公开(公告)号：US20120088362A1

公开(公告)日：2012-04-12

申请号：US12901273

申请日：2010-10-08

申请人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

IPC分类号： H01L21/768

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/75302 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.

摘要翻译： 一种方法包括允许具有焊料凸点的工件接触焊接头; 加热粘结头，直到焊料凸起熔化; 并将冷却介质导入接合头以冷却焊料凸点并固化焊料凸块。

公开(公告)号：US20120049346A1

公开(公告)日：2012-03-01

申请号：US12871565

申请日：2010-08-30

申请人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

发明人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L21/02052 ,  H01L21/32125 ,  H01L21/76873 ,  H01L21/76885 ,  H01L23/488 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/1084 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/1111 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11614 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/11912 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0541 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/20102 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/207

摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。

公开(公告)号：US20120007230A1

公开(公告)日：2012-01-12

申请号：US12832168

申请日：2010-07-08

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Zheng-Yi Lim ,  Yi-Yang Lei ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Zheng-Yi Lim ,  Yi-Yang Lei ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： H01L23/498 ,  H01L21/3205

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0361 ,  H01L2224/03831 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11622 ,  H01L2224/11831 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/1146

摘要： An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.

摘要翻译： 本公开的实施例包括半导体管芯上的导电凸块。 提供基板。 焊盘在衬底上。 凸块下金属（UBM）层位于焊盘上方。 铜柱在UBM层之上。 铜柱具有第一宽度的顶表面和具有凹形的侧壁。 具有顶表面和底表面的镍层在铜柱的顶表面之上。 镍层的底面具有第二宽度。 第二宽度与第一宽度的比率在约0.93至约1.07之间。 焊料材料在盖层的顶表面之上。

公开(公告)号：US08258055B2

公开(公告)日：2012-09-04

申请号：US12832168

申请日：2010-07-08

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Zheng-Yi Lim ,  Yi-Yang Lei ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Zheng-Yi Lim ,  Yi-Yang Lei ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： H01L21/44

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03464 ,  H01L2224/0361 ,  H01L2224/03831 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11622 ,  H01L2224/11831 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2224/1146

摘要： An embodiment of the disclosure includes a conductive bump on a semiconductor die. A substrate is provided. A bond pad is over the substrate. An under bump metallurgy (UBM) layer is over the bond pad. A copper pillar is over the UBM layer. The copper pillar has a top surface with a first width and sidewalls with a concave shape. A nickel layer having a top surface and a bottom surface is over the top surface of the copper pillar. The bottom surface of the nickel layer has a second width. A ratio of the second width to the first width is between about 0.93 to about 1.07. A solder material is over the top surface of the cap layer.

摘要翻译： 本公开的实施例包括半导体管芯上的导电凸块。 提供基板。 焊盘在衬底上。 凸块下金属（UBM）层位于焊盘上方。 铜柱在UBM层之上。 铜柱具有第一宽度的顶表面和具有凹形的侧壁。 具有顶表面和底表面的镍层在铜柱的顶表面之上。 镍层的底面具有第二宽度。 第二宽度与第一宽度的比率在约0.93至约1.07之间。 焊料材料在盖层的顶表面之上。

公开(公告)号：US08823166B2

公开(公告)日：2014-09-02

申请号：US12871565

申请日：2010-08-30

申请人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

发明人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L21/02052 ,  H01L21/32125 ,  H01L21/76873 ,  H01L21/76885 ,  H01L23/488 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/1084 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/1111 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11614 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/11912 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0541 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/20102 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/207

摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。

公开(公告)号：US08317077B2

公开(公告)日：2012-11-27

申请号：US13351099

申请日：2012-01-16

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0012 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/95 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75755 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00

摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

公开(公告)号：US08177862B2

公开(公告)日：2012-05-15

申请号：US12901273

申请日：2010-10-08

申请人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Cheng-Chung Lin ,  Ying-Jui Huang ,  Chung-Shi Liu

IPC分类号： H01L21/58

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/75302 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method includes allowing a work piece having a solder bump to contact a bond head; heating the bond head until the solder bump is melted; and conducting a cooling media into the bond head to cool the solder bump and to solidify the solder bump.

摘要翻译： 一种方法包括允许具有焊料凸点的工件接触焊接头; 加热粘结头，直到焊料凸起熔化; 并将冷却介质导入接合头以冷却焊料凸点并固化焊料凸块。

公开(公告)号：US20120111922A1

公开(公告)日：2012-05-10

申请号：US13351099

申请日：2012-01-16

申请人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Ying-Jui Huang ,  Cheng-Chung Lin ,  Chung-Shi Liu

IPC分类号： B23K3/04 ,  B23K3/08

CPC分类号： H01L24/81 ,  B23K1/0012 ,  B23K1/203 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/95 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75755 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/814 ,  H01L2224/81907 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/00

摘要： A method of bonding includes providing a first work piece, and attaching a second work piece on the first work piece, with a solder bump disposed between the first and the second work pieces. The second work piece is heated using a heating head of a heating tool to melt the solder bump. After the step of heating the second work piece, one of the first and the second work pieces is allowed to move freely in a horizontal direction to self-align the first and the second work pieces. After the step of allowing one of the first and the second work pieces to move, a temperature of the heating head is lowed until the first solder bump solidifies to form a second solder bump.

摘要翻译： 一种接合方法包括提供第一工件，并且将第二工件附接在第一工件上，其中焊料凸块设置在第一和第二工件之间。 使用加热工具的加热头加热第二工件以熔化焊料凸块。 在加热第二工件的步骤之后，允许第一工件和第二工件中的一个在水平方向上自由移动以使第一工件和第二工件自对准。 在允许第一和第二工件中的一个移动的步骤之后，加热头的温度降低直到第一焊料凸点固化以形成第二焊料凸块。

公开(公告)号：US08679591B2

公开(公告)日：2014-03-25

申请号：US12891487

申请日：2010-09-27

申请人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

发明人： Chien Ling Hwang ,  Yi-Li Hsiao ,  Chung-Shi Liu

IPC分类号： B05D1/18

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： An embodiment is a method for forming a semiconductor assembly including cleaning a connector including copper formed on a substrate, applying cold tin to the connector, applying hot tin to the connector, and spin rinsing and drying the connector.

摘要翻译： 一个实施例是一种用于形成半导体组件的方法，包括清洁在基板上形成的铜的连接器，向连接器施加冷锡，向连接器施加热锡，并旋转冲洗和干燥连接器。

公开(公告)号：US20130167373A1

公开(公告)日：2013-07-04

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B26D7/27 ,  H01R43/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.