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35 条记录 (耗时 0.021 秒)

    PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME
    17.
    发明申请
    PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME 有权

    公开(公告)号：US20210242105A1

    公开(公告)日：2021-08-05

    申请号：US16781475

    申请日：2020-02-04

    申请人： INTEL CORPORATION

    发明人： Jesus Gerardo Reyes Schuldes ,  Shankar Devasenathipathy ,  Pramod Malatkar ,  Aravindha Antoniswamy ,  Kyle Arrington

    IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H05K1/02

    摘要： Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.

    Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging
    19.
    发明授权
    Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging 有权

    公开(公告)号：US10607909B2

    公开(公告)日：2020-03-31

    申请号：US16075120

    申请日：2016-04-02

    申请人： Intel Corporation

    发明人： Purushotham Kaushik Muthur Srinath ,  Pramod Malatkar ,  Sairam Agraharam ,  Chandra M. Jha ,  Arnab Choudhury ,  Nachiket R. Raravikar

    IPC分类号： H01L23/367 ,  H01L23/26 ,  H01L23/433 ,  H01L25/065 ,  H01L23/36 ,  H01L23/00 ,  H01L25/18 ,  H01L23/31

    摘要： In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing a thermal solution for 3D packaging. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces therein; a first layer functional silicon die electrically interfaced to the electrical traces of the substrate layer, the first layer functional silicon die having a first thermal pad integrated thereupon; a second layer functional silicon die positioned above the first layer functional silicon die, the second layer functional silicon die having a second thermal pad integrated thereupon; and a conductivity layer positioned between the first layer functional silicon die and the second layer functional silicon die, wherein the conductivity layer is to: (i) electrically join the second layer functional silicon die to the first layer functional silicon die and (ii) bond the first thermal pad of the first layer functional silicon die to the second thermal pad of the second layer functional silicon die via solder. Other related embodiments are disclosed.

    Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration
    20.
    发明授权
    Systems, methods, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration 有权

    公开(公告)号：US10475750B2

    公开(公告)日：2019-11-12

    申请号：US16075513

    申请日：2016-04-02

    申请人： Intel Corporation

    发明人： Vijay K. Nair ,  Pramod Malatkar

    IPC分类号： H01L23/552 ,  H01L23/48 ,  H01L23/00 ,  H01L23/367 ,  H01L21/48 ,  H01L23/498 ,  H01L23/66 ,  H01L25/18

    摘要： In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing an organic stiffener with an EMI shield for RF integration. For instance, in accordance with one embodiment, there is an apparatus having therein: a substrate layer having electrical traces and a ground plane therein; a functional semiconductor die electrically interfaced to the electrical traces of the substrate layer; a heat pipe thermally interfaced to a top surface of the functional semiconductor die; one or more interposers of an organic dielectric material electrically connected to the ground plane of the substrate layer and electrically connected to the heat pipe; in which the one or more interposers form the electromagnetic shield to electrically shield the functional semiconductor die; and further in which the one or more interposers form the organic stiffener are to mechanically retain the substrate layer in a planer form. Other related embodiments are disclosed.