公开(公告)号：US09718682B2

公开(公告)日：2017-08-01

申请号：US15222006

申请日：2016-07-28

Applicant: Semiconductor Manufacturing International (Shanghai) Corporation

Inventor： Peng Ren

IPC: H01L21/00 ,  B81C1/00 ,  H01L23/48 ,  H01L21/768 ,  H01L21/67 ,  H01L21/687 ,  H01L23/00

CPC classification number: B81C1/00801 ,  B81C2201/0154 ,  B81C2201/05 ,  B81C2203/0778 ,  H01L21/67063 ,  H01L21/6715 ,  H01L21/687 ,  H01L21/76861 ,  H01L21/76873 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02317 ,  H01L2224/02372 ,  H01L2224/02381 ,  H01L2224/13024

Abstract: A method for fabricating a semiconductor structure includes providing a substrate with a first surface and a second surface, wherein at least one soldering pad is formed on the first surface of the substrate. The method also includes forming at least one via to expose each soldering pad by etching the substrate from the second surface, forming a seed layer to cover the second surface of the substrate and the sidewall and the bottom surfaces of each via, and then forming a redistribution metal layer over a portion of the seed layer formed on the sidewall and the bottom surfaces of each via and the second surface of the substrate surrounding each via. The method further includes alternately performing a pre-wetting process and a chemical etching process to completely remove the portion of the seed layer not covered by the redistribution metal layer.

公开(公告)号：US09685186B2

公开(公告)日：2017-06-20

申请号：US12703897

申请日：2010-02-11

Applicant: Majeed A. Foad ,  Jacob Newman ,  Jose Antonio Marin ,  Daniel J. Hoffman ,  Stephen Moffatt ,  Steven Verhaverbeke

Inventor： Majeed A. Foad ,  Jacob Newman ,  Jose Antonio Marin ,  Daniel J. Hoffman ,  Stephen Moffatt ,  Steven Verhaverbeke

IPC: G11B5/85 ,  C23C16/00 ,  G11B5/82 ,  C23F1/00 ,  H01L21/673 ,  G11B5/84 ,  H01L21/677 ,  G11B5/855 ,  C23C14/48 ,  H01L21/687 ,  C23C14/50

CPC classification number: G11B5/82 ,  C23C14/48 ,  C23C14/50 ,  C23C16/00 ,  C23F1/00 ,  G11B5/84 ,  G11B5/855 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687

Abstract: Methods and apparatus for forming substrates having magnetically patterned surfaces is provided. A magnetic layer comprising one or more materials having magnetic properties is formed on a substrate. The magnetic layer is subjected to a patterning process in which selected portions of the surface of the magnetic layer are altered such that the altered portions have different magnetic properties from the non-altered portions without changing the topography of the substrate. A protective layer and a lubricant layer are deposited over the patterned magnetic layer. The patterning is accomplished through a number of processes that expose substrates to energy of varying forms. Apparatus and methods disclosed herein enable processing of two major surfaces of a substrate simultaneously, or sequentially by flipping. In some embodiments, magnetic properties of the substrate surface may be uniformly altered by plasma exposure and then selectively restored by exposure to patterned energy.

公开(公告)号：US09593430B2

公开(公告)日：2017-03-14

申请号：US15180477

申请日：2016-06-13

Applicant: EBARA CORPORATION

Inventor： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

IPC: C25D17/00 ,  C25D7/12 ,  H01L21/687 ,  H01L21/683 ,  H01L21/288 ,  H01L23/00 ,  C25D17/06 ,  C25D21/12 ,  H01L21/67 ,  C25D17/08 ,  H01L21/768

CPC classification number: C25D17/001 ,  C25D5/022 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/11462 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract translation: 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。

公开(公告)号：US09558971B2

公开(公告)日：2017-01-31

申请号：US14309287

申请日：2014-06-19

Applicant: Ebara Corporation

Inventor： Mitsuru Miyazaki ,  Takuya Inoue

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate.

Abstract translation: 公开了能够减少诸如晶片的基板的偏转量的基板保持装置。 基板保持装置包括：多个卡盘，其构造成保持基板的周边边缘; 设置在所述基板下方的至少一个支撑构件; 以及致动装置，其构造成使得所述卡盘与所述基板的周边边缘接触，同时升高所述支撑构件以使所述支撑构件与所述基板的下表面接触，并且构造成使所述卡盘沿远离所述基板的方向移动 同时降低支撑构件以将支撑构件分离离开衬底的下表面。

公开(公告)号：US09536759B2

公开(公告)日：2017-01-03

申请号：US14725285

申请日：2015-05-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Ching-Hai Yang ,  Shang-Sheng Li ,  Yao-Hwan Kao

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/67115 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68 ,  H01L21/687 ,  H01L21/68764

Abstract: A baking apparatus for baking a wafer is provided. The baking apparatus includes a wafer chuck configured to hold the wafer, and a heating device disposed over the wafer chuck and configured to heat the wafer. The baking apparatus also includes a carrying arm configured to transport the wafer over the wafer chuck. The wafer chuck is in physical contact with the center area of the bottom surface of the wafer when the wafer is held by the wafer chuck.

Abstract translation: 提供了一种用于烘烤晶片的烘烤装置。 烘烤装置包括构造成保持晶片的晶片卡盘和设置在晶片卡盘上方并构造成加热晶片的加热装置。 烘烤设备还包括配置成将晶片输送到晶片卡盘上的承载臂。 当晶片被晶片卡盘保持时，晶片卡盘与晶片的底表面的中心区域物理接触。

公开(公告)号：US09506162B2

公开(公告)日：2016-11-29

申请号：US15180448

申请日：2016-06-13

Applicant: EBARA CORPORATION

Inventor： Junichiro Yoshioka ,  Kuniaki Horie ,  Yugang Guo ,  Satoshi Morikami

IPC: C25D17/00 ,  C25D7/12 ,  H01L21/687 ,  H01L21/683 ,  H01L21/288 ,  H01L23/00 ,  H01L21/768

CPC classification number: C25D17/001 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68728 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/05599

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract translation: 本发明提供一种能够利用密封构件进行更完全的密封的衬底保持器，并且可以容易且牢固地将衬底从衬底保持器中取出，以及设置有衬底保持器的电镀设备。 衬底保持器包括：固定保持构件和用于在其间保持衬底的可动保持构件; 安装到所述固定保持构件或所述可动保持构件的密封构件; 以及用于吸引保持在固定保持构件和可动保持构件之间的基板的背面的吸盘。

公开(公告)号：US20160319456A1

公开(公告)日：2016-11-03

申请号：US15180477

申请日：2016-06-13

Applicant: EBARA CORPORATION

Inventor： Junichiro YOSHIOKA ,  Kuniaki HORIE ,  Yugang GUO ,  Satoshi MORIKAMI

IPC: C25D17/08 ,  H01L21/687 ,  H01L21/683 ,  C25D7/12

CPC classification number: C25D17/001 ,  C25D5/022 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/11462 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

公开(公告)号：US20160319454A1

公开(公告)日：2016-11-03

申请号：US15180457

申请日：2016-06-13

Applicant: EBARA CORPORATION

Inventor： Junichiro YOSHIOKA ,  Kuniaki HORIE ,  Yugang GUO ,  Satoshi MORIKAMI

IPC: C25D17/06 ,  C25D21/12 ,  H01L21/288 ,  H01L21/687 ,  H01L21/67 ,  H01L23/00 ,  C25D17/00 ,  C25D7/12

CPC classification number: C25D17/001 ,  C25D5/022 ,  C25D7/12 ,  C25D7/123 ,  C25D17/004 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/687 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/76879 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/11462 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

公开(公告)号：US09480194B2

公开(公告)日：2016-10-25

申请号：US14666553

申请日：2015-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeho Song ,  Sangin Choi ,  YoungBin Han

IPC: A47B97/00 ,  B66C1/02 ,  H05K13/04 ,  B25J15/06 ,  H01L21/677 ,  H01L21/687 ,  H01L23/00

CPC classification number: H05K13/0478 ,  B25J15/0616 ,  H01L21/67706 ,  H01L21/687 ,  H01L24/00

Abstract: A picker assembly includes a picker, a driving member coupled to the picker, the driving member adjusting a position of the picker, a pair of first fixing members on a lower surface of the driving member, the pair of first fixing members being adjacent to a portion at which the driving member and the picker are connected, and a pair of second fixing members on the picker, the pair of second fixing members being coupled to respective first fixing members through latching and fixing.

Abstract translation: 拾取器组件包括拾取器，联接到拾取器的驱动构件，调节拾取器位置的驱动构件，驱动构件的下表面上的一对第一固定构件，一对第一固定构件邻近于 驱动构件和拾取器连接的部分和拾取器上的一对第二固定构件，一对第二固定构件通过锁定和固定联接到相应的第一固定构件。

公开(公告)号：US09458537B2

公开(公告)日：2016-10-04

申请号：US14869371

申请日：2015-09-29

Applicant: Applied Materials, Inc.

Inventor： Nagarajan Rajagopalan ,  Xinhai Han ,  Michael Wenyoung Tsiang ,  Masaki Ogata ,  Zhijun Jiang ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Jianhua Zhou ,  Ramprakash Sankarakrishnan ,  Amit Kumar Bansal ,  Jeongmin Lee ,  Todd Egan ,  Edward Budiarto ,  Dmitriy Panasyuk ,  Terrance Y. Lee ,  Jian J. Chen ,  Mohamad A. Ayoub ,  Heung Lak Park ,  Patrick Reilly ,  Shahid Shaikh ,  Bok Hoen Kim ,  Sergey Starik ,  Ganesh Balasubramanian

IPC: G01N21/00 ,  C23C16/52 ,  G01B11/06 ,  H01L21/00 ,  H01L21/687 ,  H01L21/67 ,  C23C16/509 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  G01N21/55 ,  G01N21/65 ,  C23C16/455

CPC classification number: C23C16/52 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/458 ,  C23C16/46 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509 ,  C23C16/5096 ,  G01B11/0625 ,  G01B11/0683 ,  G01N21/55 ,  G01N21/658 ,  G01N2201/1222 ,  H01L21/00 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/687

Abstract: A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.