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公开(公告)号：US08421246B2
公开(公告)日：2013-04-16
申请号：US12864826
申请日：2009-05-22
IPC分类号： H01L29/43
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。
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公开(公告)号：US08598464B2
公开(公告)日：2013-12-03
申请号：US12999411
申请日：2010-04-19
CPC分类号： H05K3/3463 , B23K35/262 , B23K2101/36 , B32B15/01 , C22C13/00 , H05K3/3442 , H05K2201/10992 , Y02P70/613
摘要： A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.
摘要翻译： 焊料材料包括1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或 选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。 当通过使用该焊料将电子部件的含铜电极部分连接到基板的含铜电极焊盘时，可以在焊料连接部分中形成具有优异的应力松弛特性的部分， Sn金属间化合物可以从电极焊盘和电极部分快速生长，形成强阻挡结构。
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公开(公告)号：US20100301481A1
公开(公告)日：2010-12-02
申请号：US12864826
申请日：2009-05-22
IPC分类号： H01L23/532
CPC分类号： B23K1/0016 , B23K35/0233 , B23K35/0238 , B23K35/264 , B23K2101/40 , C22C12/00 , C22C19/03 , H01L23/488 , H01L23/49503 , H01L23/49513 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/29101 , H01L2224/29113 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48699 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/10162 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/00 , H01L2924/01083 , H01L2924/3512 , H01L2924/00012
摘要： A joint structure joins an electronic element 12 included in an electronic component to an electrode 14 included in that electronic component. The joint structure includes a solder layer, which contains 0.2 to 6% by weight of copper, 0.02 to 0.2% by weight of germanium and 93.8 to 99.78% by weight of bismuth, a nickel layer provided between the solder layer and the electrode, and a barrier layer provided between the nickel layer and the solder layer. Here, the barrier layer is formed so as to have an average thickness of from 0.5 to 4.5 μm after the electronic element and the electrode are joined by the solder layer.
摘要翻译： 接合结构将包括在电子部件中的电子元件12与包括在该电子部件中的电极14连接。 接头结构包括焊料层，其含有0.2〜6重量％的铜，0.02〜0.2重量％的锗和93.8〜99.78重量％的铋，设置在焊料层和电极之间的镍层，以及 设置在镍层和焊料层之间的阻挡层。 这里，在电子元件和电极通过焊料层接合之后，阻挡层形成为具有0.5至4.5μm的平均厚度。
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公开(公告)号：US20110120769A1
公开(公告)日：2011-05-26
申请号：US12999411
申请日：2010-04-19
CPC分类号： H05K3/3463 , B23K35/262 , B23K2101/36 , B32B15/01 , C22C13/00 , H05K3/3442 , H05K2201/10992 , Y02P70/613
摘要： A lead-free solder material is provided, which shows a high thermal fatigue resistance and is able to effectively reduce occurrence of connection failure that would cause a function of a product to stop.A solder material comprises 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part (3a) of an electronic component (3) is connected to a copper-containing electrode land (1a) of a substrate (1) by using this solder material, a part (5b) having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound (5a) can be rapidly grown from the electrode land (1a) and the electrode part (3a) to form a strong blocking structure. Thus, even in a severe temperature environment, cleavage can be prevented from generating and extending, a high thermal fatigue resistance can be attained, and occurrence of connection failure can be reduced.
摘要翻译： 提供了一种无铅焊料，其显示出高耐热疲劳性，并且能够有效地减少导致产品功能停止的连接故障的发生。 焊料材料包含1.0-4.0重量％的Ag，4.0-6.0重量％的In，0.1-1.0重量％的Bi，1重量％以下（不包括0重量％）的1个或 选自由Cu，Ni，Co，Fe和Sb组成的组中的更多元素，以及Sn的剩余部分。 当使用该焊料将电子部件（3）的含铜电极部（3a）与基板（1）的含铜电极焊盘（1a）连接时，具有优异应力的部分（5b） 可以在焊料连接部中形成松弛性，并且可以从电极接合区（1a）和电极部（3a）迅速地生长Cu-Sn金属间化合物（5a），形成强阻挡结构。 因此，即使在严酷的温度环境下，也可以防止产生和延伸的裂纹，可以获得高耐热疲劳性，并且可以降低连接故障的发生。
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公开(公告)号：US20110284278A1
公开(公告)日：2011-11-24
申请号：US13110136
申请日：2011-05-18
申请人： Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
发明人： Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
IPC分类号： H05K1/18
CPC分类号： H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/0939 , H05K2201/09663 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0
摘要翻译： 安装结构包括绝缘基板，其具有设置有至少一个电极切口的基板电极和抗蚀剂，具有电连接到基板电极的电子部件电极的电子部件和印刷在基板电极的表面上的焊膏 基板电极。 基板电极具有以下关系：0
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公开(公告)号：US20100148367A1
公开(公告)日：2010-06-17
申请号：US12711628
申请日：2010-02-24
IPC分类号： H01L23/488 , H01L21/603
CPC分类号： C22C1/002 , H01L23/49513 , H01L23/49562 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/04026 , H01L2224/05554 , H01L2224/0558 , H01L2224/05639 , H01L2224/29101 , H01L2224/29111 , H01L2224/29113 , H01L2224/32057 , H01L2224/32245 , H01L2224/45124 , H01L2224/48247 , H01L2224/48739 , H01L2224/73265 , H01L2224/743 , H01L2224/83101 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/85439 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/01022 , H01L2924/00012
摘要： A semiconductor device includes a die pad having a surface on which a first solder bonding layer is formed, and made of metal; and a semiconductor element fixed on the first solder bonding layer on the die pad by a solder material made mostly of bismuth. The first solder bonding layer is made of a softer material than the solder material, a recess is formed in a part of the first solder bonding layer by pressing the solder material against the first solder bonding layer, and the solder material partially fills the recess.
摘要翻译： 半导体器件包括具有表面的芯片焊盘，其上形成有第一焊料接合层，并由金属制成; 以及半导体元件，其通过主要由铋制成的焊料固定在芯片焊盘上的第一焊料接合层上。 第一焊料接合层由比焊料材料更软的材料制成，通过将焊料材料压靠在第一焊料接合层上而在第一焊料接合层的一部分中形成凹部，并且焊料材料部分地填充凹部。
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公开(公告)号：US08552307B2
公开(公告)日：2013-10-08
申请号：US13110136
申请日：2011-05-18
申请人： Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
发明人： Kiyohiro Hine , Shigeaki Sakatani , Akio Furusawa
IPC分类号： H05K1/18
CPC分类号： H05K1/111 , H05K3/3442 , H05K3/3484 , H05K2201/09381 , H05K2201/0939 , H05K2201/09663 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting structure includes an insulating substrate having a substrate electrode on which at least one electrode notch is provided and a resist, an electronic component having an electronic component electrode to be electrically connected to the substrate electrode, and solder paste printed on a surface of the substrate electrode. The substrate electrode has a following relation, 0
摘要翻译： 安装结构包括绝缘基板，其具有设置有至少一个电极切口的基板电极和抗蚀剂，具有电连接到基板电极的电子部件电极的电子部件和印刷在基板电极的表面上的焊膏 基板电极。 基板电极具有以下关系：0
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18.发明申请HEAT CURABLE RESIN COMPOSITION, AND MOUNTING METHOD AND REPARING PROCESS FOR CIRCUIT BOARD USING THE HEAT CURABLE COMPOSITION 审中-公开热固化树脂组合物，以及使用热固化组合物的电路板的安装方法和重复方法公开(公告)号：US20090236036A1
公开(公告)日：2009-09-24
申请号：US12306610
申请日：2007-06-22
申请人： Hidenori Miyakawa , Ryou Kuwabara , Shigeaki Sakatani , Atsushi Yamaguchi , Susumu Saitoh , Arata Kishi
发明人： Hidenori Miyakawa , Ryou Kuwabara , Shigeaki Sakatani , Atsushi Yamaguchi , Susumu Saitoh , Arata Kishi
CPC分类号： H05K3/305 , C08G59/66 , C08G59/686 , C08K9/04 , C08L63/00 , H05K3/225 , H05K3/306 , H05K2201/0209 , H05K2203/1105 , H05K2203/176 , Y02P20/582 , Y02P70/613
摘要： A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.
摘要翻译： 提供了一种树脂组合物，其可以在将电子部件安装在电路板上的过程中，在加热时防止低耐热性部件被损坏。 还提供了一种容易修复在安装过程中被确定为不合规格产品的电路板的方法，以及用于从确定为关闭的电路板分离和恢复有用的电路板和/或电子部件的方法 - 在安装过程中确定产品。 树脂组合物包含（A）100重量份的环氧树脂，（B）30〜200重量份的硫醇系固化剂，（C）5〜200重量份的有机 - 无机复合绝缘填料 和（D）0.5〜20重量份的咪唑类固化促进剂。 根据回收方法，通过在安装工序中将电路板的一部分或全部加热到树脂组合物的玻璃化转变温度以上且不高于110℃的温度，使树脂组合物软化。 ，并且从电路板分离和回收电子部件。
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公开(公告)号：US08378472B2
公开(公告)日：2013-02-19
申请号：US12738430
申请日：2008-10-16
IPC分类号： H01L23/22
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
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20.发明申请公开(公告)号：US20110110050A1
公开(公告)日：2011-05-12
申请号：US12675080
申请日：2008-10-21
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线基板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。
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