公开(公告)号：US08837160B2

公开(公告)日：2014-09-16

申请号：US13175683

申请日：2011-07-01

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H05K1/16 ,  H01L21/48 ,  H01L23/50 ,  H01L23/498 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K1/162 ,  H01L21/4867 ,  H01L23/498 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/388 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method of producing a capacitor for a printed circuit board includes producing high-dielectric sheets and selecting ones of the high-dielectric sheets, which are substantially free from a defect after the heat process. Each of the high-dielectric sheets is produced by providing a first electrode, forming a first sputter film on the first electrode, forming an intermediate layer on the first sputter film by calcining a sol-gel film, forming a second sputter film on the intermediate layer, and providing a second electrode on the second sputter film. The high-dielectric sheets are subjected to a heat process in which the high-dielectric sheets are subjected to a first temperature at least once and a second temperature higher than the first temperature at least once.

摘要翻译： 一种印刷电路板用电容器的制造方法，其特征在于，制造高介电质片材，并选择在热处理后基本上不存在缺陷的高电介质片材。 每个高电介质片通过提供第一电极来制造，在第一电极上形成第一溅射膜，通过煅烧溶胶 - 凝胶膜在第一溅射膜上形成中间层，在中间层上形成第二溅射膜 并且在第二溅射膜上提供第二电极。 对高电介质片材进行热处理，其中高电介质片材经受至少一次的第一温度和比第一温度高至少一次的第二温度。

公开(公告)号：US08707552B2

公开(公告)日：2014-04-29

申请号：US11580927

申请日：2006-10-16

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H05K3/30

CPC分类号： H05K1/162 ,  H01L21/4867 ,  H01L23/498 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/388 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A high-dielectric sheet for a printed circuit board includes a first electrode, a first sputter film formed on the first electrode, an intermediate layer formed on the first sputter film by calcining a sol-gel film, a second sputter film formed on the intermediate layer, and a second electrode provided on the second sputter film.

摘要翻译： 用于印刷电路板的高电介质片包括第一电极，形成在第一电极上的第一溅射膜，通过煅烧溶胶 - 凝胶膜在第一溅射膜上形成的中间层，形成在中间体上的第二溅射膜 层和设置在第二溅射膜上的第二电极。

公开(公告)号：US08654538B2

公开(公告)日：2014-02-18

申请号：US13050217

申请日：2011-03-17

申请人： Takashi Kariya ,  Toshiki Furutani

发明人： Takashi Kariya ,  Toshiki Furutani

IPC分类号： H05K1/18

CPC分类号： H05K1/0298 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2924/15151 ,  H01L2924/15311 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/10159 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A wiring board including a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on one surface of the first substrate and including multiple interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including multiple conductive circuits for being connected to multiple semiconductor elements, and a filler filling the opening portion of the built-up layer such that the interposer is held in the opening portion of the built-up layer. The opening portion of the built-up layer has a tapered portion tapering toward the outermost surface of the built-up layer.

摘要翻译： 一种布线基板，包括具有穿透所述第一基板的穿透孔的第一基板，形成在所述第一基板的一个表面上并且包括多个层间树脂绝缘层和布线层的积层，所述积层具有开口部 与第一基板的贯通孔相通并且向组合层的最外表面开口，插入物容纳在积层的开口部分中，并且包括形成在第二基板上的第二基板和布线层， 插入器的布线层包括用于连接到多个半导体元件的多个导电电路，以及填充积层的开口部分的填充物，使得插入器被保持在积层的开口部分中。 积层的开口部分具有朝向堆积层的最外表面渐缩的锥形部分。

公开(公告)号：US08347493B2

公开(公告)日：2013-01-08

申请号：US12369115

申请日：2009-02-11

申请人： Hirotaka Taniguchi ,  Toshiki Furutani ,  Takeshi Furusawa ,  Takashi Kariya

发明人： Hirotaka Taniguchi ,  Toshiki Furutani ,  Takeshi Furusawa ,  Takashi Kariya

IPC分类号： H05K3/30 ,  H05K3/00 ,  H05K3/02 ,  H01R9/00

CPC分类号： H05K1/187 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/205 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49169 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing a wiring board with a built-in electronic component including providing a first base material having a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, mounting an electronic component to the connection terminal such that the electronic component is electrically connected to the connection terminal and mounted on the first base material, covering the electronic component with an insulative material structure having a hollow portion such that the electronic component is accommodated in the hollow portion of the insulative material structure after the mounting and detaching the support body from the first metal foil such that a substrate having the first base material and the insulative material structure is formed.

摘要翻译： 一种制造具有内置电子部件的布线板的方法，包括提供具有支撑体的第一基材和可拆卸地粘附在所述支撑体上的第一金属箔，形成用于将电子部件安装在所述第一金属箔上的连接端子 通过添加方法将电子部件安装到连接端子上，使得电子部件电连接到连接端子并安装在第一基材上，用绝缘材料结构覆盖电子部件，该绝缘材料结构具有中空部分 使得在将支撑体从第一金属箔安装和拆卸之后，电子部件容纳在绝缘材料结构的中空部分中，从而形成具有第一基材和绝缘材料结构的基板。

公开(公告)号：US07888606B2

公开(公告)日：2011-02-15

申请号：US12034581

申请日：2008-02-20

申请人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime Sakamoto ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K1/16

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A multilayer printed circuit board has an IC chip included in a core substrate in advance and a mediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the mediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole and reliability.

摘要翻译： 多层印刷电路板预先包括在芯基板中的IC芯片和设置在IC芯片的焊盘上的介质层。 由此，可以在不使用引线部件和密封树脂的情况下将IC芯片电连接到多层印刷电路板。 此外，通过在芯片焊盘上设置由铜制成的中介层，可以防止焊盘上的树脂残留，并且改善焊盘和通孔之间的连接特性以及可靠性。

公开(公告)号：US07817440B2

公开(公告)日：2010-10-19

申请号：US12608568

申请日：2009-10-29

申请人： Takashi Kariya ,  Hironori Tanaka

发明人： Takashi Kariya ,  Hironori Tanaka

IPC分类号： H05K1/18

CPC分类号： H05K1/18 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4602 ,  H05K3/4652 ,  H05K7/00 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10674 ,  Y10T29/49133 ,  Y10T29/49162 ,  H01L2924/00 ,  H01L2224/0401

摘要： A multilayer printed wiring board includes a mounting portion supporting a semiconductor device and a layered capacitor portion including first and second layered electrodes and a ceramic high-dielectric layer therebetween. The first layered electrode is connected to a ground line and the second layered electrode is connected to a power supply line. The ratio of number of via holes, each constituting a conducting path part electrically connecting a ground pad to the ground line of a wiring pattern and passing through the second layered electrode in non-contact, to number of ground pads is 0.05 to 0.7. The ratio of number of second rod-shaped conductors, each constituting a conducting path part electrically connecting a power supply pad to the power supply line of the wiring pattern and passing through the first layered electrode in non-contact, to number of power supply pad is 0.05 to 0.7.

公开(公告)号：US07812702B2

公开(公告)日：2010-10-12

申请号：US12466940

申请日：2009-05-15

申请人： Yasuhiko Mano ,  Takashi Kariya ,  Shinobu Kato

发明人： Yasuhiko Mano ,  Takashi Kariya ,  Shinobu Kato

IPC分类号： H01F5/00

CPC分类号： H05K3/4046 ,  H01F17/0006 ,  H01F17/06 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/065 ,  H01L23/645 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/185 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/09581 ,  Y10T29/4902 ,  H01L2224/05599

摘要： An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

摘要翻译： 嵌入印刷电路板的电感器包括沿着印刷电路板的厚度方向延伸的导体和与导体接触而不间隙的磁体。 例如，磁性体由具有圆柱形管状的铁氧体构成。 导体由在圆筒形管状铁氧体的内周面上电镀形成的铜膜构成。 电感器沿印刷电路板的厚度方向插入。

公开(公告)号：US07731504B2

公开(公告)日：2010-06-08

申请号：US12254592

申请日：2008-10-20

申请人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

发明人： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC分类号： H01R9/00

CPC分类号： H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

摘要翻译： 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：US07692267B2

公开(公告)日：2010-04-06

申请号：US12401166

申请日：2009-03-10

申请人： Takashi Kariya

发明人： Takashi Kariya

IPC分类号： H01L29/00

CPC分类号： H01G4/30 ,  H01G4/232 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/66 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2203/0152 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： When a package substrate with a built-in capacitor includes a first thin-film small electrode 41aa and a second thin-film small electrode 42aa that are electrically short-circuited to each other via a pinhole P in a high-dielectric layer 43, a power supply post 61a and a via hole 61b are not formed in the first thin-film small electrode 41aa, and a ground post 62a and a via hole 62b are not formed in the second thin-film small electrode 42aa, either. As a result, the short-circuited small electrodes 41aa and 42aa are electrically connected to neither a power supply line nor a ground line, and become a potential independent from a power supply potential and a ground potential. Therefore, in the thin-film capacitor 40, only the portion where the short-circuited small electrodes 41aa and 42aa sandwich the high dielectric layer 43 loses the capacitor function, and portions where other thin-film small electrodes 41a and 42a sandwich the high dielectric layer 43 maintain the capacitor function.

摘要翻译： 当具有内置电容器的封装衬底包括通过高电介质层43中的针孔P彼此电短路的第一薄膜小电极41aa和第二薄膜小电极42aa时， 在第一薄膜小电极41aa中没有形成供电支柱61a和通孔61b，也不在第二薄膜小电极42aa中形成接地柱62a和通孔62b。 结果，短路的小电极41aa和42aa既不与电源线也不与接地线电连接，并且成为独立于电源电位和接地电位的电位。 因此，在薄膜电容器40中，只有短路的小电极41aa和42aa夹着高电介质层43的部分失去电容器功能，其他薄膜小电极41a和42a夹住高电介质的部分 层43保持电容器的功能。

公开(公告)号：US20090070996A1

公开(公告)日：2009-03-19

申请号：US12273939

申请日：2008-11-19

申请人： Hajime SAKAMOTO ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

发明人： Hajime SAKAMOTO ,  Tadashi Sugiyama ,  Dongdong Wang ,  Takashi Kariya

IPC分类号： H05K3/42

CPC分类号： H01L24/29 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/03 ,  H01L25/18 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/18162 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09918 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad.

摘要翻译： 一种制造印刷电路板的方法，包括提供芯基板和包含在芯基板中的电子部件，具有芯片焊盘的电子部件，在芯基板上形成定位标记，在芯基板上形成层间绝缘层 和所述电子部件，根据所述芯基板上的定位标记，通过所述层间绝缘层形成连接到所述电子部件的所述管芯焊盘的通孔开口，以及在所述层间绝缘体的通孔开口部形成通孔结构 使得通孔结构电连接到管芯焊盘。