公开(公告)号：US07855741B2

公开(公告)日：2010-12-21

申请号：US12078572

申请日：2008-04-01

Applicant: Young-su Moon ,  Ho-jin Lee ,  Shi-hwa Lee

Inventor： Young-su Moon ,  Ho-jin Lee ,  Shi-hwa Lee

IPC: H04N3/14 ,  H04N5/228

CPC classification number: H04N9/045 ,  H04N5/217 ,  H04N2209/046

Abstract: Provided are an image signal processing apparatus and method. According to the image signal processing method, by simultaneously performing in an integrated manner image denoising and interpolation using 4-directional image gradient information which defines differences in color brightness between adjacent pixels on the basis of edge direction information obtained from a bayer image output from an image sensor, it is possible to improve picture quality and processing speed.

Abstract translation: 提供了一种图像信号处理装置和方法。 根据图像信号处理方法，通过使用四方向图像梯度信息以集成方式同时执行图像去噪和内插，所述四方向图像梯度信息基于从输出的拜耳图像获得的边缘方向信息来定义相邻像素之间的颜色亮度的差异 图像传感器，可以提高图像质量和处理速度。

公开(公告)号：US20080094087A1

公开(公告)日：2008-04-24

申请号：US11827689

申请日：2007-07-13

Applicant: Ho-jin Lee

Inventor： Ho-jin Lee

IPC: G01R31/02 ,  G01J5/00

CPC classification number: G01R31/2891 ,  G01R31/311 ,  H01L21/681

Abstract: In a device for detecting a chip location and a method of detecting a chip location using the device, the device includes a chuck to which a wafer to be inspected is fixable, an infrared irradiation unit capable of irradiating infrared light to a target semiconductor chip of the wafer from the backside of the wafer, and a scope disposed opposite to the infrared irradiation unit with respect to the wafer. In this manner, it can be readily be determined whether the scope is aligned with a target semiconductor chip to which a probe card is connected for inspection by a backside emission method. Furthermore, the target semiconductor chip to be inspected can be readily detected among semiconductor chips viewed through the scope. Therefore, TAT (turn around time) for inspection can be largely reduced.

Abstract translation: 在用于检测芯片位置的装置和使用该装置检测芯片位置的方法中，该装置包括：待检查晶片可固定的卡盘;能够将红外光照射到目标半导体芯片的红外线照射单元 来自晶片背面的晶片和相对于晶片与红外辐射单元相对设置的镜片。 以这种方式，可以容易地确定范围是否与通过背面发射方法连接用于检查的探针卡的目标半导体芯片对准。 此外，可以在通过范围观看的半导体芯片中容易地检测要检查的目标半导体芯片。 因此，TAT（转机时间）可以大大降低。

公开(公告)号：US08586477B2

公开(公告)日：2013-11-19

申请号：US13195128

申请日：2011-08-01

Applicant: Se-young Jeong ,  Ho-jin Lee ,  Ho-geon Song ,  Jae-hyun Phee

Inventor： Se-young Jeong ,  Ho-jin Lee ,  Ho-geon Song ,  Jae-hyun Phee

IPC: H01L21/44 ,  H01L21/00 ,  H01L23/04

CPC classification number: H01L21/76898 ,  H01L21/563 ,  H01L23/481 ,  H01L24/03 ,  H01L24/04 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/03002 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/03618 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05557 ,  H01L2224/0557 ,  H01L2224/05609 ,  H01L2224/05613 ,  H01L2224/05614 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05649 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/0567 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/0568 ,  H01L2224/05681 ,  H01L2224/05683 ,  H01L2224/05684 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13171 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05552

Abstract: A semiconductor apparatus having a through electrode, a semiconductor package, and a method of manufacturing the semiconductor package are provided. The method of includes preparing a substrate including a buried via, the buried via having a first surface at a first end, and the buried via extending from a first substrate surface of the substrate into the substrate; planarizing a second substrate surface of the substrate opposite the first substrate surface to form a through via by exposing a second via surface at a second end of the buried via opposite the first end; forming a conductive capping layer on the exposed second via surface of the through via; and recessing the second substrate surface so that at least a first portion of the through via extends beyond the second substrate surface.

Abstract translation: 提供了具有贯通电极，半导体封装以及半导体封装的制造方法的半导体装置。 该方法包括制备包括掩埋通孔的衬底，所述埋入通孔在第一端具有第一表面，以及所述掩埋通孔从所述衬底的第一衬底表面延伸到所述衬底中; 平行化与第一衬底表面相对的衬底的第二衬底表面以通过在与第一端相对的埋置通孔的第二端处暴露第二通孔表面而形成通孔; 在通孔的暴露的第二通孔表面上形成导电覆盖层; 并且使所述第二衬底表面凹陷，使得所述通孔的至少第一部分延伸超出所述第二衬底表面。

公开(公告)号：US08564102B2

公开(公告)日：2013-10-22

申请号：US13108231

申请日：2011-05-16

Applicant: Ju-il Choi ,  Jae-hyun Phee ,  Kyu-ha Lee ,  Ho-jin Lee ,  Son-kwan Hwang

Inventor： Ju-il Choi ,  Jae-hyun Phee ,  Kyu-ha Lee ,  Ho-jin Lee ,  Son-kwan Hwang

IPC: H01L29/40 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L21/76879 ,  H01L21/76844 ,  H01L21/76873 ,  H01L21/76898 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/05009 ,  H01L2224/06181

Abstract: A semiconductor device and a method of fabricating a semiconductor device. The semiconductor device includes an interlayer insulation layer pattern, a metal wire pattern exposed by a passage formed by a via hole formed in the interlayer insulation layer pattern to input and output an electrical signal, and a plated layer pattern directly contacting the metal wire pattern and filling the via hole. The method includes forming an interlayer insulation layer having a metal wire pattern to input and output an electrical signal formed therein, forming a via hole to define a passage that extends through the interlayer insulation layer until at least a part of the metal wire pattern is exposed, and forming a plated layer pattern to fill the via hole and to directly contact the metal wire pattern by using the metal wire pattern exposed through the via hole as a seed metal layer.

Abstract translation: 半导体器件和半导体器件的制造方法。 半导体器件包括层间绝缘层图案，由形成在层间绝缘层图案中的通孔形成的通道暴露的金属线图案，以输入和输出电信号，以及直接接触金属线图案的镀层图案和 填充通孔。 该方法包括形成具有金属线图案的层间绝缘层，以输入和输出其中形成的电信号，形成通孔以限定延伸穿过层间绝缘层的通道，直到金属线图案的至少一部分露出 并且形成镀层图案以填充通孔并且通过使用通过通孔露出的金属线图案作为种子金属层直接接触金属线图案。

公开(公告)号：US20120299194A1

公开(公告)日：2012-11-29

申请号：US13569653

申请日：2012-08-08

Applicant: Ho-jin Lee ,  Hyun-soo Chung ,  Chang-seong Jeon ,  Sang-sick Park ,  Jae-hyun Phee

Inventor： Ho-jin Lee ,  Hyun-soo Chung ,  Chang-seong Jeon ,  Sang-sick Park ,  Jae-hyun Phee

IPC: H01L23/48

CPC classification number: H01L23/48 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05186 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/04953 ,  H01L2924/04941

Abstract: A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.

Abstract translation: 半导体器件包括半导体衬底和通孔电极。 通孔电极在基板上具有第一部分并且朝向基板延伸并且具有从第一部分延伸到基板中的多个尖峰，每个尖峰彼此间隔开。

公开(公告)号：US08223719B2

公开(公告)日：2012-07-17

申请号：US12553622

申请日：2009-09-03

Applicant: Hyun-ha Hong ,  Ki-seop Han ,  Dae-ig Chang ,  Ho-jin Lee

Inventor： Hyun-ha Hong ,  Ki-seop Han ,  Dae-ig Chang ,  Ho-jin Lee

IPC: H04W4/00 ,  H04W36/00 ,  H04W24/00 ,  H04L12/56

CPC classification number: H04W36/0011 ,  H04W80/04 ,  H04W84/06 ,  H04W84/12

Abstract: Provided are an apparatus for controlling handover between heterogeneous networks, a method of performing handover between heterogeneous networks in a mobile router, and a mobile router. The method includes determining whether a handover to a network employing a different method from a network to which the mobile router belongs is required based on information prestored in the mobile router, the network to which the mobile router belongs determined by current location information of the mobile router and performing the handover according to the result of the determination. Mobility detection time can be reduced by applying the handover technique between wireless/satellite networks based on link trigger and location to a mobile router moving at high speed. Thus, service interruption can be prevented regardless of movement speed, even in a satellite shadow region such as a station.

Abstract translation: 提供了一种用于控制异构网络之间的切换的装置，在移动路由器中的异构网络之间执行切换的方法和移动路由器。 该方法包括基于在移动路由器中预先存储的信息来确定是否需要使用与移动路由器所属的网络不同的方法的切换，移动路由器所属的网络由移动台的当前位置信息确定 路由器并根据确定的结果执行切换。 可以通过在基于链路触发和位置的无线/卫星网络之间通过移动高速移动路由器的切换技术来减少移动性检测时间。 因此，即使在诸如车站的卫星影像区域中，不管运动速度如何，都可以防止服务中断。

公开(公告)号：US20100271285A1

公开(公告)日：2010-10-28

申请号：US12747134

申请日：2008-07-18

Applicant: So-Hyeun Yun ,  In-Bok Yom ,  Ho-jin Lee ,  Ji-Whan Ko

Inventor： So-Hyeun Yun ,  In-Bok Yom ,  Ho-jin Lee ,  Ji-Whan Ko

IPC: H01Q15/14

CPC classification number: H01Q15/0013

Abstract: There is provided a frequency Selective Surface (FSS) structure for multi frequency bands configured with unit cells, each including a loop unit, arranged at regular intervals, wherein each unit cell includes: a dielectric layer; and the loop unit having a fixed width and formed on the dielectric layer, wherein the loop unit includes a first loop and a second loop formed inside the first loop with a predetermined space away from the first loop, each of the first loop and the second loop being formed sinuously in at least one portion.

Abstract translation: 提供了配置有单位单元的多频段的频率选择表面（FSS）结构，每个单元包括以规则间隔排列的循环单元，其中每个单位单元包括：介电层; 并且所述环形单元具有固定的宽度并且形成在所述介电层上，其中所述环形单元包括第一环和第二环，所述第一环和第二环形成在所述第一环内，具有远离所述第一环的预定空间，所述第一环和所述第二环中的每一个 在至少一个部分中正弦地形成环。

公开(公告)号：US20100007007A1

公开(公告)日：2010-01-14

申请号：US12496819

申请日：2009-07-02

Applicant: Sung-hwan YOON ,  Jai-kyeong Shin ,  Yong-nam Koh ,  Hyoung-suk Kim ,  In-ku Kang ,  Ho-jin Lee ,  Sang-wook Park ,  Joong-kyo Kook ,  Min-young Son ,  Soong-yong Hur

Inventor： Sung-hwan YOON ,  Jai-kyeong Shin ,  Yong-nam Koh ,  Hyoung-suk Kim ,  In-ku Kang ,  Ho-jin Lee ,  Sang-wook Park ,  Joong-kyo Kook ,  Min-young Son ,  Soong-yong Hur

IPC: H01L23/498 ,  H01L23/29

CPC classification number: H01L23/295 ,  H01L23/3171 ,  H01L23/564 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions.

Abstract translation: 半导体封装包括：具有第一表面的半导体芯片和与第一表面相对并允许在其上形成半导体器件的第二表面; 配置在半导体芯片的第二表面上的接合焊盘; 以及设置在半导体芯片的第一表面上的金属离子阻挡层，并且防止金属离子通过半导体芯片的第一表面渗入半导体芯片。 因此，半导体封装可以通过最小化吸湿和有效地阻挡金属离子的穿透而获得优良的半导体器件。

公开(公告)号：US20090128662A1

公开(公告)日：2009-05-21

申请号：US12078572

申请日：2008-04-01

Applicant: Young-su Moon ,  Ho-jin Lee ,  Shi-hwa Lee

Inventor： Young-su Moon ,  Ho-jin Lee ,  Shi-hwa Lee

IPC: H04N5/76

CPC classification number: H04N9/045 ,  H04N5/217 ,  H04N2209/046

Abstract: Provided are an image signal processing apparatus and method. According to the image signal processing method, by simultaneously performing in an integrated manner image denoising and interpolation using 4-directional image gradient information which defines differences in color brightness between adjacent pixels on the basis of edge direction information obtained from a bayer image output from an image sensor, it is possible to improve picture quality and processing speed.

Abstract translation: 提供了一种图像信号处理装置和方法。 根据图像信号处理方法，通过使用四方向图像梯度信息以集成方式同时执行图像去噪和内插，所述四方向图像梯度信息基于从输出的拜耳图像获得的边缘方向信息来定义相邻像素之间的颜色亮度的差异 图像传感器，可以提高图像质量和处理速度。

公开(公告)号：US20140124901A1

公开(公告)日：2014-05-08

申请号：US14153478

申请日：2014-01-13

Applicant: Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-iI Choi ,  Son-kwan Hwang

Inventor： Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-iI Choi ,  Son-kwan Hwang

IPC: H01L23/528 ,  H01L23/522

CPC classification number: H01L23/528 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/00012

Abstract: Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.

Abstract translation: 形成集成电路器件的方法包括在半导体衬底的第一表面上形成层间电介质层，然后形成延伸穿过层间电介质层并进入半导体衬底的互连孔。 第一侧壁间隔层形成在互连孔的侧壁上。 在互连孔的底部的半导体衬底被各向同性蚀刻以在半导体衬底中限定底切凹部。 该蚀刻步骤使用第一侧壁间隔层作为蚀刻掩模进行。 然后用通孔电极填充互连孔和未切割凹部。 去除半导体衬底的第二表面足够的持续时间以露出包含通孔电极的未切割凹部。