公开(公告)号：US06268077B1

公开(公告)日：2001-07-31

申请号：US09260097

申请日：1999-03-01

申请人： Ronald J. Kelley ,  Steven D. Pratt ,  Bobby Dean Landreth ,  Robert W. Pennisi ,  Sivakumar Muthuswamy ,  Glenn F. Urbish

发明人： Ronald J. Kelley ,  Steven D. Pratt ,  Bobby Dean Landreth ,  Robert W. Pennisi ,  Sivakumar Muthuswamy ,  Glenn F. Urbish

IPC分类号： H01M810

CPC分类号： H01M8/04761 ,  H01M8/04089 ,  H01M8/065 ,  H01M8/1007 ,  H01M8/247

摘要： The invention provides a device for generating energy, utilizing a fuel cell. Air is freely guided to the fuel cell, while a fuel gas is provided to the fuel cell from a pressurized fuel supply via a regulator. The portable power supply is most applicable to use with handheld electric devices, and contains a fuel storage means (110) for storing a supply of fuel, a fuel delivery means (120) connected to the fuel storage means, an energy conversion device (140) connected to the fuel delivery means for converting the fuel to electricity. The fuel storage means, the fuel delivery means, and the energy conversion device are all contained in a volume less than 500 cubic centimeters.

摘要翻译： 本发明提供一种利用燃料电池产生能量的装置。 空气被自由地引导到燃料电池，同时燃料气体通过调节器从加压燃料供给到燃料电池。 便携式电源最适用于手持式电气设备，并且包括用于存储燃料供应的燃料储存装置（110），连接到燃料存储装置的燃料输送装置（120），能量转换装置（140） ）连接到用于将燃料转换成电力的燃料输送装置。 燃料储存装置，燃料输送装置和能量转换装置都包含在小于500立方厘米的容积中。

公开(公告)号：US5136365A

公开(公告)日：1992-08-04

申请号：US588889

申请日：1990-09-27

申请人： Robert W. Pennisi ,  Marc V. Papageorge ,  Glenn F. Urbish

发明人： Robert W. Pennisi ,  Marc V. Papageorge ,  Glenn F. Urbish

IPC分类号： B23K35/22 ,  B23K35/363 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J167/00 ,  H01B1/22 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/81 ,  H05K3/323 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/2932 ,  H01L2224/29339 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K2201/0145 ,  H05K3/321 ,  H05K3/3489

摘要： An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles 240 to the substrate metallization pattern 210 and the component, and the adhesive material 220 is cured, to mechanically interconnect and encapsulate the substrate 210 and the component 230.

摘要翻译： 将包含助熔剂和金属颗粒240的粘合剂材料220施加到具有金属化图案210或电气部件230的基板200上。部件230定位在基板210上并加热。 在加热步骤期间，助熔剂促进金属颗粒240与基底金属化图案210和部件的粘附，并且粘合剂材料220被固化，以机械地互连和封装基底210和部件230。

公开(公告)号：US6025804A

公开(公告)日：2000-02-15

申请号：US578404

申请日：1995-12-26

申请人： James Lynn Davis ,  Robert W. Pennisi ,  Glenn F. Urbish

发明人： James Lynn Davis ,  Robert W. Pennisi ,  Glenn F. Urbish

IPC分类号： H01Q1/24 ,  H01Q17/00

CPC分类号： H01Q1/245 ,  H01Q17/001

摘要： An antenna (100) includes a radiating element (202) covered with a protective jacket having at least one pocket selectively located therein. The at least one pocket (102) is filled with a material (105) having an absorptive index substantially higher than the index of the protective jacket (102). This material imposes substantial restriction to the free radiation of radio frequency energy. Conversely, the remainder of the jacket (102) with no pockets provides for the unrestricted radiation of the radio frequency energy therethrough. As a result the antenna (100) directionally radiates energy without the use of reflectors or additional radiating elements.

摘要翻译： 天线（100）包括用保护套覆盖的辐射元件（202），其具有选择性地位于其中的至少一个口袋。 所述至少一个口袋（102​​）填充有具有大大高于保护套（102）的指数的吸收指数的材料（105）。 这种材料对射频能量的自由辐射施加了实质性的限制。 相反，没有袋的护套（102）的其余部分提供了通过其中的射频能量的不受限制的辐射。 结果，天线（100）在不使用反射器或附加辐射元件的情况下定向地辐射能量。

公开(公告)号：US5662946A

公开(公告)日：1997-09-02

申请号：US318311

申请日：1994-10-05

申请人： Steven Duane Pratt ,  Robert W. Pennisi ,  Glenn F. Urbish

发明人： Steven Duane Pratt ,  Robert W. Pennisi ,  Glenn F. Urbish

IPC分类号： B29C45/26 ,  B29C33/20

CPC分类号： B29C45/2675 ,  B29C45/2673 ,  B29C2033/0005

摘要： An adaptable mold assembly (10) consists of two mold bases (100, 102). One or both of the mold bases has at least one interchangeable portion (104, 105) removably mounted on the mold base, whose function is to actuate in a direction different from the draw direction. The interchangeable portion is typically used to facilitate the removal of the molded part from the mold, and often functions as a mold slide or pull. The ability to interchange and reconfigure the mold base reduces tooling costs and adds design flexibility to the tool. In another embodiment of the invention, the function of the interchangeable portion (106) is to provide process monitoring, process control or process optimization.

摘要翻译： 适应性模具组件（10）由两个模具基座（100,102）组成。 一个或两个模具基座具有至少一个可移除地安装在模具基座上的可互换部分（104,105），其功能是沿与拉伸方向不同的方向致动。 可互换部分通常用于促进模制部件从模具中的移除，并且通常用作模具滑动件或拉模。 交换和重新配置模具底座的能力降低了工具成本，并为工具增加了设计灵活性。 在本发明的另一个实施例中，可互换部分（106）的功能是提供过程监控，过程控制或过程优化。

公开(公告)号：US5313365A

公开(公告)日：1994-05-17

申请号：US906346

申请日：1992-06-30

申请人： Robert W. Pennisi ,  Glenn E. Gold ,  Frank J. Juskey ,  Glenn F. Urbish

发明人： Robert W. Pennisi ,  Glenn E. Gold ,  Frank J. Juskey ,  Glenn F. Urbish

IPC分类号： H01L23/29 ,  H01L23/31 ,  H05K7/02 ,  H01L23/28

CPC分类号： H01L23/293 ,  H01L23/3121 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181

摘要： An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optionally, solder pads (27) on the second side. The glob top encapsulant covers the integrated circuit, portions of the metal circuit pattern, and portions of the printed circuit board surface. The printed circuit board, the adhesive, and the encapsulant are all made from the same type of resin. In the preferred embodiment of the invention, the resin used to make the printed circuit board, the adhesive, and the encapsulant is an organosilicon polymer comprised substantially of alternating polycyclic hydrocarbon residues and cyclic polysiloxane or siloxysilane residues linked through carbon-silicon bonds.

摘要翻译： 封装的电子封装（10）通过用粘合剂（14）将一个或多个半导体器件或集成电路（16）结合到印刷电路板上并用球状顶部密封剂（15）覆盖来制造。 印刷电路板在一侧具有金属电路图案（12），并且可选地在第二侧上具有焊盘（27）。 球形顶部密封剂覆盖集成电路，金属电路图案的部分和印刷电路板表面的部分。 印刷电路板，粘合剂和密封剂均由相同类型的树脂制成。 在本发明的优选实施例中，用于制造印刷电路板，粘合剂和密封剂的树脂是基本上由交替的多环烃残基组成的有机硅聚合物和通过碳 - 硅键连接的环状聚硅氧烷或硅氧烷硅烷残基。

公开(公告)号：US5241133A

公开(公告)日：1993-08-31

申请号：US976720

申请日：1992-11-16

申请人： William B. Mullen, III ,  Glenn F. Urbish ,  Bruce J. Freyman

发明人： William B. Mullen, III ,  Glenn F. Urbish ,  Bruce J. Freyman

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L24/32 ,  H01L23/3121 ,  H01L23/49827 ,  H01L24/83 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181

摘要： A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

摘要翻译： 公开了一种无铅焊盘阵列芯片载体封装，其采用在底侧具有焊盘（34）阵列的印刷电路板（22）。 半导体器件（24）被电焊接（49）并且与导电粘合剂（47）连接到印刷电路板（22）的金属化图案（43,45）。 保护性塑料盖（26）围绕覆盖印刷电路板（22）的基本上所有顶侧的半导体器件（24）传输模制。

公开(公告)号：US4939792A

公开(公告)日：1990-07-03

申请号：US121323

申请日：1987-11-16

申请人： Glenn F. Urbish ,  John M. McKee ,  Martin J. McKinley ,  Anthony B. Suppelsa

发明人： Glenn F. Urbish ,  John M. McKee ,  Martin J. McKinley ,  Anthony B. Suppelsa

IPC分类号： H04B1/08 ,  H04B7/26 ,  H04Q7/14 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K7/06

CPC分类号： H05K3/326 ,  H04B1/08 ,  H05K1/0278 ,  H05K1/119 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/0191 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10136 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K3/0058 ,  H05K3/325

摘要： A molded thermoplastic housing (100) includes base (102) and cover (104) members joined by a living hinge (106). The base member (102) includes a peripheral wall (108). Four solderable printed circuit patterns (112, 114, 116 and 118) are vacuum deposited onto the interior and exterior surfaces of both housing members. The printed circuit patterns on opposing surfaces of the base and cover members are joined by conductive through-holes (e.g., 120 and 122), while the printed circuit patterns on the interior surfaces of the base and cover members are joined by an interconnecting printed circuit pattern (124) which is vacuum deposited onto the living hinge. Mylar sheets (132) are adhered to the exterior surface of the housing to insulate the exterior printed circuit patterns. An antenna pattern (126) is also vacuum deposited onto an exterior surface of the housing. A switch (136) and battery contact (152) are integrally formed with the housing and an integrally molded structural support means strenghthens the housing members. The housing is manufactured "opened up" and, at the final assembly stage, the cover member is rotated about the hinge until it contacts the upper surface of the peripheral wall (108B). Snap-fit connectors (e.g., 110) join the cover to the base.

摘要翻译： 模制的热塑性外壳（100）包括由活动铰链（106）连接的基座（102）和盖（104）构件。 基部构件（102）包括周壁（108）。 四个可焊接印刷电路图案（112,114,116和118）被真空沉积到两个壳体构件的内表面和外表面上。 基座和盖构件的相对表面上的印刷电路图案通过导电通孔（例如，120和122）连接，而基座和盖构件的内表面上的印刷电路图案通过互连印刷电路 图案（124），其被真空沉积到活动铰链上。 聚酯薄膜片（132）粘附到外壳的外表面以使外部印刷电路图案绝缘。 天线图案（126）也被真空沉积到外壳的外表面上。 开关（136）和电池触点（152）与壳体一体地形成，并且整体模制的结构支撑装置加强了壳体构件。 壳体被制造为“开放”，并且在最终组装阶段，盖构件围绕铰链旋转直到其接触周壁（108B）的上表面。 卡扣连接器（例如，110）将盖连接到基座。

公开(公告)号：US4598972A

公开(公告)日：1986-07-08

申请号：US689493

申请日：1985-01-07

申请人： William B. Mullen, III ,  Glenn F. Urbish

发明人： William B. Mullen, III ,  Glenn F. Urbish

IPC分类号： H01R13/11 ,  H01R13/115 ,  H05K7/10 ,  H01R11/22

CPC分类号： H01R13/112 ,  H05K7/1053

摘要： An improved electronic clip-on lead is disclosed. It is comprised of an elongated shaft suitable for electrical connection having a front spring finger extending from one end. A rear bracing member is positioned behind and parallel to the front spring finger by a support structure which fixes the displacement of the rear bracing member to the front spring finger.

摘要翻译： 公开了一种改进的电子夹式引线。 它由适合于电连接的细长轴组成，具有从一端延伸的前弹簧指。 后支撑构件通过将后支撑构件的位移固定到前弹簧指的支撑结构定位在前弹簧手指的后方并平行。

公开(公告)号：US5184768A

公开(公告)日：1993-02-09

申请号：US619944

申请日：1990-11-29

申请人： Robert S. Hall ,  Glenn F. Urbish ,  William B. Mullen, III

发明人： Robert S. Hall ,  Glenn F. Urbish ,  William B. Mullen, III

IPC分类号： B23K31/02 ,  G01R31/303 ,  G01R31/306 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K13/08

CPC分类号： H05K1/111 ,  B23K31/02 ,  G01R31/303 ,  G01R31/306 ,  H05K13/08 ,  H05K3/3436 ,  B23K2201/40 ,  H05K1/0269 ,  H05K2201/09381 ,  H05K2201/10734 ,  H05K2203/162 ,  Y02P70/611 ,  Y02P70/613

摘要： A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.

摘要翻译： 焊接互连验证系统用于验证在部件（25）下隐藏的焊点的形成。 焊料（28）被附着或回流焊接到部件焊盘（26）上。 衬底焊盘（22）具有附接到焊垫（22）并从焊垫（22）向外延伸的小的可焊接部分（24）。 将部件放置在基板（20）上并回流焊接以将焊料（38）湿润到基板焊盘（32和34），形成不规则形状的焊点（38）。 这样形成的接头（38）在回流之后使用x射线进行检查。

公开(公告)号：US4877569A

公开(公告)日：1989-10-31

申请号：US203037

申请日：1988-06-06

申请人： Glenn F. Urbish ,  William B. Mullen, III ,  Charles W. Mooney

发明人： Glenn F. Urbish ,  William B. Mullen, III ,  Charles W. Mooney

IPC分类号： B29C33/52 ,  B29C70/74 ,  B29C70/76 ,  H01M2/10 ,  H01M2/20 ,  H01R4/48 ,  H01R13/24

CPC分类号： H01M2/1022 ,  B29C33/52 ,  B29C70/742 ,  B29C70/76 ,  H01M2/20 ,  H01R4/4863 ,  H01R13/24

摘要： A solvent soluble plastic form (104) is molded around a spring-type battery contact (102) such that one end (102A) of the battery contact projects from the form. A one-piece injection molded thermoplastic housing (202) is then molded around the battery contact and form, thereby molding the end of the battery contact into the housing. The soluble plastic form is then dissolved in an appropriate solvent, leaving a housing with a cavity (202D) that contains the battery contact.

摘要翻译： 围绕弹簧式电池触点（102）模制溶剂可溶塑料形式（104），使得电池触点的一端（102A）从形式突出。 然后将一体式注模的热塑性壳体（202）模制在电池触点周围并形成，从而将电池触点的端部模制到壳体中。 然后将可溶性塑料形式溶解在合适的溶剂中，留下具有包含电池触点的空腔（202D）的壳体。