公开(公告)号：US20230163095A1

公开(公告)日：2023-05-25

申请号：US17988974

申请日：2022-11-17

申请人： Kulicke and Soffa Industries, Inc.

发明人： Andreas Marte ,  Daniel Buergi ,  Urban Ernst ,  Eirini Kakkava ,  Alexander Holzer ,  Mathias Moser ,  Fabian Schneider

IPC分类号： H01L23/00

CPC分类号： H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L2224/0213 ,  H01L2224/08221 ,  H01L2224/80007 ,  H01L2224/80986 ,  H01L2224/80894 ,  H01L2224/8017 ,  H01L2224/8018 ,  H01L2224/8013 ,  H01L2224/80132

摘要： A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

公开(公告)号：US20150340329A1

公开(公告)日：2015-11-26

申请号：US14283716

申请日：2014-05-21

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： TSUNG-YUAN YU

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0213 ,  H01L2224/0231 ,  H01L2224/02373 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/10135 ,  H01L2224/11 ,  H01L2224/11015 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16237 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/014

摘要： In some embodiments in accordance with the present disclosure, a semiconductor device having a semiconductor substrate is provided. A metal structure is disposed over the semiconductor substrate, and a post-passivation interconnect (PPI) is disposed over the metal structure. In addition, the upper surface of the PPI is configured to receive a bump thereon. In certain embodiments, the upper surface of the PPI for receiving the bump is substantially flat. A positioning member is formed over the PPI and configured to accommodate the bump. In some embodiments, the positioning member is configured to limit bump movement after the bump is disposed over the PPI so as to retain the bump at a predetermined position.

摘要翻译： 在根据本公开的一些实施例中，提供了具有半导体衬底的半导体器件。 金属结构设置在半导体衬底上，并且钝化后互连（PPI）设置在金属结构上。 此外，PPI的上表面被配置为在其上接收凸块。 在某些实施例中，用于接收凸块的PPI的上表面基本上是平的。 定位构件形成在PPI上并被构造成容纳凸起。 在一些实施例中，定位构件构造成在凸起布置在PPI上之后限制凸块移动，以便将凸块保持在预定位置。

公开(公告)号：US20110316154A1

公开(公告)日：2011-12-29

申请号：US13230395

申请日：2011-09-12

申请人： Takeshi MATSUMOTO

发明人： Takeshi MATSUMOTO

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/03 ,  H01L23/3157 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0213 ,  H01L2224/03464 ,  H01L2224/03828 ,  H01L2224/0384 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05541 ,  H01L2224/05551 ,  H01L2224/05554 ,  H01L2224/05557 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/11334 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A semiconductor device includes a semiconductor substrate having a plurality of electrode pads, a protective film covering the upper surface of the semiconductor substrate and having an opening so that the electrode pad is exposed therethrough, a metal film formed on the electrode pad exposed through the opening, and a bump formed on the metal film. The metal film includes a plurality of grooves radially formed from the center thereof toward the periphery thereof.

摘要翻译： 半导体器件包括具有多个电极焊盘的半导体衬底，覆盖半导体衬底的上表面并具有开口以使得电极焊盘暴露于其中的保护膜，形成在通过开口暴露的电极焊盘上的金属膜 和在金属膜上形成的凸点。 金属膜包括从其中心向其周边径向形成的多个槽。

公开(公告)号：US20240055379A1

公开(公告)日：2024-02-15

申请号：US18140960

申请日：2023-04-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： HASEOB SEONG ,  AENEE JANG

IPC分类号： H01L23/00 ,  H10B80/00 ,  H01L25/065

CPC分类号： H01L24/08 ,  H10B80/00 ,  H01L24/05 ,  H01L24/80 ,  H01L24/94 ,  H01L25/0657 ,  H01L2225/06593 ,  H01L2225/06541 ,  H01L2224/94 ,  H01L2224/05647 ,  H01L2224/05687 ,  H01L2224/8013 ,  H01L2224/80203 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2224/08145 ,  H01L2224/0213 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0801 ,  H01L2924/16235 ,  H01L2924/1616

摘要： A semiconductor package includes; a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes; a first substrate, a first bonding pad on a first surface of the first substrate, and a first passivation layer on the first surface of the first substrate exposing at least a portion of the first bonding pad. The second semiconductor chip includes; a second substrate, a second insulation layer on a front surface of the second substrate, a second bonding pad on the second insulation layer, a first alignment key pattern on the second insulation layer, and a second passivation layer on the second insulation layer, covering at least a portion of the first alignment key pattern, and exposing at least a portion of the second bonding pad, wherein the first bonding pad and the second bonding pad are directly bonded, and the first passivation layer and the second passivation layer are directly bonded.

公开(公告)号：US09799632B2

公开(公告)日：2017-10-24

申请号：US15457744

申请日：2017-03-13

申请人： IMEC VZW ,  Katholieke Universiteit Leuven, KU LEUVEN R&D

发明人： Vikas Dubey ,  Ingrid De Wolf ,  Eric Beyne

IPC分类号： H01L23/02 ,  H01L25/065 ,  H01L23/00 ,  H01L23/528 ,  H01L23/31 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L23/3157 ,  H01L23/3192 ,  H01L23/528 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0217 ,  H01L2224/02175 ,  H01L2224/0218 ,  H01L2224/02185 ,  H01L2224/0224 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/0903 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1703 ,  H01L2224/80004 ,  H01L2224/80007 ,  H01L2224/80121 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80143 ,  H01L2224/80203 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/81121 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81894 ,  H01L2224/81907 ,  H01L2224/83143 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Alignment of a first micro-electronic component to a receiving surface of a second micro-electronic component is realized by a capillary force-induced self-alignment, combined with an electrostatic alignment. The latter is accomplished by providing at least one first electrical conductor line along the periphery of the first component, and at least one second electrical conductor along the periphery of the location on the receiving surface of the second component onto which the component is to be placed. The contact areas surrounded by the conductor lines are covered with a wetting layer. The electrical conductor lines may be embedded in a strip of anti-wetting material that runs along the peripheries to create a wettability contrast. The wettability contrast helps to maintain a drop of alignment liquid between the contact areas so as to obtain self-alignment by capillary force. By applying appropriate charges on the conductor lines, electrostatic self-alignment is realized, which improves the alignment obtained through capillary force and maintains the alignment during evaporation of the liquid.

公开(公告)号：US09601459B2

公开(公告)日：2017-03-21

申请号：US14576637

申请日：2014-12-19

申请人： IMEC VZW ,  Katholieke Universiteit Leuven, KU LEUVEN R&D

发明人： Vikas Dubey ,  Ingrid De Wolf ,  Eric Beyne

IPC分类号： H01L29/80 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0657 ,  H01L23/3157 ,  H01L23/3192 ,  H01L23/528 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0217 ,  H01L2224/02175 ,  H01L2224/0218 ,  H01L2224/02185 ,  H01L2224/0224 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/0903 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1703 ,  H01L2224/80004 ,  H01L2224/80007 ,  H01L2224/80121 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80143 ,  H01L2224/80203 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/81121 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81894 ,  H01L2224/81907 ,  H01L2224/83143 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Alignment of a first micro-electronic component to a receiving surface of a second micro-electronic component is realized by a capillary force-induced self-alignment, combined with an electrostatic alignment. The latter is accomplished by providing at least one first electrical conductor line along the periphery of the first component, and at least one second electrical conductor along the periphery of the location on the receiving surface of the second component onto which the component is to be placed. The contact areas surrounded by the conductor lines are covered with a wetting layer. The electrical conductor lines may be embedded in a strip of anti-wetting material that runs along the peripheries to create a wettability contrast. The wettability contrast helps to maintain a drop of alignment liquid between the contact areas so as to obtain self-alignment by capillary force. By applying appropriate charges on the conductor lines, electrostatic self-alignment is realized, which improves the alignment obtained through capillary force and maintains the alignment during evaporation of the liquid.

公开(公告)号：US09570415B2

公开(公告)日：2017-02-14

申请号：US14696171

申请日：2015-04-24

申请人： Korea Advanced Institute of Science and Technology

发明人： Hyo Hoon Park ,  Suk Min Seo ,  Jong Hun Kim ,  Sun Kyu Han

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

摘要： A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

摘要翻译： 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。

公开(公告)号：US20150311177A1

公开(公告)日：2015-10-29

申请号：US14696171

申请日：2015-04-24

申请人： Korea Advanced Institute of Science and Technology

发明人： Hyo Hoon PARK ,  Suk Min SEO ,  Jong Hun KIM ,  Sun Kyu HAN

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/81 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/02135 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81009 ,  H01L2224/8102 ,  H01L2224/811 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81375 ,  H01L2224/81379 ,  H01L2224/81395 ,  H01L2224/8149 ,  H01L2224/81493 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/06 ,  H01L2924/01014 ,  H01L2924/01006

摘要： A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

摘要翻译： 使用疏水性表面的芯片封装方法包括在形成在第一芯片或第一板和第二芯片或第二板之一上的超疏水表面的预定位置上形成亲水表面的超疏水表面，分别产生液体 分别形成在第一芯片或第一板上的一个上的亲水表面上的金属球和第二芯片或第二板中的一个上的金属球，并且将第一芯片或第一板中的一个和第二芯片 通过将第一芯片或第一板中的一个的液态金属球和第二芯片或第二板中的一个的液态金属球彼此结合而将芯片或第二板彼此结合。

公开(公告)号：US20150179605A1

公开(公告)日：2015-06-25

申请号：US14576637

申请日：2014-12-19

申请人： IMEC VZW ,  Katholieke Universiteit Leuven, KU LEUVEN R&D

发明人： Vikas Dubey ,  Ingrid De Wolf ,  Eric Beyne

IPC分类号： H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/3157 ,  H01L23/3192 ,  H01L23/528 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0213 ,  H01L2224/0214 ,  H01L2224/02145 ,  H01L2224/0217 ,  H01L2224/02175 ,  H01L2224/0218 ,  H01L2224/02185 ,  H01L2224/0224 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/0903 ,  H01L2224/10135 ,  H01L2224/10145 ,  H01L2224/10165 ,  H01L2224/10175 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/1703 ,  H01L2224/80004 ,  H01L2224/80007 ,  H01L2224/80121 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80143 ,  H01L2224/80203 ,  H01L2224/80894 ,  H01L2224/80907 ,  H01L2224/81002 ,  H01L2224/81007 ,  H01L2224/81121 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81141 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81894 ,  H01L2224/81907 ,  H01L2224/83143 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/14 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Alignment of a first micro-electronic component to a receiving surface of a second micro-electronic component is realized by a capillary force-induced self-alignment, combined with an electrostatic alignment. The latter is accomplished by providing at least one first electrical conductor line along the periphery of the first component, and at least one second electrical conductor along the periphery of the location on the receiving surface of the second component onto which the component is to be placed. The contact areas surrounded by the conductor lines are covered with a wetting layer. The electrical conductor lines may be embedded in a strip of anti-wetting material that runs along the peripheries to create a wettability contrast. The wettability contrast helps to maintain a drop of alignment liquid between the contact areas so as to obtain self-alignment by capillary force. By applying appropriate charges on the conductor lines, electrostatic self-alignment is realized, which improves the alignment obtained through capillary force and maintains the alignment during evaporation of the liquid.

摘要翻译： 第一微电子部件与第二微电子部件的接收表面的对准通过与静电取向相结合的毛细管力诱导的自对准来实现。 后者通过沿着第一部件的周边提供至少一个第一电导体线，以及沿着第二部件的接收表面上的位置的周边的至少一个第二电导体，部件将放置在其上 。 由导体线包围的接触区域被润湿层覆盖。 电导体线可以嵌入沿着周边延伸的防湿材料条，以产生润湿性对比度。 润湿性对比度有助于保持接触区域之间的取向液滴，从而通过毛细管力获得自对准。 通过在导体线上施加适当的电荷，实现静电自对准，这改善了通过毛细管力获得的对准并且在液体的蒸发期间保持对准。