Abstract:
Provided is a power conversion apparatus, including: a power module; a base section including a cooler; a second substrate; a first bus bar; a second bus bar; a smoothing capacitor; and a first substrate. The power module is placed on an upper surface of the base section. The first bus bar, the smoothing capacitor, and the first substrate are sequentially stacked on an upper side of the power module. The second substrate is arranged in an upright direction with respect to the base section and is fixed to the power module and the first substrate.
Abstract:
A signal line includes a first line portion at a first layer level and a second line portion at a second layer level, which are connected by a first interlayer connection. A first ground portion at the first layer level includes end portions closer to the first line portion than an intermediate portion, and a second ground portion at the second layer level includes end portions closer to the second line portion than an intermediate portion. A second interlayer connection connects one of the end portions of the first ground portion and one of the end portions of the second ground portion. A distance between the first and second interlayer connections is less than a distance between the first line portion and the intermediate portion of the first ground portion and is less than a distance between the second line portion and the intermediate portion of the second ground portion.
Abstract:
A hearing assistance device for a user comprising a housing, a three dimensional electronic substrate disposed in the housing, the substrate adapted to conform to a battery of the hearing assistance device and hearing assistance electronics mounted to the substrate.
Abstract:
A printed circuit board includes a base substrate, at least one through-hole in the base substrate, a connection tab extending through the through-hole, an electrical element on the base substrate and adjacent to the through-hole, and at least one groove portion in the base substrate and adjacent to the electrical element.
Abstract:
A method for manufacturing an integrated circuit may include forming an electronic circuit in or above a carrier; forming at least one metallization layer structure configured to electrically connect the electronic circuit; and forming a solid state electrolyte battery at least partially in the at least one metallization layer structure, wherein the solid state electrolyte battery is electrically connected to the electronic circuit.
Abstract:
A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.
Abstract:
There is provided a wiring board. The wiring board includes: a first insulating layer; a secondary battery on one surface of the first insulating layer; a second insulating layer formed on the secondary battery; a third insulating layer covering the second insulating layer; a first wiring layer on one surface of the third insulating layer; and a via electrically connecting the first wiring layer to an electrode of the secondary battery. A rigidity of the second insulating layer is lower than those of the first and third insulating layers.
Abstract:
A printed-circuit board to be fixed to a battery of accumulators includes a substrate comprising conductive tracks, a circuit for measuring voltage connected to the conductive tracks, and an electric interconnection element formed by a single piece, which is conductive and flexible, the interconnection element having a thickness of 0.3 mm to 1.5 mm. The interconnection element comprises a single portion fixed to the substrate by several force-fittings and electrically connected to one of the conductive tracks, and at least two portions overhanging the fixed portion and mobile relative to the substrate. The overhanging portions are formed at ends of a conductive strip disposed to be overhang the fixed portion. The conductive strip connects to the fixed portion by a junction that is narrower than the conductive strip.
Abstract:
A modular battery device may include a substantially planar dielectric substrate having a first major surface and a second major surface spaced from and opposite the first major surface. A plurality of conductive couplers may extend through the substrate from the first major surface to the second major surface at spaced locations. Each conductive coupler may have a first connector element disposed at the first major surface of the substrate electrically connected to an associated second connector element forming an extension extending from the second major surface of the substrate. The device may be selectively engageable with another such device by selectively mating the first connector element of a first conductive coupler on the device in mechanical and electrical engagement with the second connector element of a second conductive coupler on the other such device. Devices having batteries may be stacked to provide parallel and/or series connections.
Abstract:
A battery pack including a plurality of battery cells, each including an electrode terminal; and a circuit board assembly including: a first circuit board electrically connecting the electrode terminals of adjacent battery cells of the plurality of battery cells; a second circuit board electrically connected to the first circuit board; and a connection wire electrically connected between the second circuit board and the first circuit board.