公开(公告)号：US09385009B2

公开(公告)日：2016-07-05

申请号：US13243558

申请日：2011-09-23

申请人： Yaojian Lin ,  Rui Huang ,  Kang Cheng ,  Gu Yu

发明人： Yaojian Lin ,  Rui Huang ,  Kang Cheng ,  Gu Yu

IPC分类号： H01L29/41 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L23/31

CPC分类号： H01L23/3128 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/568 ,  H01L23/293 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/0558 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/19 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a semiconductor die mounted to a carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A first insulating layer is formed over the encapsulant and semiconductor die. First vias are formed through the first insulating layer to expose contact pads of the semiconductor die. A first conductive layer is formed over the first insulating layer and into the first vias to electrically connect to the contact pads of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. Second vias are formed through the second insulating layer by laser direct ablation and aligned or offset with the first vias to expose the first conductive layer. A second conductive layer is formed over the second insulating layer and into the second vias. Conductive vias can be formed through the encapsulant.

摘要翻译： 半导体器件具有安装到载体上的半导体管芯。 密封剂沉积在半导体管芯和载体上。 载体被移除。 在密封剂和半导体管芯上形成第一绝缘层。 通过第一绝缘层形成第一通孔以暴露半导体管芯的接触焊盘。 第一导电层形成在第一绝缘层上并且形成在第一通孔中，以电连接到半导体管芯的接触焊盘。 在第一绝缘层和第一导电层上形成第二绝缘层。 通过激光直接消融通过第二绝缘层形成第二通孔，并与第一通孔对准或偏移以暴露第一导电层。 第二导电层形成在第二绝缘层上并进入第二通孔中。 可以通过密封剂形成导电孔。

公开(公告)号：US20150215837A1

公开(公告)日：2015-07-30

申请号：US14488774

申请日：2014-09-17

申请人： Candy Yiu ,  Yang Tang ,  Yujian Zhang ,  Rui Huang

发明人： Candy Yiu ,  Yang Tang ,  Yujian Zhang ,  Rui Huang

IPC分类号： H04W36/22 ,  H04W24/10 ,  H04W28/08

CPC分类号： H04W24/10 ,  H04W28/08 ,  H04W36/0088 ,  H04W72/12

摘要： An embodiment for user equipment that receives a plurality of measurement gap repetition patterns from a network. Each measurement gap repetition pattern may be assigned to a different frequency of the network. The plurality of measurement gap repetition patterns may include skipping measurement patterns. Further embodiments may include the user equipment receiving a repetition period in a measurement object frame or receiving a plurality of measurement gap repetition patterns in which the measurement gaps are non-colliding with measurement gaps of other repetition patterns assigned to the user equipment.

摘要翻译： 从网络接收多个测量间隙重复模式的用户设备的实施例。 每个测量间隙重复模式可以被分配给网络的不同频率。 多个测量间隙重复图案可以包括跳过测量图案。 另外的实施例可以包括用户设备在测量对象框架中接收重复周期或接收多个测量间隙重复模式，其中测量间隙与分配给用户设备的其他重复模式的测量间隙不相冲突。

公开(公告)号：US08942122B2

公开(公告)日：2015-01-27

申请号：US13526767

申请日：2012-06-19

申请人： Hong He ,  Jong-Kae Fwu ,  Rui Huang

发明人： Hong He ,  Jong-Kae Fwu ,  Rui Huang

IPC分类号： H04W72/04 ,  H04W24/00

CPC分类号： H04W52/241 ,  H04B17/318 ,  H04B17/382 ,  H04L5/0007 ,  H04L5/0035 ,  H04L5/0096 ,  H04L5/14 ,  H04W28/16 ,  H04W36/0061 ,  H04W36/0066 ,  H04W48/16 ,  H04W52/08 ,  H04W52/146 ,  H04W72/0413 ,  H04W72/042 ,  H04W72/0446 ,  H04W72/08 ,  H04W88/06 ,  H04W88/10 ,  Y02D70/10 ,  Y02D70/20

摘要： At least one neighbor cell is identified by a base station by detecting a synchronization signal of the at least one neighbor cell. A received signal power, such as a Reference Signal Received Power (RSRP) or a Reference Signal Received Quality (RSRQ), or a combination thereof, is also measured from the at least one neighbor cell. Identifying information and the received signal power of the at least one neighbor cell is then communicated to a network entity of the wireless network. Information is received from the network entity indicating whether the base station can enable a reconfiguration of the allocation of uplink and downlink subframes used in the cell of the base station. Based on the information received from the network entity, the base station enables a reconfiguration of the allocation of uplink and downlink subframes used in the cell.

摘要翻译： 至少一个相邻小区由基站通过检测至少一个相邻小区的同步信号来识别。 还从至少一个相邻小区测量诸如参考信号接收功率（RSRP）或参考信号接收质量（RSRQ）的接收信号功率或其组合。 然后将所述至少一个相邻小区的信息和所接收的信号功率进行识别，然后被传送到所述无线网络的网络实体。 从网络实体接收指示基站是否能够使基站的小区中使用的上行链路和下行链路子帧的分配重新配置的信息。 基于从网络实体接收的信息，基站能够重新配置小区中使用的上行链路和下行链路子帧的分配。

公开(公告)号：US20140056229A1

公开(公告)日：2014-02-27

申请号：US13512509

申请日：2011-11-30

申请人： Honggang Li ,  Rui Huang ,  Shantidev Mohanty

发明人： Honggang Li ,  Rui Huang ,  Shantidev Mohanty

IPC分类号： H04W76/02

CPC分类号： H04W76/028 ,  H04W4/08 ,  H04W8/186 ,  H04W60/00 ,  H04W76/19 ,  H04W76/40

摘要： Embodiments of the present disclosure describe device, methods, computer-readable media and system configurations for establishing a reentry procedure for a machine-to-machine (“M2M”) device to reenter a wireless communication network based on traffic pattern characteristics or mobility characteristics associated with the M2M device. In various embodiments, a wireless communication device may include a processor, a wireless communication interface, memory coupled to the processor, and a control module. The control module may be operated by the processor and configured to establish a reentry procedure for a machine-to-machine (“M2M”) device to reenter a wireless communication network based on traffic pattern characteristics or mobility characteristics associated with the M2M device. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例描述了用于建立机器对机器（“M2M”）设备的重入程序的设备，方法，计算机可读介质和系统配置，以基于相关联的业务模式特性或移动性特性重新进入无线通信网络 与M2M设备。 在各种实施例中，无线通信设备可以包括处理器，无线通信接口，耦合到处理器的存储器和控制模块。 控制模块可以由处理器操作，并且被配置为基于与M2M设备相关联的业务模式特性或移动性特性，建立机器对机器（“M2M”）设备重新进入无线通信网络的重入程序。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20140056221A1

公开(公告)日：2014-02-27

申请号：US13995147

申请日：2012-03-29

申请人： Honggang Li ,  Rui Huang ,  Shantidev Mohanty

发明人： Honggang Li ,  Rui Huang ,  Shantidev Mohanty

IPC分类号： H04W4/08

CPC分类号： H04W4/08 ,  H04W4/70 ,  H04W68/025 ,  H04W84/22 ,  H04W88/04

摘要： A machine-to-machine-type (M2M-type) device and technique comprising a transceiver at an M2M-type device that receives from a base station a paging message designating the M2M-type device to be a delegate for a group of M2M-type devices. In response, a processor of the M2M-type device generates an acknowledgement and/or an M2M-type group-based reentry communication for the transceiver to send to the base station. The base station is part of wireless network that can comprise one of a Bluetooth-based standard wireless network, an IEEE 802.11-based standard wireless network, an IEEE 802.16-based standard wireless network, an IEEE 802.18-based wireless network standard, a 3GPP LTE-based wireless network standard, a 3GPP-based protocol wireless network, a 3GPP2 Air Interface Evolution (3GPP2 AIE) based wireless network standard, a UMTS-based protocol wireless network, a CDMA2000-based protocol wireless network, a GSM-based protocol wireless network, a cellular-digital-packet-data-based (CDPD-based) protocol wireless network, or a Mobitex-based protocol wireless network.

摘要翻译： 一种机器对机器（M2M型）设备和技术，其包括在M2M型设备处的收发器，其从基站接收指定M2M类型设备的寻呼消息，以作为M2M组的一组代表， 类型设备。 作为响应，M2M型设备的处理器生成用于收发器发送给基站的确认和/或M2M类型的基于组的再入通信。 基站是无线网络的一部分，其可以包括基于蓝牙的标准无线网络，基于IEEE 802.11的标准无线网络，基于IEEE 802.16的标准无线网络，基于IEEE 802.18的无线网络标准，3GPP 基于LTE的无线网络标准，基于3GPP的协议无线网络，基于3GPP2空中接口演进（3GPP2AIE）的无线网络标准，基于UMTS的协议无线网络，基于CDMA2000的协议无线网络，基于GSM的协议 无线网络，基于蜂窝数字分组数据（CDPD）的协议无线网络或基于Mobitex的协议无线网络。

公开(公告)号：US20140036792A1

公开(公告)日：2014-02-06

申请号：US13713242

申请日：2012-12-13

申请人： Qinghua Li ,  Honggang Li ,  Jong-Kae Fwu ,  Wendy Wong ,  Rui Huang

发明人： Qinghua Li ,  Honggang Li ,  Jong-Kae Fwu ,  Wendy Wong ,  Rui Huang

IPC分类号： H04W72/00

CPC分类号： H04W24/04 ,  H04B17/27 ,  H04L1/1861 ,  H04L5/00 ,  H04L5/0035 ,  H04L5/0055 ,  H04L5/0057 ,  H04L41/0659 ,  H04L41/082 ,  H04L41/0836 ,  H04L43/0811 ,  H04L45/28 ,  H04L47/27 ,  H04L65/1006 ,  H04L65/4092 ,  H04L65/80 ,  H04L67/16 ,  H04L67/303 ,  H04L67/34 ,  H04L67/36 ,  H04N21/23439 ,  H04N21/25825 ,  H04W4/00 ,  H04W4/02 ,  H04W4/70 ,  H04W4/80 ,  H04W8/18 ,  H04W12/06 ,  H04W16/18 ,  H04W16/28 ,  H04W24/02 ,  H04W24/10 ,  H04W28/0221 ,  H04W28/0236 ,  H04W28/04 ,  H04W36/0072 ,  H04W36/14 ,  H04W40/02 ,  H04W40/34 ,  H04W52/00 ,  H04W52/0209 ,  H04W52/0212 ,  H04W52/0216 ,  H04W52/0229 ,  H04W52/0258 ,  H04W64/003 ,  H04W72/005 ,  H04W72/04 ,  H04W72/0406 ,  H04W72/0413 ,  H04W72/042 ,  H04W72/044 ,  H04W72/0446 ,  H04W74/0816 ,  H04W76/10 ,  H04W76/11 ,  H04W76/14 ,  H04W76/15 ,  H04W76/16 ,  H04W76/28 ,  H04W88/06 ,  H04W88/12 ,  H04W92/18 ,  Y02D70/00 ,  Y02D70/1222 ,  Y02D70/1224 ,  Y02D70/1242 ,  Y02D70/1244 ,  Y02D70/1246 ,  Y02D70/1262 ,  Y02D70/1264 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/164 ,  Y02D70/166 ,  Y02D70/21 ,  Y02D70/22 ,  Y02D70/23 ,  Y02D70/24 ,  Y02D70/25

摘要： Embodiments of computer-implemented methods, systems, computing devices, and computer-readable media are described herein for device-to-device on-demand advertisement. In some embodiments, the method may include receiving a request for broadcasting an advertisement by a device-to-device (D2D) advertiser via a D2D communication protocol, requesting that an evolved NodeB (eNB) associated with the D2D advertiser allocate a resource for broadcasting the advertisement by the D2D advertiser, determining that the broadcasting the advertisement is no longer needed, and requesting that the eNB retrieve the allocated resource. Other embodiments may be described and claimed.

摘要翻译： 这里描述了计算机实现的方法，系统，计算设备和计算机可读介质的实施例，用于设备到设备按需广告。 在一些实施例中，该方法可以包括经由D2D通信协议接收由设备到设备（D2D）广告商广播广告的请求，请求与D2D广告商相关联的演进的节点B（eNB）分配用于广播的资源 D2D广告商的广告，确定不再需要广播广告，并请求eNB检索分配的资源。 可以描述和要求保护其他实施例。

公开(公告)号：US20130265932A1

公开(公告)日：2013-10-10

申请号：US13976466

申请日：2011-09-28

申请人： Rui Huang ,  Honggang Li ,  Shantidev Mohanty

发明人： Rui Huang ,  Honggang Li ,  Shantidev Mohanty

IPC分类号： H04W4/08

CPC分类号： H04W4/08 ,  H04W8/186 ,  H04W60/00 ,  H04W76/19 ,  H04W76/40

摘要： Techniques for machine-to-machine device management are described. In some embodiments a method may comprise receiving information from a plurality of machine-to-machine (M2M) devices over one or more wireless channels, aggregating two or more of the M2M devices as an M2M group based on the received information, and multicasting data to the M2M devices in the M2M group over the one or more wireless channels. Other embodiments are described and claimed.

摘要翻译： 描述了机器对机器设备管理的技术。 在一些实施例中，一种方法可以包括通过一个或多个无线信道从多个机器对机器（M2M）设备接收信息，基于所接收的信息将M2M设备中的两个或多个作为M2M组聚合，以及多播数据 通过一个或多个无线信道到M2M组中的M2M设备。 描述和要求保护其他实施例。

公开(公告)号：US20130188500A1

公开(公告)日：2013-07-25

申请号：US13526767

申请日：2012-06-19

申请人： Hong He ,  Jong-Kae Fwu ,  Rui Huang

发明人： Hong He ,  Jong-Kae Fwu ,  Rui Huang

IPC分类号： H04W72/04 ,  H04W24/00

CPC分类号： H04W52/241 ,  H04B17/318 ,  H04B17/382 ,  H04L5/0007 ,  H04L5/0035 ,  H04L5/0096 ,  H04L5/14 ,  H04W28/16 ,  H04W36/0061 ,  H04W36/0066 ,  H04W48/16 ,  H04W52/08 ,  H04W52/146 ,  H04W72/0413 ,  H04W72/042 ,  H04W72/0446 ,  H04W72/08 ,  H04W88/06 ,  H04W88/10 ,  Y02D70/10 ,  Y02D70/20

摘要： At least one neighbor cell is identified by a base station by detecting a synchronization signal of the at least one neighbor cell. A received signal power, such as a Reference Signal Received Power (RSRP) or a Reference Signal Received Quality (RSRQ), or a combination thereof, is also measured from the at least one neighbor cell. Identifying information and the received signal power of the at least one neighbor cell is then communicated to a network entity of the wireless network. Information is received from the network entity indicating whether the base station can enable a reconfiguration of the allocation of uplink and downlink subframes used in the cell of the base station. Based on the information received from the network entity, the base station enables a reconfiguration of the allocation of uplink and downlink subframes used in the cell.

摘要翻译： 至少一个相邻小区由基站通过检测至少一个相邻小区的同步信号来识别。 还从至少一个相邻小区测量诸如参考信号接收功率（RSRP）或参考信号接收质量（RSRQ）的接收信号功率或其组合。 然后将所述至少一个相邻小区的信息和所接收的信号功率进行识别，然后被传送到所述无线网络的网络实体。 从网络实体接收指示基站是否能够使基站的小区中使用的上行链路和下行链路子帧的分配重新配置的信息。 基于从网络实体接收的信息，基站能够重新配置小区中使用的上行链路和下行链路子帧的分配。

公开(公告)号：US08456002B2

公开(公告)日：2013-06-04

申请号：US13333739

申请日：2011-12-21

申请人： Yaojian Lin ,  Pandi C. Marimuthu ,  Kang Chen ,  Hin Hwa Goh ,  Yu Gu ,  Il Kwon Shim ,  Rui Huang ,  Seng Guan Chow ,  Jianmin Fang ,  Xia Feng

发明人： Yaojian Lin ,  Pandi C. Marimuthu ,  Kang Chen ,  Hin Hwa Goh ,  Yu Gu ,  Il Kwon Shim ,  Rui Huang ,  Seng Guan Chow ,  Jianmin Fang ,  Xia Feng

IPC分类号： H01L23/52

CPC分类号： H01L23/3114 ,  H01L21/31 ,  H01L21/56 ,  H01L21/568 ,  H01L21/768 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/522 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2924/00012 ,  H01L2224/214

摘要： A semiconductor device has a semiconductor die and conductive layer formed over a surface of the semiconductor die. A first channel can be formed in the semiconductor die. An encapsulant is deposited over the semiconductor die. A second channel can be formed in the encapsulant. A first insulating layer is formed over the semiconductor die and first conductive layer and into the first channel. The first insulating layer extends into the second channel. The first insulating layer has characteristics of tensile strength greater than 150 MPa, elongation between 35-150%, and thickness of 2-30 micrometers. A second insulating layer can be formed over the semiconductor die prior to forming the first insulating layer. An interconnect structure is formed over the semiconductor die and encapsulant. The interconnect structure is electrically connected to the first conductive layer. The first insulating layer provides stress relief during formation of the interconnect structure.

公开(公告)号：US08399305B2

公开(公告)日：2013-03-19

申请号：US12885831

申请日：2010-09-20

申请人： Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuang

发明人： Rui Huang ,  Seng Guan Chow ,  Heap Hoe Kuang

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L21/563 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83007 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor wafer contains a plurality of semiconductor die separated by saw streets. A dam material is formed over the saw streets around each of the semiconductor die. A plurality of openings is formed in the dam material. The openings in the dam material can be formed on each side or corners of the first semiconductor die. The semiconductor wafer is singulated through the dam material to separate the semiconductor die. The semiconductor die is mounted to a substrate. A mold underfill is deposited through a first opening in the dam material. A vacuum is drawn on a second opening in the dam material to cause the underfill material to cover an area between the first semiconductor die and substrate without voids. The number of second openings can be greater than the number of first openings. The first opening can be larger than the second opening.

摘要翻译： 半导体晶片包含由锯条隔开的多个半导体管芯。 在围绕每个半导体管芯的锯切街道上形成坝材料。 在堤坝材料中形成多个开口。 坝体材料中的开口可以形成在第一半导体管芯的每个侧面上。 半导体晶片通过坝体材料分离，以分离半导体管芯。 将半导体管芯安装到基板上。 模具底部填充物通过坝体材料中的第一开口沉积。 在坝材料的第二开口上抽真空，使得底部填充材料覆盖第一半导体管芯和衬底之间的空隙。 第二开口的数量可以大于第一开口的数量。 第一开口可以大于第二开口。