公开(公告)号：US20120094439A1

公开(公告)日：2012-04-19

申请号：US13377109

申请日：2010-06-14

Applicant: Christian Val

Inventor： Christian Val

IPC: H01L21/78

CPC classification number: H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00

Abstract: A method for fabricating a re-built wafer which comprises chips having connection pads, comprising: fabricating a first wafer of chips, production on this wafer of a stack of at least one layer of redistribution of the pads of the chips on conductive tracks designed for the interconnection of the chips, this stack being designated the main RDL layer, cutting this wafer in order to obtain individual chips each furnished with their RDL layer, transferring the individual chips with their RDL layer to a sufficiently rigid support to remain flat during the following steps, which support is furnished with an adhesive layer, with the RDL layer on the adhesive layer, depositing a resin in order to encapsulate the chips, polymerizing the resin, removing the rigid support, depositing a single redistribution layer called a mini RDL in order to connect the conductive tracks of the main RDL layer up to interconnection contacts, through apertures made in the adhesive layer, the wafer comprising the polymerized resin, the chips with their RDL layer and the mini RDL being the re-built wafer.

Abstract translation: 一种用于制造重构晶片的方法，其包括具有连接焊盘的芯片，包括：制造芯片的第一晶片，在所述晶片上制造堆叠的至少一层芯片焊盘重新分布的导电轨道 芯片的互连，该堆叠被指定为主RDL层，切割该晶片以获得各自配备有RDL层的各个芯片，将具有RDL层的各个芯片传递到足够刚性的支撑件，以在下列过程中保持平坦 步骤，该支撑件配备有粘合剂层，RDL层在粘合剂层上，沉积树脂以封装芯片，聚合树脂，去除刚性载体，按顺序沉积单个再分布层，称为小型RDL 将主RDL层的导电轨道连接到互连触点，通过在粘合剂层中制成的孔，晶片包括 聚合树脂，具有RDL层的芯片和小型RDL是重新构建的晶片。

公开(公告)号：US20050012188A1

公开(公告)日：2005-01-20

申请号：US10494421

申请日：2002-10-15

Applicant: Christian Val

Inventor： Christian Val

IPC: G02B6/42 ,  B81B7/00 ,  B81B7/02 ,  H01L23/10 ,  H01L23/31 ,  H01L23/34 ,  H01L31/0203 ,  H01L31/024 ,  H01L23/02

CPC classification number: B81B7/0041 ,  B81B7/007 ,  G02B6/4201 ,  G02B6/4248 ,  G02B6/4251 ,  H01L23/10 ,  H01L23/315 ,  H01L23/34 ,  H01L31/0203 ,  H01L31/024 ,  H01L2224/16 ,  H01L2924/01057 ,  H01L2924/16152

Abstract: The invention relates to a device for the hermetic encapsulation of a component that has to be protected from any stress. The component (5) is fastened to a substrate (15) that carries, on its other face, a temperature-regulating element (17) fastened by adhesive bonding (16). This assembly is placed in a package comprising two portions (11, 12) joined together by adhesive bonding (13) with a passage for optical links (6) and for electrical connections (18, 142). It is supported by protuberances (19) of one portion (11) of the package. Bonded to the other portion (12) is a three-dimensional interconnection block (14) forming the temperature-regulating electronics. The block, the package (11, 12) and a minimum length (L) of the links and connections are encapsulated in a mineral protective layer (4′). The invention applies especially to optoelectronic components and to MEMS components.

Abstract translation: 本发明涉及一种用于密封封装组件的装置，该装置必须被保护以免受任何压力。 组件（5）固定在基板（15）上，该基板在另一面上承载通过粘接（16）固定的温度调节元件（17）。 该组件被放置在包括两个部分（11,12）的包装中，该两个部分（11,12）通过粘合剂接合（13）与光学连接件（6）和电连接（18,142）的通道相连。 它由包装的一部分（11）的突起（19）支撑。 结合到另一部分（12）的是形成温度调节电子器件的三维互连块（14）。 该块，包装（11,12）和连接件和连接件的最小长度（L）封装在矿物保护层（4'）中。 本发明特别适用于光电子部件和MEMS部件。

公开(公告)号：US4654694A

公开(公告)日：1987-03-31

申请号：US634433

申请日：1984-07-26

Applicant: Christian Val

Inventor： Christian Val

IPC: H01G4/40 ,  H01L23/64 ,  H01L23/02

CPC classification number: H01L23/642 ,  H01L2224/45184 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: An electronic box having a capacitor in the form of a supporting plate bearing a component and covered by a cap. Additionally, the box includes a capacitor connected onto the supporting plate in such a way as to be situated between the component and the cap.

Abstract translation: 一种电子盒，其具有支撑板形式的电容器，该支撑板承载部件并被帽覆盖。 此外，盒子包括连接到支撑板上的电容器，以便位于部件和盖子之间。

公开(公告)号：US4639826A

公开(公告)日：1987-01-27

申请号：US613905

申请日：1984-05-24

Applicant: Christian Val ,  Joseph Pinel ,  Yves B. Gibod

Inventor： Christian Val ,  Joseph Pinel ,  Yves B. Gibod

IPC: H05K9/00 ,  H01L23/02 ,  H01L23/057 ,  H01L23/06 ,  H01L23/552 ,  H01L23/64 ,  H05K5/06 ,  B65D73/02 ,  H01G1/06

CPC classification number: H01L23/552 ,  H01L23/057 ,  H01L23/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3025 ,  Y10S257/916

Abstract: A casing for protecting electronic components or circuits against ionizing radiations, comprising an alternance of layers of materials having low and high atomic charge numbers, forming a multi-layer capacitor, and a base comprising an alternation of the same type.

Abstract translation: 一种用于保护电子元件或电路免受电离辐射的外壳，包括具有低和高原子电荷数的材料的交替层，形成多层电容器，以及包括相同类型的交替的基座。

公开(公告)号：US4413170A

公开(公告)日：1983-11-01

申请号：US274376

申请日：1981-06-17

Applicant: Christian Val ,  Didier Pribat

Inventor： Christian Val ,  Didier Pribat

IPC: B41J2/335 ,  H05B1/00

CPC classification number: B41J2/33515 ,  B41J2/33535 ,  B41J2/3355 ,  B41J2/3357

Abstract: An electrical heating resistor of the type deposited on a substrate plate constituting the basis element of a thermal printing head. In order to concentrate the heat given off in the free surface of said heating resistor towards the paper to print, the invention provides for the deposition on the substrate of at least one layer having a relatively constant resistivity and then at least one surface layer with a non-linear resistivity and a negative temperature coefficient. Starting from a high value when cold, the resistance of the surface layer drops abruptly as soon as it reaches the triggering temperature, thus switching the heat resistor by command of a control circuit.

Abstract translation: 一种沉积在构成热敏打印头的基础元件的基板上的类型的电加热电阻器。 为了将发热电阻器的自由表面放出的热量集中到要印刷的纸张上，本发明提供了至少一层具有相对恒定电阻率的衬底上的沉积，然后提供至少一个具有 非线性电阻率和负温度系数。 冷时由高值开始，一旦达到触发温度，表层的电阻就会急剧下降，从而通过控制电路的命令切换热电阻。

公开(公告)号：US20140349008A1

公开(公告)日：2014-11-27

申请号：US14115853

申请日：2012-05-04

Applicant: Christian Val

Inventor： Christian Val

IPC: H01G4/224

CPC classification number: H01G4/224 ,  B05D1/02 ,  B05D5/10 ,  C23C14/08 ,  C23C16/01 ,  C23C16/402 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/18 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68368 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/181 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2224/82

Abstract: A method for collectively fabricating a reconstituted wafer comprising chips exhibiting connection pads on a front face of the chip, comprises: positioning the chips on an initial adhesive support, front face on the support, vapor deposition at atmospheric pressure and ambient temperature, of an electrically insulating layer on the initial support and the chips, having a mechanical role of holding the chips, transfer of the chips covered with the mineral layer onto a provisional adhesive support, rear face of the chips toward this provisional adhesive support, removal of the initial adhesive support, overlaying the chips onto a support of “chuck” type, front faces of the chips toward this support, removal of the provisional adhesive support, deposition of a resin on the support of “chuck” type to encapsulate the chips, and then polymerization of the resin, removal of the support of “chuck” type, production of an RDL layer active face side.

Abstract translation: 一种用于共同制造重构的晶片的方法，其包括在芯片的前表面上显示连接焊盘的芯片，包括：将芯片定位在初始粘合剂支撑体上，支撑体上的正面，大气压和环境温度下的气相沉积 在初始支撑体上的绝缘层和芯片，具有保持芯片的机械作用，将由矿物层覆盖的芯片转移到临时粘合剂支撑体上，将芯片的后表面朝向该临时粘合剂支撑件移除，初始粘合剂的去除 支撑，将芯片叠加到“卡盘”型的支撑件上，朝向该支撑件的芯片的前表面，去除临时粘合剂支撑件，将树脂沉积在“卡盘”型支撑件上以封装芯片，然后聚合 的树脂，去除“卡盘”型的支撑，生产RDL层有源面。

公开(公告)号：US20080316727A1

公开(公告)日：2008-12-25

申请号：US12095157

申请日：2006-11-30

Applicant: Christian Val ,  Olivier Lignier

Inventor： Christian Val ,  Olivier Lignier

IPC: H05K1/14

CPC classification number: H05K1/144 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/19041 ,  H01L2924/3512 ,  H05K1/185

Abstract: The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, traversing the thickness of the slice. The second slice (30) comprises at least one electrically conductive element (3) traversing said slice in a zone (61) of electrically insulating material, able to receive a set (4) of protrusions (41) of the first slice (10).

Abstract translation: 本发明涉及一种3D电子模块，其包括至少第一切片（10）和第二切片（30）的堆叠（100），所述第一切片（10）在面部（101）上具有至少一组 ），并且所述第二切片（30）包括穿过所述切片的厚度的至少一个电绝缘材料区（61）。 第二切片（30）包括穿过电绝缘材料区域（61）中的所述切片的至少一个导电元件（3），能够接收第一切片（10）的一组（4）突起（41） 。

公开(公告)号：US20070262443A1

公开(公告)日：2007-11-15

申请号：US11575751

申请日：2005-09-07

Applicant: Christian Val ,  Olivier Lignier ,  Regis Bocage

Inventor： Christian Val ,  Olivier Lignier ,  Regis Bocage

IPC: H01L23/34

CPC classification number: H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4641 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2203/165 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to an electronic device incorporating a heat distributor. It applies more particularly to devices of the plastic package type, with one or more levels of components. According to the invention, the electronic device, for example of the package type, is provided for its external connection with pads distributed over a connection surface. It includes a thermally conducting plate lying parallel to said connection surface and having a nonuniform structure making it possible, when the device is exposed to a given external temperature, to supply a controlled amount of heat to each external connection pad according to its position on the connection surface. If the device is a package comprising a support of the printed circuit type, the conducting plate will advantageously form an internal layer of said support.

Abstract translation: 本发明涉及一种并入热分配器的电子设备。 它更具体地应用于塑料封装类型的器件，具有一个或多个级别的部件。 根据本发明，提供了例如封装类型的电子设备，用于其与分布在连接表面上的焊盘的外部连接。 它包括平行于所述连接表面并且具有不均匀结构的导热板，使得当设备暴露于给定的外部温度时，可以根据其在位置上的位置向每个外部连接垫提供受控量的热量 连接面。 如果设备是包括印刷电路类型的支撑体的封装，导电板将有利地形成所述支撑件的内层。

公开(公告)号：US20070117369A1

公开(公告)日：2007-05-24

申请号：US10562685

申请日：2004-06-30

Applicant: Christian Val ,  Olivier Lignier

Inventor： Christian Val ,  Olivier Lignier

IPC: H01L21/00 ,  H01L29/82 ,  H01L21/4763

CPC classification number: H01L24/85 ,  H01G4/228 ,  H01G4/40 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The present invention relates to a method for the thin interconnection of active and passive components in two or three dimensions, and to the resulting thin heterogeneous components. According to the invention, the method comprises: positioning and fixing (11) at least one active component and one passive component on a flat support (23), the terminals being in contact with the support, depositing (12) a polymer layer (24) on all of the support and said components, removing the support (14), redistributing the terminals (15) between the components and/or toward the periphery by means of metal conductors (26) arranged in a predetermined layout, making it possible to obtain a heterogeneous reconstituted structure, heterogeneously thinning (16) said structure by nonselective surface treatment of the polymer layer and at least one passive component (22).

Abstract translation: 本发明涉及一种用于两个或三个维度的主动和被动部件的薄互连以及由此产生的薄异质部件的方法。 根据本发明，所述方法包括：在平坦支撑件（23）上定位和固定（11）至少一个有源部件和一个无源部件，所述端子与所述支撑件接触，沉积（12）聚合物层（24） ）在所有支撑件和所述部件上，通过以预定布置布置的金属导体（26）去除支撑件（14），将端子（15）重新分配在部件之间和/或朝向周边，使得可以 通过聚合物层和至少一个无源部件（22）的非选择性表面处理，获得非均匀重构的结构，使所述结构非均匀地稀化（16）。

公开(公告)号：US5885850A

公开(公告)日：1999-03-23

申请号：US146099

申请日：1993-11-10

Applicant: Christian Val

Inventor： Christian Val

IPC: H01L23/28 ,  H01L21/48 ,  H01L23/433 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K1/18 ,  H01L21/56 ,  H01L21/60 ,  H01L21/70

CPC classification number: H05K1/185 ,  H01L21/4853 ,  H01L23/4334 ,  H01L24/97 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/1094 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/09118 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/1469

Abstract: A method for the interconnection of stacked packages encapsulating, for example, a semiconductor chip containing an integrated circuit, for example a memory. Packages with connection pins (21) are stacked and fixedly joined to each other by means of a coating of resin for example. The pins of the packages are cut so as to be flush with the faces (31, 32) of the stack (3). The connection (C) of the packages with one another and their connection to connection pads (35) of the stack is done on the faces of the stack. The connection pads are, if necessary, provided with connection pins (36).

Abstract translation: PCT No.PCT / FR93 / 00239 Sec。 371日期：1993年11月10日 102（e）日期1993年11月10日PCT 1993年3月10日PCT公布。 公开号WO93 / 18549 日期1993年9月16日一种用于封装例如包含集成电路的半导体芯片（例如存储器）的堆叠封装的互连方法。 具有连接销（21）的包装通过例如树脂涂层彼此堆叠并彼此固定。 包装件的销被切割成与堆叠（3）的表面（31,32）齐平。 封装的连接（C）彼此之间的连接以及它们与堆叠的连接焊盘（35）的连接在堆叠的表面上完成。 如果需要，连接焊盘设置有连接引脚（36）。