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    Semiconductor package including flex circuit, interconnects and dense array external contacts
    11.
    发明授权
    Semiconductor package including flex circuit, interconnects and dense array external contacts 失效

    公开(公告)号：US6097087A

    公开(公告)日：2000-08-01

    申请号：US961881

    申请日：1997-10-31

    申请人： Warren M. Farnworth ,  Alan G. Wood ,  Mike Brooks

    发明人： Warren M. Farnworth ,  Alan G. Wood ,  Mike Brooks

    IPC分类号： H01L23/498 ,  H01L23/04

    CPC分类号： H01L23/49827 ,  H01L23/4985 ,  H01L2224/02333 ,  H01L2224/73215 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15173

    摘要： A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit. Several different embodiments of interconnects are provided including: bumps on the die contacts, bonded to the flex circuit conductors with a conductive adhesive layer; polymer bumps on the conductors, or die contacts, applied in a semi-cured state and then fully cured; solder bumps on the die contacts and conductors, bonded to one another using a bonding tool; rivet-like bonded connections between the conductors and die contacts, formed using metal bumps and a wire bonding or ball bonding apparatus; single point bonded connections between the conductors and die contacts, formed with a bonding tool; and wire bonds between the conductors and die contacts.

    Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
    16.
    发明授权
    Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages 有权
    用于制造图像传感器封装等的框架结构和半导体附着工艺以及所产生的封装

    公开(公告)号：US07645635B2

    公开(公告)日：2010-01-12

    申请号：US10919604

    申请日：2004-08-16

    申请人： Alan G. Wood ,  Kyle K. Kirby ,  Warren M. Farnworth ,  Salman Akram

    发明人： Alan G. Wood ,  Kyle K. Kirby ,  Warren M. Farnworth ,  Salman Akram

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.

    摘要翻译： 诸如图像传感器封装的半导体封装以及制造方法。 框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。 单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。 或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口 ，然后安装其他包装组件。 在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。 各种外部连接方法可用于包装。

    Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures
    17.
    发明授权
    Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures 有权
    在半导体衬底中形成通孔的方法，而不损坏其有效区域和结果

    公开(公告)号：US07598167B2

    公开(公告)日：2009-10-06

    申请号：US11140402

    申请日：2005-05-27

    申请人： Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  Salman Akram ,  Warren M. Farnworth

    发明人： Charles M. Watkins ,  Kyle K. Kirby ,  Alan G. Wood ,  Salman Akram ,  Warren M. Farnworth

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76898

    摘要： Methods for forming through vias in a semiconductor substrate and resulting structures are disclosed. In one embodiment, a through via may be formed by forming a partial via from the active surface through a conductive element thereon and a portion of the semiconductor substrate underlying the conductive element. The through via may then be completed by laser ablation or drilling from the back surface. In another embodiment, a partial via may be formed by laser ablation or drilling from the back surface of a semiconductor substrate to a predetermined distance therein. The through via may be completed from the active surface by forming a partial via extending through the conductive element and the underlying semiconductor substrate to intersect the laser-drilled partial via. In another embodiment, a partial via may first be formed by ablation or drilling from the back surface of the semiconductor substrate followed by dry etching to complete the through via and expose the underside of the conductive element.

    摘要翻译： 公开了在半导体衬底中形成贯通孔的方法和所得到的结构。 在一个实施例中，通孔可以通过在其上的导电元件和导电元件下面的半导体衬底的一部分从活性表面形成部分通孔而形成通孔。 然后可以通过从后表面的激光烧蚀或钻孔来完成通孔。 在另一个实施例中，部分通孔可以通过激光烧蚀或从半导体衬底的背面钻孔到其中的预定距离来形成。 通孔可以通过形成延伸穿过导电元件和下面的半导体衬底以与激光钻孔的部分通孔相交的部分通孔从活性表面完成。 在另一个实施例中，可以首先通过从半导体衬底的后表面进行烧蚀或钻孔形成部分通孔，然后进行干法蚀刻以完成通孔并暴露导电元件的下侧。