公开(公告)号：US09850408B2

公开(公告)日：2017-12-26

申请号：US14406314

申请日：2013-01-08

Applicant: LG Chem, Ltd.

Inventor： Chan Oh Yoon ,  Jang Soon Kim ,  Min Seok Song ,  Eun Kyung Park ,  Bu Gi Jung

IPC: B32B7/12 ,  C09J133/08 ,  C09J133/04 ,  C09J7/00 ,  C09J7/02 ,  G02B27/00

CPC classification number: C09J133/08 ,  C08L33/04 ,  C08L33/08 ,  C08L2312/00 ,  C09J7/00 ,  C09J7/10 ,  C09J133/04 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2433/00 ,  G02B27/0018 ,  Y10T428/24942

Abstract: The present invention relates to an optical adhesive film which has excellent adhesive strength at room temperature and has improved efficiency in a rework process since peel strength is low at high temperatures. When attaching a touchscreen panel and an LCD by using the adhesive film of the present invention and separating the touchscreen panel and the LCD at high temperatures, the touchscreen panel and the LCD can be separated from each other without causing damage thereto. Additionally, the optical film of the present invention comprises two adhesive layers, wherein peeling occurs at the first adhesive layer having an adhesive composition such that a peeling surface can be controlled according to the convenience of a user.

公开(公告)号：US20170362469A1

公开(公告)日：2017-12-21

申请号：US15537791

申请日：2015-12-16

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Audrey A. Sherman ,  Eric D. Shockey ,  Joan M. Noyola ,  Krystal K. Hunt

IPC: C09J7/02 ,  B32B7/06 ,  C08G77/455 ,  C08G77/54 ,  B32B7/12

CPC classification number: C08G77/54 ,  B32B7/06 ,  B32B7/12 ,  B32B2307/412 ,  B32B2405/00 ,  C08G77/455 ,  C09J7/10 ,  C09J7/22 ,  C09J7/38 ,  C09J7/403 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2483/00 ,  C09J2483/006

Abstract: Dual-sided adhesive articles include a first crosslinked pressure sensitive adhesive layer with a first major surface and a second major surface, a second siloxane-based pressure sensitive adhesive layer with a first major surface and a second major surface, such that the first major surface of the second siloxane-based pressure sensitive adhesive layer is in contact with the second major surface of the first crosslinked pressure sensitive adhesive layer. The articles also include a release liner having a microstructured surface with an array of microstructures, where the microstructured surface is in contact with the second major surface of the second siloxane-based pressure sensitive adhesive layer. The microstructures of the microstructured surface of the second siloxane-based pressure sensitive adhesive layer are unstable when not in contact with the microstructured release liner, and disappear over time when in contact with a substrate.

公开(公告)号：US20170355492A1

公开(公告)日：2017-12-14

申请号：US15618943

申请日：2017-06-09

Applicant: Signode Industrial Group LLC

Inventor： Gurpreet Chhiber ,  Kevin A. Bruzzesi ,  Patricia Chidiac Maneri ,  Joseph E. Lininger ,  Tmothy B. Pearson

IPC: B65D33/20 ,  B65B27/12 ,  B65B7/02 ,  B65B51/02 ,  C09J7/02 ,  C09J5/04 ,  B65D33/22 ,  C09J131/04 ,  C09J109/06

CPC classification number: B65D33/20 ,  B65B7/02 ,  B65B7/04 ,  B65B27/125 ,  B65B51/02 ,  B65B51/062 ,  B65B51/07 ,  B65B51/146 ,  B65D31/10 ,  B65D33/22 ,  B65D85/07 ,  C09J7/30 ,  C09J109/06 ,  C09J131/04 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2409/00 ,  C09J2423/04 ,  C09J2433/00

Abstract: A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.

公开(公告)号：US20170354042A1

公开(公告)日：2017-12-07

申请号：US15539341

申请日：2015-12-21

Applicant: Senju Metal Industry Co., Ltd. ,  NITTA CORPORATION

Inventor： Kaichi Tsuruta ,  Takeo Saitoh ,  Manabu Muraoka ,  Hiroki Oshima ,  Koji Yamashita ,  Shinichiro Kawahara

IPC: H05K3/34 ,  H01L23/492 ,  H01L21/60 ,  C09J201/02 ,  C09J11/04 ,  C09J7/02

CPC classification number: H05K3/3457 ,  C08K3/10 ,  C09J7/30 ,  C09J11/04 ,  C09J201/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2467/006 ,  H01L23/4928 ,  H01L2021/60015 ,  H05K3/321 ,  H05K3/34 ,  H05K3/341 ,  H05K3/3478

Abstract: Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

公开(公告)号：US20170323701A1

公开(公告)日：2017-11-09

申请号：US15522162

申请日：2015-10-28

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU ,  Reiji TSUKAO

IPC: H01B5/16 ,  B32B27/08 ,  B32B7/12 ,  H01B1/22 ,  H05K3/32 ,  H01L23/00

CPC classification number: H01B5/16 ,  B32B7/12 ,  B32B27/08 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/294 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2924/07802 ,  H01R12/7076 ,  H01R13/2414 ,  H05K3/323 ,  H01L2924/00014

Abstract: The present invention provides an anisotropic electrically conductive film with a structure, in which electrically conductive particles are disposed at lattice points of a planar lattice pattern in an electrically insulating adhesive base layer. A proportion of the lattice points, at which no electrically conductive particle is disposed, with respect to all the lattice points of the planar lattice pattern assumed as a reference region, is less than 20%. A proportion of the lattice points, at which plural electrically conductive particles are disposed in an aggregated state, with respect to all the lattice points of the planar lattice pattern, is not greater than 15%. A sum of omission of the electrically conductive particle and an aggregation of the electrically conductive particles is less than 25%.

公开(公告)号：US20170275500A1

公开(公告)日：2017-09-28

申请号：US15619760

申请日：2017-06-12

Applicant: FIRESTONE BUILDING PRODUCTS CO., LLC

Inventor： Wensheng ZHOU ,  Michael J. HUBBARD ,  Joseph CARR

IPC: C09J7/02 ,  B32B25/10 ,  B32B9/00 ,  B32B15/06 ,  B32B25/18 ,  E04D5/10 ,  B32B27/08 ,  B32B27/18 ,  C08K7/24 ,  B32B25/08 ,  B32B27/30 ,  E04D5/14 ,  B32B27/12 ,  B32B15/08

CPC classification number: C08K7/24 ,  B32B5/16 ,  B32B9/007 ,  B32B9/045 ,  B32B15/06 ,  B32B15/08 ,  B32B25/047 ,  B32B25/08 ,  B32B25/10 ,  B32B25/18 ,  B32B27/08 ,  B32B27/12 ,  B32B27/14 ,  B32B27/18 ,  B32B27/302 ,  B32B37/24 ,  B32B2037/268 ,  B32B2264/108 ,  B32B2307/3065 ,  B32B2307/7242 ,  B32B2307/7246 ,  B32B2405/00 ,  B32B2419/06 ,  C08K3/04 ,  C09J1/00 ,  C09J7/20 ,  C09J7/21 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2400/10 ,  C09J2400/226 ,  C09J2400/263 ,  C09J2409/00 ,  C09J2453/00 ,  E04D5/10 ,  E04D5/148 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1476 ,  Y10T428/24802 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2835 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/30 ,  Y10T442/2648

Abstract: A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

公开(公告)号：US20170233610A1

公开(公告)日：2017-08-17

申请号：US15500355

申请日：2016-04-29

Applicant: LG CHEM, LTD.

Inventor： Hee Jung KIM ,  Se Ra KIM ,  Jung Hak KIM ,  Seung Hee NAM ,  Jung Ho JO ,  Kwang Joo LEE ,  Young Kook KIM

IPC: C09J7/00 ,  H01L23/00

CPC classification number: C09J7/00 ,  B32B7/06 ,  B32B7/12 ,  B32B15/08 ,  B32B15/082 ,  B32B15/085 ,  B32B15/09 ,  B32B27/06 ,  B32B27/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/51 ,  B32B2307/558 ,  B32B2307/58 ,  B32B2307/732 ,  B32B2405/00 ,  B32B2457/14 ,  B32B2553/00 ,  C08L63/00 ,  C09D163/00 ,  C09J7/10 ,  C09J7/20 ,  C09J161/12 ,  C09J163/00 ,  C09J163/04 ,  C09J201/00 ,  C09J2201/162 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2433/00 ,  C09J2433/006 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/005 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/00 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2924/066 ,  H01L2924/0665 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  C08L33/08

Abstract: The present invention relates to an adhesive film for a semiconductor that can more easily bury unevenness such as through wires of a semiconductor substrate or a wire attached to a semiconductor chip and the like, and yet can be applied to various cutting methods without specific limitations to realize excellent cuttability, thus improving reliability and efficiency of a semiconductor packaging process.

公开(公告)号：US20170226387A1

公开(公告)日：2017-08-10

申请号：US15515309

申请日：2015-10-26

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: C09J9/02 ,  H01B1/12 ,  H01B1/20 ,  C09J7/00

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2499/00 ,  H01B1/12 ,  H01B1/20 ,  H01L23/49827 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/13144 ,  H01L2224/27003 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29455 ,  H01L2224/32225 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/14

Abstract: An anisotropic conductive film with a structure wherein an electrically insulting adhesive base layer and cover layer are stacked, and electrically conductive particles are disposed at lattice points with a planar lattice pattern in the vicinity of the interface of the layers. In the anisotropic conductive film, a proportion of lattice points at which no electrically conductive particles are disposed with respect to all lattice points with the planar lattice pattern assumed in any reference region is 25% or less, and some of the electrically conductive particles disposed at lattice points with planar lattice pattern are disposed to be shifted in longitudinal direction of anisotropic conductive film with respect to corresponding lattice points, and a shift amount defined as a distance between a plane projection center of the electrically conductive particles disposed to be shifted and the corresponding lattice point is less than 50% the electrically conductive particles' average diameter.

公开(公告)号：US20170218239A1

公开(公告)日：2017-08-03

申请号：US15518581

申请日：2015-10-13

Applicant: Avery Dennison Corporation

Inventor： Susan M. RHODES ,  Michel RAVERS ,  Ingrid E. GEUENS ,  Qianchun LI

IPC: C09J183/04 ,  B32B7/12 ,  C09J7/02 ,  C09J5/10 ,  C09J9/02 ,  C09J11/04

CPC classification number: C09J183/04 ,  B32B7/12 ,  B32B2405/00 ,  C08K3/04 ,  C08K3/08 ,  C08K5/14 ,  C08K9/02 ,  C08K2003/0812 ,  C08K2201/001 ,  C08K2201/005 ,  C09J5/10 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2483/00

Abstract: Weldable adhesive compositions that dampen noise or vibration are described. In addition, various tape products that include the adhesive compositions are described. Also described are various methods of damping noise or vibration by use of the adhesive compositions and tapes. In addition, vibration damping assemblies utilizing the adhesives are described.

公开(公告)号：US09718992B2

公开(公告)日：2017-08-01

申请号：US14235542

申请日：2012-07-26

Applicant: Steffen Traser ,  Bernd Kuehneweg ,  Christian Claus ,  Jan D. Forster

Inventor： Steffen Traser ,  Bernd Kuehneweg ,  Christian Claus ,  Jan D. Forster

IPC: C09J7/02 ,  C09J5/08 ,  B32B37/24 ,  F03D1/06

CPC classification number: C09J7/02 ,  B32B37/24 ,  C09J5/08 ,  C09J7/20 ,  C09J7/385 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2475/006 ,  F03D1/0675 ,  Y02E10/721 ,  Y10T156/10 ,  Y10T428/24496 ,  Y10T428/24521 ,  Y10T428/24612

Abstract: A multilayer protective tape for rotor blades of wind energy turbines said tape having a protective top layer comprising a polymer film and an adhesive bottom layer, wherein the top layer has a continuous surface (S) that is outwardly curved or outwardly trapezoidal surface such that the tape has a cross-sectional profile having an inner section between two lateral sections and wherein the inner section has a thickness (Ti) made up by the thickness of the top layer and adhesive bottom layer that is greater than the thickness of at least one of the lateral sections (T1,T2) made up by the thickness of the top layer and adhesive bottom layer and wherein the thickness (T1 or T2) of at least one lateral section is at most 600 μm and the thickness of the inner section (Ti) is at least 330 μm. Also provided are processes for making profiled tapes and methods for applying the tapes to rotor blades and blades containing protective tapes.