公开(公告)号：US20170372820A1

公开(公告)日：2017-12-28

申请号：US15548338

申请日：2016-11-04

Applicant: EPCOS AG

Inventor： Uwe Wozniak ,  Thomas Feichtinger

IPC: H01C7/112 ,  C04B35/453 ,  H01C17/00 ,  C04B37/02

CPC classification number: H01C7/112 ,  B32B18/00 ,  C04B35/453 ,  C04B37/021 ,  C04B37/023 ,  C04B2235/3217 ,  C04B2235/3241 ,  C04B2235/3265 ,  C04B2235/3277 ,  C04B2235/3279 ,  C04B2235/3284 ,  C04B2235/3291 ,  C04B2235/3294 ,  C04B2235/3298 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2237/34 ,  C04B2237/408 ,  C04B2237/60 ,  H01C1/148 ,  H01C7/1006 ,  H01C7/102 ,  H01C7/108 ,  H01C7/18 ,  H01C17/00 ,  H01C17/06533 ,  H01C17/283

Abstract: A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.

公开(公告)号：US20170309802A1

公开(公告)日：2017-10-26

申请号：US15508361

申请日：2015-08-05

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/60 ,  H01L25/16 ,  H01L23/34

CPC classification number: H01L33/62 ,  H01L21/0254 ,  H01L23/34 ,  H01L23/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/48 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light-emitting diode device is specified, comprising at least one carrier and a light-emitting diode arranged thereon. The carrier comprises a plurality of polymer layers arranged one above another. At least one polymer layer has a cutout, in which an electrical component is embedded.

公开(公告)号：US20170236634A1

公开(公告)日：2017-08-17

申请号：US15358702

申请日：2016-11-22

Applicant: EPCOS AG

Inventor： Christian Block ,  Pavol Dudesek ,  Thomas Feichtinger ,  Christian Hoffmann ,  Guenter Pudmich

IPC: H01F27/28 ,  H01G4/012 ,  H01G4/228 ,  H01G4/30 ,  H01F27/29 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32 ,  H01C1/14 ,  H01C17/06 ,  H01C7/00 ,  H01C7/10 ,  B32B18/00 ,  B32B37/18 ,  B32B37/06 ,  B32B38/00 ,  H01G4/12

CPC classification number: H01F27/2804 ,  B32B18/00 ,  B32B37/06 ,  B32B37/18 ,  B32B38/0036 ,  B32B38/145 ,  B32B2255/205 ,  B32B2264/101 ,  B32B2264/107 ,  B32B2264/12 ,  B32B2305/77 ,  B32B2305/80 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/704 ,  B32B2457/16 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/366 ,  C04B2237/564 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01C1/14 ,  H01C7/008 ,  H01C7/10 ,  H01C7/18 ,  H01C17/06 ,  H01F10/20 ,  H01F10/265 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/32 ,  H01F41/041 ,  H01F41/12 ,  H01F2027/2809 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/552 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H2001/0085 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  Y10T428/265 ,  H01L2924/00

Abstract: A film stack made from compacted green films and capable of being sintered to form a ceramic component with monolithic multi-layer structure is disclosed. The film stack includes a functional layer comprising a green film comprising a functional ceramic and a tension layer comprising a green film comprising a dielectric material. The tension layer is directly adjacent to the functional layer in the multi-layer structure. The multilayer structure also includes a first metallization plane and second metallization plane. The functional layer is between the first metallization plane and the second metallization plane.

公开(公告)号：US20150351258A1

公开(公告)日：2015-12-03

申请号：US14654436

申请日：2013-11-26

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Axel Pecina ,  Stefan Obermair ,  Werner Tschnuchnig

IPC: H05K3/46 ,  B32B37/06 ,  B32B15/04 ,  B32B37/10

CPC classification number: H05K3/4611 ,  B32B15/04 ,  B32B37/06 ,  B32B37/10 ,  B32B2305/80 ,  B32B2457/08 ,  B32B2457/14 ,  H01L21/4867 ,  H01L23/15 ,  H01L23/3677 ,  H01L33/642 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/16 ,  H05K3/4629 ,  Y10T156/10 ,  Y10T428/24851 ,  H01L2924/00

Abstract: A method for producing a multilayer carrier body is disclosed. A method for producing a multilayer carrier body. The method includes producing films by printing a first area of each film with a first paste and printing a second area of the film with a second paste. The method also includes stacking the films and laminating the films.

Abstract translation: 公开了一种多层载体的制造方法。 一种多层载体的制造方法。 该方法包括通过用第一浆料印刷每个薄膜的第一区域并用第二浆料印刷薄膜的第二区域来制造薄膜。 该方法还包括层叠薄膜并层压薄膜。

公开(公告)号：US20150342027A1

公开(公告)日：2015-11-26

申请号：US14654369

申请日：2013-12-12

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Axel Pecina

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H01L33/64

CPC classification number: H05K1/0204 ,  H01L33/642 ,  H01L2924/0002 ,  H05K1/0207 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y10T156/10 ,  H01L2924/00

Abstract: A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region.

Abstract translation: 分量载体包括具有包含结构化功能的基底的多层载体体。 衬底横向地并且还至少部分地在功能区域的上方和下方延伸。 或者，或者另外，衬底在功能区域的横向和完全上方和/或下方延伸。 或者或另外，衬底或另外的区域布置在功能区域中或延伸到功能区域中。

公开(公告)号：US10262778B2

公开(公告)日：2019-04-16

申请号：US15548338

申请日：2016-11-04

Applicant: EPCOS AG

Inventor： Uwe Wozniak ,  Thomas Feichtinger

IPC: H01C7/10 ,  H01C7/112 ,  H01C1/148 ,  H01C7/108 ,  H01C7/18 ,  H01C17/065 ,  H01C17/28 ,  C04B35/453 ,  C04B37/02 ,  H01C17/00 ,  B32B18/00 ,  H01C7/102

Abstract: A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.

公开(公告)号：US20170290164A1

公开(公告)日：2017-10-05

申请号：US15508224

申请日：2015-08-31

Applicant: EPCOS AG

Inventor： Thomas Feichtinger

IPC: H05K1/18 ,  H01C7/10 ,  H01C1/14 ,  H05K1/11 ,  H01G4/248 ,  H01C17/00 ,  H01G4/005 ,  H01G4/12 ,  H05K3/32 ,  H01C7/00 ,  H05K1/09

Abstract: An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

公开(公告)号：US20170229617A1

公开(公告)日：2017-08-10

申请号：US15501162

申请日：2015-08-07

Applicant: EPCOS AG

Inventor： Thomas Feichtinger

IPC: H01L33/48 ,  H01L33/64 ,  H01C7/12 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01C7/12 ,  H01L23/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644

Abstract: A carrier for an LED is disclosed. In an embodiment, the carrier includes a main body, wherein the carrier has an upper side on which a first contact area for attaching an LED is arranged, and wherein a protective device for protecting the LED from electrostatic discharges is integrated in the main body.

公开(公告)号：US09337408B2

公开(公告)日：2016-05-10

申请号：US14422673

申请日：2013-07-22

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。

公开(公告)号：US09209619B2

公开(公告)日：2015-12-08

申请号：US14351051

申请日：2012-10-26

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek

IPC: H01L33/64 ,  H01L33/62 ,  H01L23/00 ,  H02H9/04 ,  H01C7/12 ,  H01L25/16 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62

CPC classification number: H02H9/04 ,  H01C7/12 ,  H01L23/28 ,  H01L23/60 ,  H01L23/62 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16

Abstract: An ESD protection component includes a ceramic material and a BGA or LGA termination. In addition, an ESD protection component includes a basic body with a lower side. The basic body includes a ceramic material. At least one floating inner electrode is located at a distance from the lower side of two to 100 ceramic grains. Also a component includes a carrier, on which an LED and an ESD protection component are arranged.

Abstract translation: ESD保护组件包括陶瓷材料和BGA或LGA终端。 此外，ESD保护部件包括具有下侧的基体。 基体包括陶瓷材料。 至少一个浮动内部电极位于距离两个至100个陶瓷颗粒的下侧一定距离处。 而且，组件还包括载体，LED和ESD保护组件布置在该载体上。