公开(公告)号：US20090129039A1

公开(公告)日：2009-05-21

申请号：US11917085

申请日：2006-06-14

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4602 ,  H05K3/4652 ,  H05K7/00 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10674 ,  Y10T29/49133 ,  Y10T29/49162 ,  H01L2924/00 ,  H01L2224/0401

摘要： A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7.

摘要翻译： 多层印刷布线板包括支撑半导体器件的安装部分和包括第一和第二层状电极的层状电容器部分和其间的陶瓷高介电层。 第一层状电极连接到地线，第二层状电极连接到电源线。 构成将接地焊盘与布线图案的接地线电连接并且非接触地穿过第二层状电极的导电路径部分的通孔数量的比率与接地焊盘数目的比为0.05〜0.7。 第二棒状导体的数量比构成将电源焊盘与布线图案的电源线电连接并且非接触地穿过第一层状电极的导电路径部分的数量与供电焊盘的数量 为0.05〜0.7。

公开(公告)号：US07525190B2

公开(公告)日：2009-04-28

申请号：US11078342

申请日：2005-03-14

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H01L23/12 ,  H05K1/00 ,  H05K7/00

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，在构成拐角部分C等于或小于90°的部分上添加一个纸条F，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。

公开(公告)号：US20090025216A1

公开(公告)日：2009-01-29

申请号：US12053237

申请日：2008-03-21

申请人： Yasuji HIRAMATSU ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji HIRAMATSU ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H05K3/10

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。

公开(公告)号：US07332816B2

公开(公告)日：2008-02-19

申请号：US10108628

申请日：2002-03-29

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H01L23/48 ,  H01K1/11 ,  H01K7/00

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，将构图F添加到构成等于或小于90°的拐角部分C的部分，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。

公开(公告)号：US07127812B2

公开(公告)日：2006-10-31

申请号：US10406245

申请日：2003-04-04

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H01K3/10

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.

摘要翻译： 板20设置有作为保形掩模的Cu膜30，其中形成有对准标记30b和形成有通孔的开口3a。 相机感测该对准标记30b，以便确定板30的位置。 激光束被引导到开口30a的大致位置，从而形成通孔穿过其中的开口26a。 通孔的开口的位置的精度取决于作为保形掩模的Cu膜30中的开口30a的位置的精度。 因此，尽管激光照射位置的精度低，但是通孔可以形成在适当的位置。

公开(公告)号：US20060131071A1

公开(公告)日：2006-06-22

申请号：US11331268

申请日：2006-01-13

申请人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

发明人： Yasuji Hiramatsu ,  Motoo Asai ,  Naohiro Hirose ,  Takashi Kariya

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/421 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0554 ,  Y10S430/146 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

摘要翻译： 多层印刷电路板包括覆盖有导体层的基板，层间绝缘树脂层，层间绝缘树脂层上的蚀刻金属膜和通孔。 层间绝缘树脂层具有纤维基材。 通孔具有电解电镀膜和无电镀膜，并且连接板的导体层和蚀刻的金属膜。

公开(公告)号：US20050158553A1

公开(公告)日：2005-07-21

申请号：US11078342

申请日：2005-03-14

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  H05K3/46 ,  B05D5/12

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，将构图F添加到构成等于或小于90°的拐角部分C的部分，并且形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。

公开(公告)号：US06440542B1

公开(公告)日：2002-08-27

申请号：US09889569

申请日：2001-07-30

申请人： Takashi Kariya

发明人： Takashi Kariya

IPC分类号： B32B300

CPC分类号： H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/384 ,  H05K3/388 ,  H05K3/4069 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

摘要： A copper-clad laminate is provided which includes an insulative substrate having laminated on one or either side thereof a copper foil whose one side is roughened, the copper foil having formed on the roughened surface side thereof a metal layer whose melting point is lower than that of zinc. There is also provided a circuit board for a printed wiring board, including an insulative substrate having a conductive circuit formed on one side thereof and viaholes formed in through-holes extending from the other side of the insulative substrate to the conductive circuit, there being formed between the one side of the insulative substrate and the conductive circuit a metal layer whose melting point is lower than that of zinc. No desmearing is required in making the circuit board, and so a circuit board for a multilayer printed wiring board can be produced which is superior in stability of the inter-layer electrical connection.

摘要翻译： 提供了一种覆铜层压板，其包括在其一侧或两侧上层叠有一侧粗糙化的铜箔的绝缘性基板，在其粗糙面的表面侧上形成有铜箔的金属层的熔点低于 的锌。 还提供了一种用于印刷电路板的电路板，包括：绝缘基板，其一侧形成有导电电路，形成在从绝缘基板的另一侧延伸到导电电路的通孔中形成的通孔， 在绝缘基板的一侧和导电电路之间，熔点低于锌的金属层。 在制造电路板时不需要除尘，因此可以制造出层间电连接的稳定性优异的多层印刷电路板用电路板。

公开(公告)号：US06407345B1

公开(公告)日：2002-06-18

申请号：US09700592

申请日：2000-11-17

申请人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

发明人： Naohiro Hirose ,  Takashi Kariya ,  Yoji Mori

IPC分类号： H01R909

CPC分类号： H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

摘要： A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

摘要翻译： 在布线图案58b，58c和58d的交叉部分X中，在构成拐角部分C等于或小于90°的部分上添加一个纸条F，并形成布线图案58。 由于添加了纸张F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于不会对交叉部分X集中的应力，因此布线图案中不会导致断线，也不会产生气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。

公开(公告)号：US4495780A

公开(公告)日：1985-01-29

申请号：US447798

申请日：1982-12-08

申请人： Tomonori Kaneko ,  Shunji Mori ,  Tetsuo Ichikawa ,  Yoichi Hiroki ,  Takashi Kariya

发明人： Tomonori Kaneko ,  Shunji Mori ,  Tetsuo Ichikawa ,  Yoichi Hiroki ,  Takashi Kariya

IPC分类号： H02B1/56 ,  F25B49/02 ,  F25D19/00 ,  F25D23/00 ,  G05D23/19 ,  H05K7/20 ,  F25B41/00

CPC分类号： H05K7/206 ,  F25B49/02 ,  F25D19/00 ,  G05D23/1931 ,  F25B2600/0251 ,  F25D23/003 ,  F25D2323/00267 ,  F25D2323/00277

摘要： Method and apparatus for controlling the cooling of a hermetic type control box accommodating therein electronic apparatus by means of a cooling system. A cooling member of the cooling system is disposed at an upper portion of a hermetically closed chamber in which the electronic apparatus is housed. On the basis of measurements of intra-box temperature and extra-box temperature, control is so performed that the intra-box temperature is maintained higher than the extra-box temperature by a predetermined value when the cooling is being effected within the control box by means of the cooling system.

摘要翻译： 用于通过冷却系统控制在其中容纳电子装置的封闭式控制箱的冷却的方法和装置。 冷却系统的冷却构件设置在容纳电子设备的气密封闭室的上部。 在箱内温度和箱外温度的测量的基础上，进行控制，使得当在控制箱内进行冷却时，将箱内温度保持高于额外箱温度预定值 冷却系统的方法。