公开(公告)号：US07331528B2

公开(公告)日：2008-02-19

申请号：US10537386

申请日：2003-12-02

Applicant: Michael Reid ,  Anton Brunner

Inventor： Michael Reid ,  Anton Brunner

IPC: G06K19/06

CPC classification number: G06K19/0775 ,  G06K19/07745 ,  G06K19/07749 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/321 ,  H05K2201/0314 ,  H05K2201/09472 ,  H05K2201/10727 ,  H01L2924/00

Abstract: The invention relates to a smart card and also to a method of producing such a smart card having a card body (11), at least one recess (12a, 12b) arranged therein for receiving at least one chip module (16) having module connections (17) in the edge region (16a) of the chip module (16) and a conductive structure body embedded in the card body (11) and having body contact connections (13), in particular an antenna having antenna connections which are arranged below the edge region (16a) of the chip module (16), where, with the chip module (16) installed between the module connections (17) on the one hand and the body contact connections (13) on the other hand, adhesive parts (14) preferably applied at points and made of elastic, conductive material are arranged between the connections (13, 17) with pressure being applied to produce a contact.

Abstract translation: 智能卡技术领域本发明涉及一种智能卡，还涉及一种制造具有卡体（11）的智能卡的方法，其中布置有至少一个凹槽（12a，12b），以容纳至少一个芯片模块（16），所述芯片模块 芯片模块（16）的边缘区域（16a）中的模块连接（17）和嵌入在卡体（11）中并具有主体接触连接（13）的导电结构体，特别是具有天线连接 布置在芯片模块（16）的边缘区域（16a）的下方，其中芯片模块（16）一方面安装在模块连接（17）与另一方面的身体接触连接（13）之间 通过施加压力以产生接触，优选地在弹性导电材料的点处施加的粘合部件（14）布置在连接件（13,17）之间。

公开(公告)号：US07256345B2

公开(公告)日：2007-08-14

申请号：US10572952

申请日：2004-09-28

Applicant: Shuichi Inoue

Inventor： Shuichi Inoue

IPC: H01B7/00 ,  H01B7/34

CPC classification number: H01B7/00 ,  B32B15/02 ,  B32B15/06 ,  B32B25/00 ,  B32B25/02 ,  B32B25/042 ,  B32B2250/42 ,  B32B2250/44 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2457/00 ,  H05K1/118 ,  H05K3/4611 ,  H05K2201/0314

Abstract: A cable 1 is configured of connecting portions 12 on both ends for connecting to external connecting terminals and an intermediate portion 13. Each connecting portion 12 has electroconductive portions 14 for connecting with external connecting terminals. The cable 1 is formed by layering multiple elastomer sheets 1H. Each elastomer sheet 1H is formed with an elastomer raw material having no electroconductivity as a base, with rectangular elastomer regions 1T having electroconductivity on both ends and transmission paths for connecting the rectangular elastomer regions 1T on both ends.

Abstract translation: 电缆1由两端的连接部分12构成，用于连接到外部连接端子和中间部分13。 每个连接部分12具有用于与外部连接端子连接的导电部分14。 电缆1通过层叠多个弹性体片材H 1而形成。每个弹性体片材H1形成有不具有导电性的弹性体原料作为基底，在两端具有导电性的矩形弹性体区域1T和用于连接矩形的传输路径 两端的弹性体区域1T。

公开(公告)号：US20070138649A1

公开(公告)日：2007-06-21

申请号：US11315138

申请日：2005-12-21

Applicant: John Knights

Inventor： John Knights

IPC: H01L23/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/11332 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2924/09701 ,  H05K3/125 ,  H05K3/245 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/013

Abstract: A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.

Abstract translation: 形成接触结构和接触结构的方法。 接触结构包括接触位置和基本上设置在接触位置上的接触元件，至少一个这样的接触元件包括可变形的中心和覆盖可变形中心的至少一部分的导电层。

公开(公告)号：US20060286721A1

公开(公告)日：2006-12-21

申请号：US11155208

申请日：2005-06-16

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01G7/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

公开(公告)号：US20060283616A1

公开(公告)日：2006-12-21

申请号：US10572952

申请日：2004-09-28

Applicant: Shuichi Onoue

Inventor： Shuichi Onoue

IPC: H01B11/06

CPC classification number: H01B7/00 ,  B32B15/02 ,  B32B15/06 ,  B32B25/00 ,  B32B25/02 ,  B32B25/042 ,  B32B2250/42 ,  B32B2250/44 ,  B32B2264/105 ,  B32B2307/202 ,  B32B2307/546 ,  B32B2457/00 ,  H05K1/118 ,  H05K3/4611 ,  H05K2201/0314

Abstract: A cable 1 is configured of connecting portions 12 on both ends for connecting to external connecting terminals and an intermediate portion 13. Each connecting portion 12 has electroconductive portions 14 for connecting with external connecting terminals. The cable 1 is formed by layering multiple elastomer sheets 1H. Each elastomer sheet 1H is formed with an elastomer raw material having no electroconductivity as a base, with rectangular elastomer regions 1T having electroconductivity on both ends and transmission paths for connecting the rectangular elastomer regions 1T on both ends. The intermediate portion 13 is narrow even though capable of parallel transmission, and the electroconductive portions 14 are capable of flexibly connecting with external connecting terminals due to the anisotropic electroconductivity thereof.

Abstract translation: 电缆1由两端的连接部分12构成，用于连接到外部连接端子和中间部分13。 每个连接部分12具有用于与外部连接端子连接的导电部分14。 电缆1通过层叠多个弹性体片材H 1而形成。每个弹性体片材H1形成有不具有导电性的弹性体原料作为基底，在两端具有导电性的矩形弹性体区域1T和用于连接矩形的传输路径 两端的弹性体区域1T。 中间部分13即使能够平行传播也很窄，并且由于其各向异性导电性，导电部分14能够与外部连接端子灵活连接。

公开(公告)号：US07083436B2

公开(公告)日：2006-08-01

申请号：US09799936

申请日：2001-03-06

Applicant: William L. Brodsky

Inventor： William L. Brodsky

IPC: H01R4/58

CPC classification number: H05K3/4069 ,  B29C45/0013 ,  B29C45/14344 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/101 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2203/0113 ,  H01L2924/00

Abstract: An interposer comprising a non-conductive carrier sheet with a pre-arranged pattern of conductive interconnect members positioned therethrough and formed from an elastomeric thermoplastic with suspended spherical and non-spherical conductive particles. The non-spherical conductive particles of the present invention are positioned substantially perpendicularly to and partially through the contact faces of the interconnect member, thereby resulting in higher conductivity and efficiency. The interposer is formed by a mold comprising two sections with first and second sets of vias formed in the first and second mold sections, respectively, which permit the injected elastomer mixture to flow completely through the mold cavity and thereby aligns the non-spherical conductive particles. The exit side of the mold is further contacted by support posts of a separable mold interface creating a network of vent passages for venting of air and the elastomer mixture, resulting in less pressure within the mold and less mold flash.

公开(公告)号：US20060102997A1

公开(公告)日：2006-05-18

申请号：US11233078

申请日：2005-09-23

Applicant: Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

Inventor： Hyo-Jae Bang ,  Byung-Man Kim ,  Dong-Chun Lee ,  Kwang-Su Yu

IPC: H01L23/02

CPC classification number: H05K3/325 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0314 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.

Abstract translation: 一种半导体模块和半导体模块的制造方法，所述半导体模块包括至少一个芯片封装，至少一个模块板，设置在所述第一芯片封装和所述模块板之间的至少一个导电元件和用于向所述导电元件施加压力的保护器， 模块板和第一芯片封装和/或用作第一芯片封装的散热器。

公开(公告)号：US20050274544A1

公开(公告)日：2005-12-15

申请号：US10863998

申请日：2004-06-09

Applicant: Lloyd Cosman ,  Farid Aziz ,  Craig Twardy ,  Simon Shearman ,  Edmund Gillespie ,  Joan Wang ,  Michael Tabatchnik ,  Marko Nicolici ,  Robert McDonald

Inventor： Lloyd Cosman ,  Farid Aziz ,  Craig Twardy ,  Simon Shearman ,  Edmund Gillespie ,  Joan Wang ,  Michael Tabatchnik ,  Marko Nicolici ,  Robert McDonald

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0047 ,  H05K3/325 ,  H05K3/429 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/09845 ,  H05K2201/10371 ,  H05K2203/0207 ,  H05K2203/0242

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract translation: 公开了一种用于印刷电路板垫圈的电绝缘方法，用于使得垫圈能够覆盖电镀通孔而不会短路。 用于印刷电路板垫圈的电隔离方法包括在受控的宽度到受压深度的对置，这些电镀通过垫圈下方的孔。 该方法提供了能够在印刷电路板中平面的两个表面上覆盖衬垫的优点。 印刷电路板垫圈的电隔离方法对于克服本领域已知的附加材料要求和电隔离的处理步骤是特别有用的。

公开(公告)号：US20050230811A1

公开(公告)日：2005-10-20

申请号：US11152438

申请日：2005-06-14

Applicant: Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

Inventor： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC: G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin assembly and a contactor card system are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

公开(公告)号：US20050230809A1

公开(公告)日：2005-10-20

申请号：US11151925

申请日：2005-06-14

Applicant: Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

Inventor： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC: G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC classification number: G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

Abstract: A compliant contact pin assembly and a contactor card system are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract translation: 提供了柔性接触销组件和接触器卡系统。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。