公开(公告)号：US20230221174A1

公开(公告)日：2023-07-13

申请号：US17571554

申请日：2022-01-10

Applicant: PixArt Imaging Inc.

Inventor： Sai Mun LEE ,  Chee Pin T'NG

IPC: G01J1/04 ,  H05K1/18

CPC classification number: G01J1/0407 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10719

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a printed circuit board (PCB); a sensor disposed on the PCB; a glass cover disposed directly on the sensor; and an aperture disposed on the PCB comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The cut-out section of the ceiling is smaller in area than the glass cover. The part of the aperture ceiling which overhangs the glass cover is thicker than the remaining part. The optical sensor package further includes an LED die disposed on the PCB, and Kapton tape placed over the ceiling of the aperture.

公开(公告)号：US20180352647A1

公开(公告)日：2018-12-06

申请号：US16102356

申请日：2018-08-13

Applicant: Seagate Technology LLC

Inventor： David Michael Davis ,  Gary Edward Webb

IPC: H05K1/02 ,  H05K3/34 ,  H01L23/50 ,  H05K1/18

CPC classification number: H05K1/029 ,  H01L23/50 ,  H05K1/0243 ,  H05K1/0245 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10212 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

公开(公告)号：US09900983B2

公开(公告)日：2018-02-20

申请号：US15045024

申请日：2016-02-16

Applicant: INTEL CORPORATION

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K7/02 ,  H05K1/02 ,  H05K3/36 ,  H05K3/42 ,  G06F1/16 ,  H05K3/34 ,  H05K1/14 ,  G06F1/18 ,  H01L23/498

CPC classification number: H05K1/115 ,  G06F1/16 ,  G06F1/18 ,  G06F1/183 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K2201/041 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

公开(公告)号：US20170186661A1

公开(公告)日：2017-06-29

申请号：US14998123

申请日：2015-12-23

Applicant: INTEL CORPORATION

Inventor： Russell S. Aoki ,  Jonathan W. Thibado ,  Jeffory L. Smalley ,  David J. Llapitan ,  Thomas A. Boyd ,  Harvey R. Kofstad ,  Dimitrios Ziakas ,  Hongfei Yan

IPC: H01L23/34 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L23/4006 ,  H01L23/49816 ,  H01L23/49822 ,  H05K1/0212 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/176

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

公开(公告)号：US09560785B1

公开(公告)日：2017-01-31

申请号：US14030525

申请日：2013-09-18

Applicant: BAE Systems Information and Electronic Systems Integration Inc.

Inventor： David A. Brigham ,  James F. Fung ,  Gregory S. Laste ,  Bryan A. Thibideau ,  Joseph C. Brackett

IPC: H01R12/00 ,  H05K13/00 ,  H05K7/10

CPC classification number: H05K7/10 ,  H05K1/0286 ,  H05K3/225 ,  H05K3/325 ,  H05K7/1061 ,  H05K13/00 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2201/10719 ,  H05K2203/176

Abstract: The mezzanine card system and method of use thereof provides a baseboard having opposing sides, each side configured to receive a mezzanine card thereon. A plurality of mezzanine cards are provided having integrated circuits, such as Field Programmable Gate Arrays, fixedly attached thereon. The mezzanine cards of the system reduce reprogramming time from about 15 months to about six weeks. This drastic reduction in reprogramming time provides great advantages for circuitry systems, especially when these systems are used within battlefield and electronic warfare technology. The surfaces of the baseboard are an Electroless Nickel, Electroless Palladium, and Immersion Gold (ENEPIG) plated finish.

Abstract translation: 夹层卡系统及其使用方法提供了具有相对侧的基板，每个侧面配置成在其上接收夹层卡。 提供了多个夹层卡，其具有固定地附接在其上的集成电路，例如现场可编程门阵列。 系统的夹层卡将重编程时间从大约15个月减少到大约六周。 重新编程时间的急剧减少为电路系统提供了巨大的优势，特别是当这些系统在战场和电子战技术中使用时。 踢脚板的表面是无电镀镍，无电镀钯和浸金（ENEPIG）电镀。

公开(公告)号：US20160338199A1

公开(公告)日：2016-11-17

申请号：US14780501

申请日：2014-12-20

Applicant: Intel Corporation

Inventor： Fay HUA ,  Hong XIE ,  Gregorio R. MURTAGIAN ,  Amit ABRAHAM ,  Alan C. MCALLISTER ,  Ting ZHONG

IPC: H05K1/18 ,  H05K3/34 ,  H01L23/498 ,  H05K3/40 ,  H01R12/52 ,  H01R33/76

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/00 ,  H01R12/52 ,  H01R33/7607 ,  H05K3/3421 ,  H05K3/4007 ,  H05K2201/10719

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及提供用于插座组件中的电连接的焊接触点的技术和配置。 在一个实施例中，焊料接触可以设置在管芯封装的底表面上，使得焊料接触件导电地耦合到管芯封装的电触头。 焊接触点可以被设置成耦合到插座组件的引脚，以提供模具封装的电触点和插座组件的引脚的导电耦合。 可以选择焊料足够软以提供更好的导电性。 引脚还可以被配置为穿透焊接触点以提供更好的导电性。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20160192479A1

公开(公告)日：2016-06-30

申请号：US15062477

申请日：2016-03-07

Applicant: FUJITSU LIMITED

Inventor： Teru Nakanishi ,  Nobuyuki Hayashi ,  Masaru Morita ,  Yasuhiro YONEDA

IPC: H05K1/02

CPC classification number: H05K1/0296 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13847 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

公开(公告)号：US09258890B2

公开(公告)日：2016-02-09

申请号：US14294875

申请日：2014-06-03

Applicant: STMicroelectronics, Inc.

Inventor： Rammil Seguido ,  Frederick Ray Gomez ,  Emmanuel Angeles

IPC: H01L23/52 ,  H01L23/48 ,  H05K1/02 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H01L23/66 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09236 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T29/49146 ,  H01L2924/00014

Abstract: Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results.

Abstract translation: 通过在管芯堆叠下方提供金属迹线支撑结构，可以避免印刷电路板上的堆叠集成电路管芯结构的分层。 金属迹线支撑结构具有基本相等间隔的细金属迹线，代替过去使用的连续金属板。 分隔开的薄金属迹线比具有大热质量的金属板不易受热膨胀。 金属迹线仍然提供结构稳定性，同时防止热处理期间芯片堆叠配置的分层。 证明了通过将管芯附着膜粘附到金属痕迹的领域将桥模组叠构造附着到印刷电路板的方法。 此外，用测试结果证实了由金属迹线支撑结构形成的桥模组的电气和结构完整性。

公开(公告)号：US20150373847A1

公开(公告)日：2015-12-24

申请号：US14496876

申请日：2014-09-25

Applicant: Intel Corporation

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  H05K3/42 ,  G06F1/16 ,  H05K3/36 ,  H05K1/02 ,  H05K7/02

CPC classification number: G06F1/16 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K3/4694 ,  H05K2201/041 ,  H05K2201/09972 ,  H05K2201/10159 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

Abstract translation: 描述了用于模块化印刷电路板（PCB）的装置和用于制造模块化PCB的方法。 装置可以包括具有在第一PCB模块的一个或多个层上的路由结构的第一图案的第一PCB模块。 该装置还可以包括具有在第二PCB模块的一个或多个层上的路由结构的第二图案的第二PCB模块。 路由结构的第二模式可以与没有连接器的路由结构的第一模式对准并电耦合。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09184520B2

公开(公告)日：2015-11-10

申请号：US14253885

申请日：2014-04-16

Applicant: Unimicron Technology Corp.

Inventor： Chih-Peng Fan ,  Yin-Hwa Cheng ,  Ching-Ho Hsieh ,  Ling-Kai Su ,  Yung-Hao Hsueh

IPC: H01R12/00 ,  H01R12/71 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01R12/718 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09036 ,  H05K2201/10265 ,  H05K2201/10719

Abstract: An electrical connector includes a base and an elastic terminal. The base has a recess. The elastic terminal is connected to the base and extends to the recess. The elastic terminal has a fixed end and a free end, the fixed end is connected to the base, and the free end is located at the recess and is curved. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to bend towards the bottom of the recess so that the free end leans against the bottom of the recess. The electrical connector may further include a contact protrusion connected to the elastic terminal. When the contact moves towards the recess, the contact is capable of pushing the contact protrusion to make the elastic terminal bend towards the bottom portion of the recess so that the free end leans against the bottom of the recess.

Abstract translation: 电连接器包括基座和弹性端子。 底座有一个凹槽。 弹性端子连接到基座并延伸到凹部。 弹性端子具有固定端和自由端，固定端连接到基座，自由端位于凹槽处并弯曲。 当接触件朝向凹部移动时，触头能够推动接触突起朝向凹部的底部弯曲，使得自由端靠在凹部的底部。 电连接器还可以包括连接到弹性端子的接触突起。 当接触件朝向凹部移动时，触头能够推动接触突起，以使弹性端子朝向凹部的底部弯曲，使得自由端靠在凹部的底部。