公开(公告)号：US09029713B2

公开(公告)日：2015-05-12

申请号：US13852233

申请日：2013-03-28

Applicant: Ibiden Co., Ltd.

Inventor： Michimasa Takahashi

IPC: H05K1/03 ,  H05K1/11 ,  H05K7/00 ,  H05K1/02 ,  H01L23/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/10484 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.

公开(公告)号：US20140319200A1

公开(公告)日：2014-10-30

申请号：US14259547

申请日：2014-04-23

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masayuki Sakai ,  Takahiro Yoneyama ,  Fumiyuki Yamatsuka

IPC: B23K31/02 ,  G03G15/00 ,  H05K1/16

CPC classification number: H05K3/3431 ,  B23K1/0016 ,  B23K2101/36 ,  B23K2101/42 ,  G03G15/5054 ,  G03G15/80 ,  G03G2215/0132 ,  G03G2215/0164 ,  G03G2215/16 ,  H05K1/181 ,  H05K3/3452 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract translation: 所述电路基板包括形成在基板上的至少两个焊盘，其中一个电极将被安装在所述至少两个焊盘上，电子部件具有电极，所述电极中的一个焊接在所述至少两个焊盘上，焊料的量为 通过具有至少两个开口部分的金属掩模调节，当焊料被施加和熔化时，所述至少两个开口部分对应于所述至少两个焊盘的位置，所述至少两个开口部分的区域彼此不同，其中 根据金属掩模的至少两个开口部分的面积的差异，一个焊料的高度不同于另一个焊料的高度，由此电子部件以倾斜的方式安装在电路基板上 州。

公开(公告)号：US20140116767A1

公开(公告)日：2014-05-01

申请号：US14063036

申请日：2013-10-25

Applicant: Ibiden Co., Ltd.

Inventor： Kenji SATO ,  Takaya ENDO

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A wiring board includes a core substrate having cavity penetrating through the substrate, an electronic component accommodated in the cavity and including a body and conductive portions on the body, filling resin filling space in the cavity having the component, a first insulation layer formed on the substrate such that the first layer is covering the substrate and component, a second insulation layer formed on the substrate on the opposite side such that the second layer is covering the substrate and component, a conductive pattern formed on the first layer, and a via hole conductor formed through the first layer such that the via hole conductor is connecting one of the conductive portions and conductive pattern. The component is positioned in the cavity such that the component is inclined with respect to surfaces of the substrate and has main surface forming inclination angle with main surface of the substrate.

Abstract translation: 布线基板包括具有穿透基板的空腔的芯基板，容纳在空腔中的电子部件，包括主体和主体上的导电部分，填充具有该部件的空腔中的树脂填充空间，形成在第一绝缘层上的第一绝缘层 基板，使得第一层覆盖基板和部件，形成在相对侧的基板上的第二绝缘层，使得第二层覆盖基板和部件，形成在第一层上的导电图案，以及通孔 导体通过第一层形成，使得通孔导体连接导电部分和导电图案之一。 该部件位于空腔中，使得部件相对于基板的表面倾斜，并且与主体表面形成主表面倾斜角。

公开(公告)号：US20130200783A1

公开(公告)日：2013-08-08

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H05B33/10 ,  H05B33/08

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US07919854B2

公开(公告)日：2011-04-05

申请号：US12192496

申请日：2008-08-15

Applicant: Thilo Stolze

Inventor： Thilo Stolze

IPC: H01L23/34

CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/4093 ,  H01L23/4334 ,  H01L23/5387 ,  H01L24/48 ,  H01L25/07 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/141 ,  H05K1/148 ,  H05K3/284 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/10484 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract translation: 具有两个冷却表面和方法的半导体模块。 一个实施例包括具有第一冷却表面的第一载体和具有第二冷却表面的第二载体。 第一冷却表面布置在第一平面中，第二冷却表面相对于第一平面以不同于0°的角度布置在第二平面中。

公开(公告)号：US20100302780A1

公开(公告)日：2010-12-02

申请号：US12599040

申请日：2007-11-19

Applicant: Zhiyong Liu

Inventor： Zhiyong Liu

IPC: F21S4/00 ,  H01J9/24

CPC classification number: F21S8/086 ,  F21K9/00 ,  F21S8/085 ,  F21S9/03 ,  F21V19/001 ,  F21V29/507 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y02B20/72

Abstract: The present invention relates to a LED directional illumination energy-saving luminaire and a manufacturing method thereof. The luminaire comprises: a plane circuit board with an X direction and a Y direction defined; and illumination units including a first illumination unit, which is arranged at the center of the circuit board, and two second illumination units arranged at the both sides of the first illumination unit symmetrically. Each illumination unit includes a plurality of LEDs mounted to said circuit board in a tilted state with said LED bodies being positioned at a predetermined height from the plane circuit board, and said plurality of LEDs are arranged at intervals in an array along said X direction and said Y direction and are symmetrically distributed with respect to the center of said array. Each LED deviates from the X direction and the Y direction at a predeterminative angle, so that the illumination units can form predeterminative project angles in the X direction and the Y direction respectively. The projection angle of the LED is less than 15 degrees, and the luminous intensity thereof is higher than 20000 mcd. The luminaire is capable of achieving an accurate directional illumination, has a well lighting effect and energy-saving effect, and has a well performance of heat dissipation, thus is especially suitable for the street lighting.

Abstract translation: 本发明涉及一种LED定向照明节能灯及其制造方法。 该照明装置包括：具有X方向和Y方向的平面电路板; 以及布置在电路板的中心的包括第一照明单元的照明单元和对称地布置在第一照明单元的两侧的两个第二照明单元。 每个照明单元包括以倾斜状态安装到所述电路板的多个LED，其中所述LED主体定位在距平面电路板的预定高度处，并且所述多个LED沿着所述X方向以间隔排列， 所述Y方向相对于所述阵列的中心对称地分布。 每个LED以预定角度偏离X方向和Y方向，使得照明单元可以分别在X方向和Y方向上形成预定投影角度。 LED的投影角度小于15度，其发光强度高于20000mcd。 灯具能够实现精确的定向照明，具有良好的照明效果和节能效果，并具有良好的散热性能，因此特别适用于街道照明。

公开(公告)号：US07839657B2

公开(公告)日：2010-11-23

申请号：US11414429

申请日：2006-04-28

Applicant: Thomas H. Nodine

Inventor： Thomas H. Nodine

IPC: H05K1/14

CPC classification number: H05K1/148 ,  H05K1/141 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/10128 ,  H05K2201/10287 ,  H05K2201/10484

Abstract: A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed to the mother board and the daughter board on a common plane the frangible connections are broken to allow the daughter board to be moved to a desired position relative to the mother board. The electrical conductors that connect the daughter board to the mother board are semi-rigid to provide movement while maintaining a desired position of the daughter board relative to the mother board.

Abstract translation: 电路板组件包括母板和子板。 子板由与母板的多个易碎连接限定，并与母板设置在公共平面上。 在将所有电子设备安装到母板和母板上的公共平面上之后，易碎连接断开，以使子板相对于母板移动到所需的位置。 将子板连接到母板的电导体是半刚性的，以提供移动，同时保持子板相对于母板的期望位置。

公开(公告)号：US20100230152A1

公开(公告)日：2010-09-16

申请号：US12715586

申请日：2010-03-02

Applicant: Takahiro KITAGAWA

Inventor： Takahiro KITAGAWA

IPC: H05K1/16 ,  B23K31/02 ,  B23K1/20

CPC classification number: H05K3/341 ,  H05K3/3442 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10469 ,  H05K2201/10484 ,  H05K2201/10969 ,  H05K2203/0415 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A method of soldering an electronic component includes; providing solder onto a printed circuit board electrode of a printed circuit board; placing the electronic component over the printed circuit board, the electronic component having a component electrode to be mounted on the printed circuit board electrode with a component-supporting member that melts with heat interposed therebetween; and heating the solder and the component-supporting member. The electronic component is supported on one side thereof by the component-supporting member and on the opposite side thereof directly by the printed circuit board.

Abstract translation: 焊接电子部件的方法包括： 在印刷电路板的印刷电路板电极上提供焊料; 将电子部件放置在印刷电路板上，电子部件具有要安装在印刷电路板电极上的部件电极，其中部件支撑部件以热量熔融在其间; 并加热焊料和部件支撑部件。 电子部件通过部件支撑部件支撑在其一侧上，并且在其相对侧由印刷电路板支撑。

公开(公告)号：US07797663B2

公开(公告)日：2010-09-14

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在μVia的外层焊盘上方的导电圆顶的微孔（μVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US07723854B2

公开(公告)日：2010-05-25

申请号：US11748109

申请日：2007-05-14

Applicant: Christophe Kopp ,  Francois Baleras ,  Christophe Martinez

Inventor： Christophe Kopp ,  Francois Baleras ,  Christophe Martinez

IPC: H01L23/48

CPC classification number: G02B6/423 ,  B23K1/0016 ,  H01L23/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16105 ,  H01L2224/1703 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15151 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10484 ,  Y02P70/613 ,  H01L2924/00

Abstract: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on an object and on a support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of the object forms an angle of 70° to 110° with respect to each wettability area of the support and the object and the support are mutually distant from one another.

Abstract translation: 通过使用焊料凸块来实现对象和支撑件的这种组装。 分别在物体和支撑体上形成至少两个润湿性区域。 每个焊料凸块确保电接触和机械固定首先到物体的润湿性区域之一，其次是支撑体的润湿性区域之一。 焊锡凸块的熔化温度低于每个润湿性区域的熔化温度。 物体的每个润湿性区域相对于支撑体的每个润湿性区域形成70°至110°的角度，并且物体和支撑体彼此相互远离。