制造方法。 该改进包括在包括附接到柱的梁的类型的弹簧接触中，用多个柱元件替换柱。 因此，梁部件设置有一个或多个列元件，其两个结构上支撑并将电子束的一端电连接到电子部件。 柱元件优选地由相对直的线元件组成，其被球形结合到基底并且被适当的结构和/或导电材料覆盖。 在替代方案中，改进包括单柱元件，其由相对直的导线段组成，其与球体结合到基底上并用适当的结构和导电材料涂覆，其中柱元件基本上是刚性的。 改进的弹簧结构特别适用于诸如探针卡，插入件，半导体器件和其它电子部件的基板上的弹簧触点。

公开(公告)号：US20060085976A1

公开(公告)日：2006-04-27

申请号：US10971489

申请日：2004-10-22

Applicant: Benjamin Eldridge ,  Gaetan Mathieu

Inventor： Benjamin Eldridge ,  Gaetan Mathieu

IPC: B23P21/00

CPC classification number: C25D1/10 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/20 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/32 ,  H05K3/321 ,  H05K3/326 ,  H05K3/341 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/42 ,  H05K2203/0726 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/53378

Abstract: Resilient spring contact structures are manufactured by plating the contact structures on a reusable mandrel, as opposed to forming the contact structures on sacrificial layers that are later etched away. In one embodiment, the mandrel includes a form or mold area that is inserted through a plated through hole in a substrate. Plating is then performed to create the spring contact on the mold area of the mandrel as well as to attach the spring contact to the substrate. In a second embodiment, the mandrel includes a form that is initially plated to form the resilient contact structure and then attached to a region of a substrate without being inserted through the substrate. Attachment in the second embodiment can be achieved during the plating process used to form the spring contact, or by using a conductive adhesive or solder either before or after releasing the spring contact from the mandrel.

Abstract translation: 通过将接触结构电镀在可重复使用的心轴上来制造弹性弹性接触结构，而不是在随后蚀刻掉的牺牲层上形成接触结构。 在一个实施例中，心轴包括通过衬底中的电镀通孔插入的形状或模具区域。 然后进行电镀以在心轴的模具区域上产生弹簧接触以及将弹簧接触件附接到基底。 在第二实施例中，心轴包括最初电镀以形成弹性接触结构然后在不插入衬底的情况下附着到衬底的区域的形式。 在用于形成弹簧接触的电镀工艺期间，或者在从芯棒释放弹簧接触之前或之后使用导电粘合剂或焊料，可以实现第二实施例中的附接。

公开(公告)号：US07024763B2

公开(公告)日：2006-04-11

申请号：US10723269

申请日：2003-11-26

Applicant: Gaetan L. Mathieu ,  Igor Y. Khandros ,  Carl Reynolds

Inventor： Gaetan L. Mathieu ,  Igor Y. Khandros ,  Carl Reynolds

IPC: H05K3/30

CPC classification number: H05K3/42 ,  G01R1/06711 ,  G01R1/07307 ,  G01R3/00 ,  H05K3/308 ,  H05K2201/09836 ,  H05K2203/0338 ,  Y10T29/49117 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49169 ,  Y10T29/49194

Abstract: Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires with a dielectric material to form a second substrate, planing the second substrate to expose the etchable wire, and etching the wires to leave plated through holes. In a second method, wires coated with a first etchable layer are initially bonded to a substrate, a second non-etchable plating layer is then applied over the first layer, and the first layer is etched away leaving plated through holes with wires disposed inside. In a third embodiment, a layer of masking material is initially deposited on a substrate and etched to form holes which are filled with a sacrificial fill material, the masking material is then removed, the fill material plated, grinding is performed to remove some plating to expose the fill material, and the fill material is then etched away leaving plated attachment wells. Probes may be attached to the plated through holes or attachment wells to create resilient spring contacts to form a wafer probe card assembly. A twisted tube plated through hole structure is formed by supporting twisted sacrificial wires coated with the plating material in a substrate, and later etching away the wires.

公开(公告)号：US07005751B2

公开(公告)日：2006-02-28

申请号：US10410948

申请日：2003-04-10

Applicant: Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

Inventor： Igor Y. Khandros ,  Charles A. Miller ,  Stuart W. Wenzel

IPC: H01L23/48

CPC classification number: H05K3/4007 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H01R12/57 ,  H01R43/007 ,  H05K3/326 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09909 ,  Y10T29/49147 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子通过柔性焊盘延伸到其端部区域。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 还公开了一种水平微电子弹簧触头及其制造方法。 水平弹簧触点具有在第一端附接到基板的端子的刚性迹线。 该迹线在其第二端处没有附着，并且从基板平行于基板的表面的方向从端子延伸到第二端。 至少延伸到第二端的迹线的远端部分与衬底的表面间隔开。 间隔开的远侧部分在平行于基底的平面中是柔性的。