公开(公告)号：US09730317B2

公开(公告)日：2017-08-08

申请号：US14219054

申请日：2014-03-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hyeong-Cheol Ahn

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K2201/10439

Abstract: A display device includes a display panel including a curved surface bent along a first direction, a circuit board coupled to the display panel, the circuit board being bent along the first direction in correspondence to the curved surface of the display panel, and an integrated circuit (IC) chip on the circuit board, a short side of the IC chip extending along the first direction.

公开(公告)号：US20150083478A1

公开(公告)日：2015-03-26

申请号：US14484537

申请日：2014-09-12

Applicant: DAI-ICHI SEIKO CO., LTD.

Inventor： Takayoshi ENDO ,  Kenya ANDO

IPC: H05K1/18 ,  H01R43/02 ,  H05K3/30 ,  H01R4/02

CPC classification number: H05K1/181 ,  H01R4/02 ,  H01R12/707 ,  H01R12/724 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/303 ,  H05K2201/10439 ,  H05K2201/10613 ,  Y10T29/49149 ,  Y10T29/49204

Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

Abstract translation: 要焊接到安装在印刷电路板上的金属焊盘的电气部件包括面向金属焊盘的第一表面，从远离金属焊盘的方向从第一表面延伸的第二表面，以及从第一表面向外延伸的第三表面 第二表面，第二表面和第三表面限定存储焊料的空间。

公开(公告)号：US20240224414A1

公开(公告)日：2024-07-04

申请号：US18207230

申请日：2023-06-08

Applicant: NIKO SEMICONDUCTOR CO., LTD.

Inventor： CHUNG-MING LENG ,  CHIH-CHENG HSIEH ,  Wei-Lun Wang ,  PIN-RUI HUANG

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/18 ,  H05K2201/09972 ,  H05K2201/10439

Abstract: A circuit board includes a substrate and a first metal circuit layer. The substrate has an upper surface and a lower surface opposite to the upper surface. The first metal circuit layer is located on the upper surface, and the first metal circuit layer includes a first line area and a second line area. The first line area and the second line area are separated by a groove area, and the groove area includes a bent section. Accordingly, the risk of detachment between the first metal circuit layer and the substrate due to stress concentration on the circuit board can be reduced.

公开(公告)号：US09668347B2

公开(公告)日：2017-05-30

申请号：US14484537

申请日：2014-09-12

Applicant: DAI-ICHI SEIKO CO., LTD.

Inventor： Takayoshi Endo ,  Kenya Ando

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H01R12/72 ,  H01R43/02 ,  H01R43/16 ,  H01R4/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01R4/02 ,  H01R12/707 ,  H01R12/724 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/303 ,  H05K2201/10439 ,  H05K2201/10613 ,  Y10T29/49149 ,  Y10T29/49204

Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.

公开(公告)号：US20150043176A1

公开(公告)日：2015-02-12

申请号：US14219054

申请日：2014-03-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hyeong-Cheol AHN

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/189 ,  H05K2201/10439

Abstract: A display device includes a display panel including a curved surface bent along a first direction, a circuit board coupled to the display panel, the circuit board being bent along the first direction in correspondence to the curved surface of the display panel, and an integrated circuit (IC) chip on the circuit board, a short side of the IC chip extending along the first direction.

Abstract translation: 一种显示装置，包括：显示面板，包括沿着第一方向弯曲的曲面;电路板，与所述显示面板连接，所述电路板沿着与所述显示面板的曲面对应的第一方向弯曲;以及集成电路 （IC）芯片，IC芯片的沿着第一方向延伸的短边。

公开(公告)号：US20150041197A1

公开(公告)日：2015-02-12

申请号：US14147204

申请日：2014-01-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa Lee ,  Hai Joon Lee ,  Tae Hyeok Kim ,  Jin Man Jung ,  Eun Hyuk Chae

IPC: H01G4/30 ,  H05K1/18 ,  H01G4/005

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/005 ,  H01G4/232 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided an embedded multilayer ceramic electronic component including: a ceramic body including dielectric layers; first internal electrodes and second internal electrodes having first and second leads; first dummy electrodes and second dummy electrodes; and first and second external electrodes, wherein when a length from ends of the first and second external electrodes formed on first and second lateral surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is G, a length of the first and second external electrodes formed on the first and second lateral surfaces of the ceramic body up to end surfaces of the ceramic body is BW, and a length from the end surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second leads is M, 30 μm≦G

Abstract translation: 提供了一种嵌入式多层陶瓷电子部件，包括：包括电介质层的陶瓷体; 第一内部电极和具有第一和第二引线的第二内部电极; 第一虚拟电极和第二虚拟电极; 以及第一外部电极和第二外部电极，其中当形成在陶瓷体的第一和第二侧表面上的第一和第二外部电极的端部与对应于第一和第二引线的第一和第二外部电极的长度为G时，长度 形成在陶瓷体的第一和第二侧表面上的第一和第二外部电极直到陶瓷体的端面为BW，并且从陶瓷体的端面到第一和第二外部电极的长度对应于 第一和第二引线为M，30μm＆nlE;满足G

公开(公告)号：US20150036306A1

公开(公告)日：2015-02-05

申请号：US14517002

申请日：2014-10-17

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K1/11 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract translation: 屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。

公开(公告)号：US20150022987A1

公开(公告)日：2015-01-22

申请号：US14330347

申请日：2014-07-14

Applicant: STMicroelectronics (Crolles 2) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Sebastien Gallois-Garreignot ,  Jérôme Lopez ,  Gil Provent ,  Caroline Moutin ,  Vincent Fiori

IPC: H05K7/02 ,  H05K1/11

CPC classification number: H05K7/02 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05647 ,  H01L2224/13006 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81815 ,  H05K1/111 ,  H05K2201/10439 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device includes an integrated circuit chip with an insulating passivation layer. An opening in the passivation layer uncovers a first region of an electrical contact. An electrical connection pad is formed to fill the opening by covering the first region and extend in projection in such a way as to cover a second region situated on the passivation layer surrounding the opening. The periphery of at least one of the first and second regions has an elongate or oblong shape. Centers of the opening and the pad are aligned with each other.

Abstract translation: 电子设备包括具有绝缘钝化层的集成电路芯片。 钝化层中的开口露出电接触的第一区域。 形成电连接垫以通过覆盖第一区域而填充开口，并且以突出方式延伸以覆盖位于围绕开口的钝化层上的第二区域。 第一和第二区域中的至少一个区域的周边具有细长或长方形形状。 开口和垫的中心彼此对准。

公开(公告)号：US20150003020A1

公开(公告)日：2015-01-01

申请号：US14490425

申请日：2014-09-18

Applicant: c/o SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Chang HONG ,  Kwang Seop YOUM ,  Bong Kyu CHOI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic component-embedded printed circuit board includes: a core substrate having a cavity; an electronic component in the cavity; an inner circuit layer formed on the core substrate; a cooling member provided on the first surface of the core substrate at a position over the cavity; and an outer insulating layer on the core substrate. In one embodiment, the cooling member is covering over a portion of the outer surface of the inner circuit layer, and is adhered to the electronic component and to the outer surface of the inner circuit layer through a conductive material.

Abstract translation: 电子元件嵌入式印刷电路板包括：具有空腔的芯基板; 空腔中的电子部件; 形成在所述芯基板上的内电路层; 设置在所述芯基板的所述第一表面上的空腔上方的位置的冷却部件; 和芯基板上的外绝缘层。 在一个实施例中，冷却构件覆盖在内部电路层的外表面的一部分上，并且通过导电材料粘附到电子部件和内部电路层的外表面。

公开(公告)号：US20130170147A1

公开(公告)日：2013-07-04

申请号：US13339817

申请日：2011-12-29

Applicant: Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K7/00 ,  H05K3/32 ,  H05K3/22

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract translation: 在一个实施例中，屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。