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    METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES
    16.
    发明申请
    METHOD AND DEVICE FOR COUPLING MULTIPLE GROUND PLANES 有权
    用于耦合多个地面平面图的方法和装置

    公开(公告)号：US20160380225A1

    公开(公告)日：2016-12-29

    申请号：US14752876

    申请日：2015-06-27

    申请人： Intel Corporation

    发明人： Douglas G. Bennett

    IPC分类号： H01L51/52 ,  H01L51/56

    CPC分类号： H01L51/52 ,  H01L24/72 ,  H01L27/32 ,  H01L51/56 ,  H01R4/48 ,  H01R12/52 ,  H01R12/57 ,  H01R12/718 ,  H01R13/2407 ,  H05K1/0215 ,  H05K3/325 ,  H05K2201/0311

    摘要： Generally, this disclosure provides systems, devices and methods for improved electrical coupling of multiple ground planes of a device. The device may include a plurality of ground planes and an electrically conductive ground clip. The ground clip may include a base portion configured to secure the ground clip to the device and a plurality of spring fingers. Each of the spring fingers may be configured to contact and electrically couple to one of the plurality of ground planes, wherein the ground clip is to provide a conduction path between each of the spring fingers. One of the spring fingers may pass through an opening or cut-through in a first ground plane to contact a second ground plane. The device may be a mobile communication or computing platform.

    摘要翻译： 通常，本公开提供用于改进设备的多个接地平面的电耦合的系统，设备和方法。 该装置可以包括多个接地平面和导电接地夹。 接地夹可以包括构造成将接地夹固定到设备的基部和多个弹簧指。 每个弹簧指可以被配置成接触并电耦合到多个接地平面中的一个，其中接地夹将提供每个弹簧指之间的传导路径。 弹簧手指中的一个可以穿过第一接地平面中的开口或切口，以接触第二接地平面。 该设备可以是移动通信或计算平台。

    Package of power dies and three-phase power converter
    18.
    发明授权
    Package of power dies and three-phase power converter 有权
    电源模块和三相电源转换器封装

    公开(公告)号：US09515012B2

    公开(公告)日：2016-12-06

    申请号：US14620762

    申请日：2015-02-12

    申请人： MITSUBISHI ELECTRIC CORPORATION

    发明人： Jeffrey Ewanchuk ,  Stefan Mollov ,  Guillaume Lefevre

    IPC分类号： H01L23/495 ,  H02M7/537 ,  H01L23/34 ,  H01L23/538 ,  H01L23/36 ,  H01L21/48

    CPC分类号： H01L23/49568 ,  H01L21/4846 ,  H01L23/16 ,  H01L23/345 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49575 ,  H01L23/5385 ,  H01L24/72 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/06181 ,  H02M7/537

    摘要： The present invention concerns a package of power dies composed of a first part and a second part, the first part including a plaque having cavities on which dies are placed, the plaque is placed on a first, a second, and a third metallic plates placed on an electric insulation substrate placed on a fourth metallic plate, the second part including a fifth and a sixth metallic plates placed on another electric insulation substrate placed on a seventh metallic plate, the dies are divided into a first group of dies and a second group of dies and wherein the first and second plate are a positive and negative DC voltage connections, the third plate is a gate connection of the second group of dies, the fourth plate is an AC voltage connection and the fifth plate is a gate connection of the first group of dies.

    摘要翻译： 本发明涉及由第一部分和第二部分组成的动力模具的包装，第一部分包括具有空腔的板，其上放置有模具，该板放置在第一，第二和第三金属板上， 在放置在第四金属板上的电绝缘基板上，第二部分包括置于第七金属板上的另一电绝缘基板上的第五和第六金属板，模具分为第一组模具和第二组 并且其中所述第一和第二板是正和负的DC电压连接，所述第三板是所述第二组模具的栅极连接，所述第四板是AC电压连接，并且所述第五板是所述第二板的栅极连接 第一组死亡。

    Semiconductor packages with sliding interconnect structure
    20.
    发明授权
    Semiconductor packages with sliding interconnect structure 有权
    具有滑动互连结构的半导体封装

    公开(公告)号：US09484322B1

    公开(公告)日：2016-11-01

    申请号：US14925235

    申请日：2015-10-28

    申请人： SK hynix Inc.

    发明人： Chan Woo Jeong

    IPC分类号： H01L23/48 ,  H01L23/00

    CPC分类号： H01L24/72 ,  H01L2224/0401 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1441 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/3511

    摘要： A semiconductor package includes a first substrate including a plurality of first connecting portions disposed thereon, a second substrate disposed on a portion of the first substrate to be adjacent to the first connecting portions and including a plurality of conductive contact rails disposed thereon, and a plurality of conductive cantilevers respectively placed in contact with surfaces of the conductive contact rails so that one end portion of each conductive cantilever is electrically coupled to one of the first connecting portions and the other end portion slides along one of the conductive contact rails.

    摘要翻译： 半导体封装包括：第一基板，包括设置在其上的多个第一连接部;第二基板，设置在与第一连接部相邻的第一基板的一部分上，并且包括设置在其上的多个导电接触轨道， 的导电悬臂分别放置成与导电接触导轨的表面接触，使得每个导电悬臂的一个端部电耦合到第一连接部分中的一个，另一个端部沿着导电接触导轨之一滑动。