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公开(公告)号：US20090283312A1
公开(公告)日：2009-11-19
申请号：US12453632
申请日：2009-05-18
申请人： Michimasa Takahashi
发明人： Michimasa Takahashi
CPC分类号： H05K1/0298 , H01L24/24 , H01L2224/24227 , H01L2224/45144 , H01L2224/48091 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01087 , H01L2924/12042 , H05K1/141 , H05K1/142 , H05K1/185 , H05K3/4602 , H05K3/4694 , H05K2201/0187 , H05K2201/09536 , H05K2201/10484 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
摘要： A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.
摘要翻译： 一种印刷电路板，包括刚性多层板，具有多个导体的第一基板和具有与第一基板的导体电连接的多个导体的第二基板。 第二基板的导体具有设定为高于第一基板的导体的现有密度的现有密度，并且第一基板和/或第二基板嵌入刚性多层板中。
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公开(公告)号：US20090188703A1
公开(公告)日：2009-07-30
申请号：US12197554
申请日：2008-08-25
申请人： Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
发明人： Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
CPC分类号： H05K1/185 , H01L23/49838 , H01L23/5383 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/82045 , H01L2224/83385 , H01L2224/92244 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H01L2924/3511 , H05K1/0218 , H05K2201/0723 , H05K2201/096 , H05K2201/09618 , H05K2201/09709 , H05K2201/10969 , Y10T29/4913 , H01L2924/00
摘要： A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate.
摘要翻译： 多层布线板包括具有容纳电子部件的凹部的多层布线基板。 多层布线基板具有多个绝缘层，多个导电电路，多个通孔和电磁屏蔽层。 导电电路由绝缘层隔开并通过通孔电连接。 电磁屏蔽层具有粗糙表面，并且沿着多层布线基板中的凹部的底面和侧面中的一个形成。
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公开(公告)号：US09027238B2
公开(公告)日：2015-05-12
申请号：US13312093
申请日：2011-12-06
申请人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
发明人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC分类号： H01L24/83 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/32 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/20 , H01L2224/24227 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8385 , H01L2224/92 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K1/185 , H05K3/0035 , H05K3/4652 , H05K2201/096 , H05K2201/10477 , H05K2201/10674 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/01049 , H01L2924/01083 , H01L2924/3512 , H01L2924/00014 , H01L2224/13111 , H01L2224/13109
摘要： A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.
摘要翻译： 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。
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公开(公告)号：US08536457B2
公开(公告)日：2013-09-17
申请号：US12453627
申请日：2009-05-18
申请人： Michimasa Takahashi
发明人： Michimasa Takahashi
CPC分类号： H05K3/4691 , H05K1/0218 , H05K1/142 , H05K3/36 , H05K3/4602 , H05K2201/0187 , H05K2201/0715 , H05K2201/0909 , H05K2201/09127 , H05K2201/096
摘要： A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.
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公开(公告)号：US20130153269A1
公开(公告)日：2013-06-20
申请号：US13665550
申请日：2012-10-31
CPC分类号： H05K1/0298 , H05K1/0278 , H05K1/028 , H05K1/111 , H05K1/115 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/368 , H05K3/46 , H05K3/4691 , Y10T29/49126 , Y10T29/4913 , Y10T156/10
摘要： A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
摘要翻译： 布线基板包括具有第一导电层并具有表面的第一多层布线板，具有第二导电层的第二多层布线板并且定位成使得第二多层布线板具有面向第一多层布线板的表面的表面，以及 粘合剂层，其包括粘合剂片，并且介于所述第一多层布线板和所述第二多层布线板之间，使得所述粘合剂层粘合所述第一多层布线板和所述第二多层布线板。 第一多层布线板在第一多层布线板的表面上具有第一焊盘，第二多层布线板在第二多层布线板的表面上具有第二焊盘，第一焊盘和第二焊盘定位成使得 第一垫和第二垫彼此面对粘合剂层。
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公开(公告)号：US08405999B2
公开(公告)日：2013-03-26
申请号：US12401141
申请日：2009-03-10
申请人： Michimasa Takahashi
发明人： Michimasa Takahashi
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K1/0218 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09509 , H05K2201/09563 , Y10T29/49124 , Y10T29/49155
摘要： A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.
摘要翻译： 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。
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公开(公告)号：US08404978B2
公开(公告)日：2013-03-26
申请号：US12873944
申请日：2010-09-01
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K2201/0391 , H05K2201/09127 , H05K2201/09854 , H05K2203/308 , Y10T29/49124
摘要： A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.
摘要翻译： 一种柔性刚性布线板，包括具有布线层的绝缘基板，所述布线层形成在所述绝缘基板上并且包括导体，柔性布线板位于所述绝缘基板的旁边并具有布线层，所述柔性布线板的布线层包括 导体，并且被容纳在柔性布线板内部;以及第一绝缘层，其位于绝缘基板和柔性布线板上，使得柔性布线板的一部分从第一绝缘层露出。 第一绝缘层具有形成在第一绝缘层上并包括导体的布线层。 第一绝缘层的布线层的厚度比柔性布线基板的布线层的厚度和绝缘基板的布线层的厚度厚。
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公开(公告)号：US20130025925A1
公开(公告)日：2013-01-31
申请号：US13483830
申请日：2012-05-30
CPC分类号： H05K3/4694 , H05K3/42 , H05K3/4697 , H05K2201/048 , H05K2201/09145 , H05K2201/2072 , Y10T29/49126
摘要： A wiring board has a first rigid wiring board having an accommodation portion, a second rigid wiring board accommodated in the accommodation portion, an insulation layer formed over the first rigid wiring board and the second rigid wiring board, and a joint conductor extending in a direction from a first surface of the first rigid wiring board to a second surface of the first rigid wiring board on the opposite side of the first surface of the first rigid wiring board such that the joint conductor is penetrating through the boundary between the first rigid wiring board and the second rigid wiring board and joining the first rigid wiring board and the second rigid wiring board.
摘要翻译： 布线基板具有容纳部的第一刚性布线板，容纳在容纳部中的第二刚性布线基板，形成在第一刚性布线基板和第二刚性布线基板上的绝缘层，以及沿着方向 从第一刚性布线板的第一表面到第一刚性布线板的与第一刚性布线板的第一表面相反的一侧的第二表面，使得接合导体穿过第一刚性布线板 和第二刚性布线板，并且连接第一刚性布线板和第二刚性布线板。
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公开(公告)号：US08353103B2
公开(公告)日：2013-01-15
申请号：US12555305
申请日：2009-09-08
申请人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
发明人： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
CPC分类号： H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
摘要： A method of manufacturing multilayer printed wiring hoard in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. In the inventive method, no corrosion resistant layer is formed on a solder pad on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, a land in which the corrosion resistant layer is formed by the method is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
摘要翻译： 可以提高制造多层印刷布线的方法，其中通过提高可靠性而获得电连接性和功能性，特别是降低测试的可靠性。 在本发明的方法中，在要安装部件的焊料焊盘上没有形成耐腐蚀层以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，通过该方法形成耐腐蚀层的区域也不太可能发生接触不良。
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30.发明授权Multilayer wiring board with concave portion for accomodating electronic component 有权多层接线板，带凹槽，适用于电子元器件公开(公告)号：US08168893B2
公开(公告)日：2012-05-01
申请号：US12197554
申请日：2008-08-25
申请人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
发明人： Sotaro Ito , Michimasa Takahashi , Yukinobu Mikado
CPC分类号： H05K1/185 , H01L23/49838 , H01L23/5383 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L2223/6677 , H01L2224/04105 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/82045 , H01L2224/83385 , H01L2224/92244 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H01L2924/3511 , H05K1/0218 , H05K2201/0723 , H05K2201/096 , H05K2201/09618 , H05K2201/09709 , H05K2201/10969 , Y10T29/4913 , H01L2924/00
摘要： A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate.
摘要翻译： 多层布线板包括具有容纳电子部件的凹部的多层布线基板。 多层布线基板具有多个绝缘层，多个导电电路，多个通孔和电磁屏蔽层。 导电电路由绝缘层隔开并通过通孔电连接。 电磁屏蔽层具有粗糙表面，并且沿着多层布线基板中的凹部的底面和侧面中的一个形成。
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