公开(公告)号：US09224629B2

公开(公告)日：2015-12-29

申请号：US14694808

申请日：2015-04-23

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  H01L21/683 ,  H01L29/06 ,  H01L21/266 ,  B81C99/00 ,  B32B38/18 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20150364107A1

公开(公告)日：2015-12-17

申请号：US14307336

申请日：2014-06-17

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Tore Nauta

IPC: G09G5/00 ,  G09G5/18 ,  G09G3/32 ,  G06F3/044

CPC classification number: G09G3/3225 ,  G06F3/0412 ,  G06F3/042 ,  G09G2300/04 ,  G09G2300/0809 ,  G09G2320/0626 ,  G09G2320/0686 ,  G09G2358/00 ,  G09G2360/144 ,  G09G2360/148 ,  G09G2370/08

Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode.

Abstract translation: 示例性方法和系统使用有源矩阵显示器中的微型发光二极管（LED）发光并感测IR二极管来感测光。 显示面板包括具有显示区域，子像素电路阵列和选择装置阵列的显示基板。 每个子像素电路包括用于在发光模式下操作相应的红外（IR）发射LED的驱动电路。 每个选择装置可以耦合到对应的感测IR二极管，以在光感测模式下操作相应的感测IR二极管。

公开(公告)号：US20150331285A1

公开(公告)日：2015-11-19

申请号：US14811417

申请日：2015-07-28

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: G02F1/1335 ,  H01L25/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  G02F1/133603 ,  G02F1/133617 ,  G02F2001/133614 ,  G09F9/00 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/322 ,  H01L27/3246 ,  H01L33/38 ,  H01L33/50 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L51/5281 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.

Abstract translation: 描述了显示器和制造方法。 显示器可以包括包括像素阵列的基板，每个像素包括多个子像素，并且像素内的每个子像素被设计用于不同的发色光谱。 每个子像素中安装有一组微型LED器件对，以提供冗余。 包含磷光体粒子的波长转换层阵列形成在微型LED器件对阵列上，用于可调色彩发射光谱。

公开(公告)号：US09178123B2

公开(公告)日：2015-11-03

申请号：US13710443

申请日：2012-12-10

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L33/60 ,  H01L25/075

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Abstract translation: 描述了发光器件的反射堤结构。 反射堤结构可以包括衬底，衬底上的绝缘层，以及绝缘层中的堤开口阵列，每个堤开口包括底表面和侧壁。 反射层跨越绝缘层中每个堤开口的侧壁。

公开(公告)号：US09153548B2

公开(公告)日：2015-10-06

申请号：US14027875

申请日：2013-09-16

Applicant: LuxVue Technology Corporation

Inventor： Clayton Ka Tsun Chan ,  Andreas Bibl

IPC: H01L27/15 ,  H01L23/00 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L24/00 ,  B81C1/00873 ,  B81C2201/0194 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/0079 ,  H01L2221/68368 ,  H01L2224/0345 ,  H01L2224/03848 ,  H01L2224/04026 ,  H01L2224/05016 ,  H01L2224/05023 ,  H01L2224/05083 ,  H01L2224/05117 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/0519 ,  H01L2224/05562 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05638 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/05688 ,  H01L2224/06181 ,  H01L2224/2745 ,  H01L2224/29005 ,  H01L2224/29007 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/83005 ,  H01L2224/83409 ,  H01L2224/83411 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/01032 ,  H01L2924/01028 ,  H01L2924/0781 ,  H01L2224/034 ,  H01L2224/274 ,  H01L2924/014 ,  H01L2224/83

Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. Patterned sacrificial spacers are formed between the stabilization posts and between the micro devices. The patterned sacrificial spacers are disposed upon the patterned sacrificial spacers.

Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 图案化的牺牲间隔物形成在稳定柱之间和微型器件之间。 图案化的牺牲隔离物设置在图案化的牺牲间隔物上。

公开(公告)号：US20150169011A1

公开(公告)日：2015-06-18

申请号：US14109864

申请日：2013-12-17

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F1/18 ,  G06F3/042 ,  G06F1/16 ,  G06F3/041

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/0412 ,  G06F3/042 ,  G06F3/14 ,  G09G3/32 ,  G09G2380/02 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

Abstract translation: 描述了包括显示模块的显示模块和系统应用。 显示模块可以包括前表面，后表面和前表面上的显示区域的显示基板。 多个互连件从前表面延伸到后表面。 一组发光二极管（LED）在显示区域中并与多个互连电连接，一个或多个驱动电路位于显示基板的背面。 示例性的系统应用包括可穿戴的，可滚动的和可折叠的显示器。

公开(公告)号：US09044926B2

公开(公告)日：2015-06-02

申请号：US14221071

申请日：2014-03-20

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  B32B38/18 ,  H01L29/06 ,  H01L21/266 ,  B81C99/00 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

Abstract translation: 描述了一种兼容的双极微器件传输头阵列和从SOI衬底形成兼容的双极微器件传输阵列的方法。 在一个实施例中，柔性双极微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括第一和第二硅互连以及与第一和第二硅互连电连接并可偏转到基底基板和硅电极之间的一个或多个空腔中的第一和第二硅电极阵列。

公开(公告)号：US20150137153A1

公开(公告)日：2015-05-21

申请号：US14603960

申请日：2015-01-23

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L27/12 ,  H01L25/075 ,  H01L33/48 ,  H01L33/44 ,  H01L33/20

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

Abstract translation: 描述了将微型LED器件集成到发光器件中的发光器件和方法。 在一个实施例中，发光器件包括在堤层内的反射堤岸结构，以及位于堤层顶部并在反射堤岸结构上方升高的导电线。 微型LED器件在反射堤结构内，钝化层位于堤层之上，并且侧向围绕反射堤坝结构内的微型LED器件。 微型LED器件的一部分和在堤层顶部的导电线突出于钝化层的顶表面之上。

公开(公告)号：US09029880B2

公开(公告)日：2015-05-12

申请号：US13842793

申请日：2013-03-15

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/12

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

公开(公告)号：US08941215B2

公开(公告)日：2015-01-27

申请号：US13711554

申请日：2012-12-11

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

IPC: H01L23/50 ,  H01L23/00

CPC classification number: H01L24/06 ,  H01L21/6835 ,  H01L24/03 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/7598 ,  H01L2224/83409 ,  H01L2224/83411 ,  H01L2224/83444 ,  H01L2224/83815 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 微器件阵列形成在由热固性材料形成的稳定柱阵列上。 每个微型装置包括比直接在底面下面的相应稳定柱更宽的底表面。