公开(公告)号：US20110296679A1

公开(公告)日：2011-12-08

申请号：US13215653

申请日：2011-08-23

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H05K1/0366 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Abstract translation: 一种制造布线板的方法，包括形成第一布线板，第一板的形成包括形成基板，在基板的表面上形成第一绝缘层，在基板的相对表面上形成第二绝缘层，形成 在一个层中的通孔，并且在第一区域中切割第一层，并且在与第一区域偏移的第二区域中切割第二层，以形成层压到第二基板的第一基板，其中介于其间的基板，第二基板 具有比第一基板更小的安装面积，使得第一基板延伸超过第二基板的边缘，将柔性构件连接到基板，并且将构件连接到第二布线板以连接第一和第二板。 一个或多个绝缘层是非柔性层。

公开(公告)号：US20110252640A1

公开(公告)日：2011-10-20

申请号：US13166861

申请日：2011-06-23

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H01K3/10

CPC classification number: H05K3/4691 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/09536 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate.

Abstract translation: 一种制造布线板的方法，包括形成基底基板，在基底基板的第一表面上形成第一绝缘层，在与第一表面相对的第二表面上形成第二绝缘层，形成IVH（间隙通孔 ），其在第一区域中切割第一绝缘层，并且在与所述第一区域偏移的第二区域中切割第二绝缘层，以形成层压到第二基板上的第一基板，其中介于基板之间。 第二基板具有比第一基板的安装面积小的安装面积，使得第一基板延伸超过第二基板的边缘。

公开(公告)号：US08040685B2

公开(公告)日：2011-10-18

申请号：US12146032

申请日：2008-06-25

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/11

CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract translation: 布线基板及布线基板的形成方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

公开(公告)号：US20110198111A1

公开(公告)日：2011-08-18

申请号：US12948882

申请日：2010-11-18

Applicant: Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Nobuyuki Naganuma ,  Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/14 ,  C09J5/00

CPC classification number: H05K3/4691 ,  H05K2201/0715 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.

Abstract translation: 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。

公开(公告)号：US07982135B2

公开(公告)日：2011-07-19

申请号：US11927144

申请日：2007-10-29

Applicant: Michimasa Takahashi ,  Masakazu Aoyama

Inventor： Michimasa Takahashi ,  Masakazu Aoyama

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。

公开(公告)号：US07929313B2

公开(公告)日：2011-04-19

申请号：US12611231

申请日：2009-11-03

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K1/16

CPC classification number: H05K1/0218 ,  H01L23/49822 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2402 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/183 ,  H05K1/185 ,  H05K3/4652 ,  H05K2201/09981 ,  H05K2203/0733 ,  Y10T29/49155 ,  H01L2924/00

Abstract: In a method of manufacturing a multilayer printed circuit board, a first insulating resin base material is formed. A resin surface of a second insulating resin base material formed by attaching copper foil on a surface of a resin-insulating layer is unified with the first insulating resin base material. A conductor circuit is formed on the second insulating resin base material and a via hole electrically connecting to the conductor circuit. A concave portion is formed from a resin-insulating layer surface in a conductor circuit non-formation area of the first insulating resin base material. A semiconductor element is housed within the concave portion and adhered with an adhesive. A resin-insulating layer is formed by coating the semiconductor element and a via hole.

Abstract translation: 在制造多层印刷电路板的方法中，形成第一绝缘树脂基材。 通过将铜箔附着在树脂绝缘层的表面上形成的第二绝缘树脂基材的树脂表面与第一绝缘树脂基材一体化。 在第二绝缘树脂基材上形成导体电路，和与导体电路电连接的通孔。 在第一绝缘树脂基材的导体电路非形成区域中的树脂绝缘层表面形成凹部。 半导体元件容纳在凹部内并用粘合剂粘合。 通过涂覆半导体元件和通孔形成树脂绝缘层。

公开(公告)号：US07902463B2

公开(公告)日：2011-03-08

申请号：US11844788

申请日：2007-08-24

Applicant: Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

Inventor： Michimasa Takahashi ,  Yukinobu Mikado ,  Hiroyuki Yanagisawa

IPC: H05K1/00

CPC classification number: H05K1/167 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09736 ,  H05K2203/1453

Abstract: A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.

Abstract translation: 印刷电路板包括具有表面的绝缘层，嵌入在绝缘层中的电极，形成在绝缘层的表面上并电连接到电极的电阻器，以及形成在绝缘层表面上的外部连接导电图案 并电连接到一个或多个电极。 绝缘层和电极在绝缘层的表面上形成部件安装表面，部件安装表面与绝缘层的表面基本平齐，并且包括形成电阻器的电阻器形成区域，并且 外部连接导体图案与电阻器隔开一个空间。

公开(公告)号：US07718901B2

公开(公告)日：2010-05-18

申请号：US11923509

申请日：2007-10-24

Applicant: Michimasa Takahashi ,  Ian Timms

Inventor： Michimasa Takahashi ,  Ian Timms

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K3/4652 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/16227 ,  H01L2924/15153 ,  H01L2924/1533 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of insulating resin layers and/or between the base substrate and the plurality of insulating resin layers. At least one opening is formed in at least one of the plurality of insulating resin layers.

Abstract translation: 电子部件基板包括基底基板，设置在基底基板上的多个绝缘树脂层，至少一个导电电路和设置在多个绝缘树脂层中的至少一个填充通孔。 所述至少一个导电电路夹在所述多个绝缘树脂层之间和/或所述基底基板与所述多个绝缘树脂层之间。 至少一个开口形成在所述多个绝缘树脂层中的至少一个中。

公开(公告)号：US20100018634A1

公开(公告)日：2010-01-28

申请号：US12574309

申请日：2009-10-06

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a flex-rigid wiring board including disposing a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate and a non-flexible substrate adjacent to each other, covering a boundary between the flexible board and the non-flexible substrate with an insulating layer comprising an inorganic material, providing a conductor pattern on the insulating layer, forming a via hole opening which passes through the insulating layer and reaches the conductor pattern of the flexible board, and plating the via hole opening to form a via connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 一种挠性刚性布线板的制造方法，其特征在于，在柔性基板和柔性基板上形成的柔性基板和导体图案之间设置柔性基板，以及相互邻接的非柔性基板， 具有包含无机材料的绝缘层的柔性基板，在绝缘层上提供导体图案，形成穿过绝缘层并到达柔性板的导体图案的通孔开口，以及电镀通孔开口形成 通过连接柔性板的导体图案和绝缘层上的导体图案。

公开(公告)号：US20100000087A1

公开(公告)日：2010-01-07

申请号：US12555305

申请日：2009-09-08

Applicant: Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

Inventor： Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

IPC: H05K3/02

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。