公开(公告)号：US07618281B2

公开(公告)日：2009-11-17

申请号：US11669068

申请日：2007-01-30

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: G01R1/0466 ,  G01R1/06711 ,  G01R1/07307 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/67005 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01R12/57 ,  H01R12/714 ,  H01R12/853 ,  H01R13/2407 ,  H05K3/303 ,  H05K3/325 ,  H05K3/4092 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y10S439/948 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. Other aspects of the invention include methods of forming the stop structure and using the structure to perform testing of integrated circuits, including for example a semiconductor wafer of integrated circuits.

Abstract translation: 互连组件和形成和使用它们的方法。 在本发明的一个示例中，互连组件包括基板，弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置，其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中，止动结构设置在具有第一接触元件的第一基板上，该止动结构限定弹性接触元件的第一位置，该第一位置设置在第二基板上，弹性接触元件位于其中 与第一接触元件机械和电接触。 本发明的其他方面包括形成停止结构并使用该结构来执行集成电路的测试的方法，所述集成电路包括例如集成电路的半导体晶片。

公开(公告)号：US20090251162A1

公开(公告)日：2009-10-08

申请号：US12485677

申请日：2009-06-16

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Charles A. Miller ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: G01R1/0491 ,  G01R1/073 ,  G01R31/3025

Abstract: A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.

Abstract translation: 设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。 基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。 然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

公开(公告)号：US07579269B2

公开(公告)日：2009-08-25

申请号：US10821715

申请日：2004-04-08

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen

IPC: H01L21/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01H1/0036 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/45099 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/3011 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Abstract translation: 弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。 每个弹簧接触元件具有基端，接触端和中心主体部分。 接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。 以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。 弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。 在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

公开(公告)号：US20090160432A1

公开(公告)日：2009-06-25

申请号：US12396661

申请日：2009-03-03

Applicant: Benjamin N. Eldridge ,  Carl V. Reynolds ,  Nobuhiro Kawamata ,  Takao Saeki

Inventor： Benjamin N. Eldridge ,  Carl V. Reynolds ,  Nobuhiro Kawamata ,  Takao Saeki

IPC: G01R31/02

CPC classification number: G01R31/2889 ,  G01R31/31905

Abstract: A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.

Abstract translation: 探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括设置在特定构造中的探针，用于探测要测试的装置。 探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插件电连接到内部的电路径 探针卡组件是测试仪接口的一部分。 插入架可以从探针卡组件拆下。 探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。 探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。

公开(公告)号：US07463043B2

公开(公告)日：2008-12-09

申请号：US11748988

申请日：2007-05-15

Applicant: Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2886 ,  G01R31/2887

Abstract: An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.

Abstract translation: 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

公开(公告)号：US07385411B2

公开(公告)日：2008-06-10

申请号：US10930272

申请日：2004-08-31

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: G01R1/07364 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49117

Abstract: A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the sum of the additional compliance and the compliance of the probes total the overall desired compliance of the probe card apparatus.

Abstract translation: 探针卡装置被配置为具有期望的总体顺应性。 确定探针卡装置的探针的符合性，并且将另外的预定量的顺应性设计到探针卡装置中，使得附加顺应性和探针的顺应性的总和达到探针的总体期望顺应性 卡装置。

公开(公告)号：US20080120833A1

公开(公告)日：2008-05-29

申请号：US12026466

申请日：2008-02-05

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge

IPC: H01R43/16 ,  H05K3/10

CPC classification number: H01L21/4853 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06761 ,  G01R3/00 ,  H01L24/71 ,  H01L2224/11 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An interconnection element and a-method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

Abstract translation: 一种形成互连元件的互连元件和方法。 在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。 与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。 在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。 在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连） 互连）结构以形成互连元件。 总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。

公开(公告)号：US07371072B2

公开(公告)日：2008-05-13

申请号：US10750355

申请日：2003-12-29

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Richard A. Larder

IPC: H01R12/00

CPC classification number: H01L24/72 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06761 ,  G01R1/07342 ,  G01R3/00 ,  H01H1/0036 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/30105 ,  H05K3/326 ,  H05K3/4092 ,  H01L2924/00

Abstract: An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.

Abstract translation: 包括具有第一接触区域和第二接触区域的第一弹性元件和具有第三接触区域和第二固定区域的第一固定区域和第二弹性元件的弹簧（主体）的互连元件。 第二弹性元件通过相应的固定区域联接到第一弹性元件，并且定位成使得在第一接触区域朝着第二弹性元件充分移位时，第二接触区域将接触第三接触区域。 在一个方面，互连具有适于直接接触半导体器件的尺寸。 可以使用具有多个这种互连元件的大型衬底作为晶片级接触器。 在另一方面，互连元件的尺寸适合于例如LGA封装中的封装半导体器件的接触。

公开(公告)号：US07352196B2

公开(公告)日：2008-04-01

申请号：US11423808

申请日：2006-06-13

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US07312618B2

公开(公告)日：2007-12-25

申请号：US11428423

申请日：2006-07-03

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

Abstract: A method and system for compensating for thermally induced motion of probe cards used in testing die on a wafer are disclosed. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced movement of the probe card is disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract translation: 公开了一种用于补偿在晶片上测试模具中使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 公开了用于允许探针卡的径向膨胀以防止热诱导的探针卡的移动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。